KR940007460B1 - 전계효과트랜지스터, 이를 이용한 반도체기억장치 및 전계효과트랜지스터의 제조방법 - Google Patents
전계효과트랜지스터, 이를 이용한 반도체기억장치 및 전계효과트랜지스터의 제조방법 Download PDFInfo
- Publication number
- KR940007460B1 KR940007460B1 KR1019910009967A KR910009967A KR940007460B1 KR 940007460 B1 KR940007460 B1 KR 940007460B1 KR 1019910009967 A KR1019910009967 A KR 1019910009967A KR 910009967 A KR910009967 A KR 910009967A KR 940007460 B1 KR940007460 B1 KR 940007460B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive layer
- region
- insulating film
- oxide film
- impurity diffusion
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940004705A KR940007464B1 (ko) | 1990-06-18 | 1994-03-10 | 메모리 셀 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2-160802 | 1990-06-18 | ||
JP2160802A JP2564972B2 (ja) | 1990-06-18 | 1990-06-18 | 半導体記憶装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920005814A KR920005814A (ko) | 1992-04-03 |
KR940007460B1 true KR940007460B1 (ko) | 1994-08-18 |
Family
ID=15722759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910009967A KR940007460B1 (ko) | 1990-06-18 | 1991-06-17 | 전계효과트랜지스터, 이를 이용한 반도체기억장치 및 전계효과트랜지스터의 제조방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2564972B2 (de) |
KR (1) | KR940007460B1 (de) |
DE (1) | DE4119918C2 (de) |
IT (1) | IT1248495B (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2905642B2 (ja) * | 1992-01-18 | 1999-06-14 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
DE4300357C2 (de) * | 1992-01-18 | 1995-06-01 | Mitsubishi Electric Corp | Herstellungsverfahren für eine Halbleitereinrichtung |
DE19640273C1 (de) * | 1996-09-30 | 1998-03-12 | Siemens Ag | Verfahren zur Herstellung barrierenfreier Halbleiterspeicheranordnungen |
JP3185745B2 (ja) | 1998-04-01 | 2001-07-11 | 日本電気株式会社 | 半導体メモリセル |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS602784B2 (ja) * | 1982-12-20 | 1985-01-23 | 富士通株式会社 | 半導体記憶装置 |
FR2577339B1 (fr) * | 1985-02-12 | 1991-05-10 | Eurotechnique Sa | Memoire dynamique en circuit integre |
JPH06105774B2 (ja) * | 1987-11-17 | 1994-12-21 | 富士通株式会社 | 半導体記憶装置及びその製造方法 |
JP2682021B2 (ja) * | 1988-06-29 | 1997-11-26 | 富士通株式会社 | 半導体メモリ装置 |
KR940005729B1 (ko) * | 1989-06-13 | 1994-06-23 | 삼성전자 주식회사 | 디램셀의 제조방법 및 구조 |
-
1990
- 1990-06-18 JP JP2160802A patent/JP2564972B2/ja not_active Expired - Fee Related
-
1991
- 1991-06-17 KR KR1019910009967A patent/KR940007460B1/ko not_active IP Right Cessation
- 1991-06-17 DE DE4119918A patent/DE4119918C2/de not_active Expired - Fee Related
- 1991-06-17 IT ITMI911649A patent/IT1248495B/it active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JPH0449656A (ja) | 1992-02-19 |
JP2564972B2 (ja) | 1996-12-18 |
ITMI911649A0 (it) | 1991-06-17 |
KR920005814A (ko) | 1992-04-03 |
ITMI911649A1 (it) | 1992-12-17 |
DE4119918C2 (de) | 1994-08-11 |
DE4119918A1 (de) | 1991-12-19 |
IT1248495B (it) | 1995-01-19 |
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