KR940001333A - 수지봉합형 고체촬상소자 패키지 및 그 제조방법 - Google Patents

수지봉합형 고체촬상소자 패키지 및 그 제조방법 Download PDF

Info

Publication number
KR940001333A
KR940001333A KR1019920010430A KR920010430A KR940001333A KR 940001333 A KR940001333 A KR 940001333A KR 1019920010430 A KR1019920010430 A KR 1019920010430A KR 920010430 A KR920010430 A KR 920010430A KR 940001333 A KR940001333 A KR 940001333A
Authority
KR
South Korea
Prior art keywords
lead
chip
resin
semiconductor chip
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019920010430A
Other languages
English (en)
Korean (ko)
Inventor
허기록
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019920010430A priority Critical patent/KR940001333A/ko
Priority to TW82103391A priority patent/TW222713B/zh
Priority to JP12603093A priority patent/JPH0653462A/ja
Priority to DE19934319786 priority patent/DE4319786A1/de
Publication of KR940001333A publication Critical patent/KR940001333A/ko
Priority to US08/337,016 priority patent/US5534725A/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019920010430A 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법 Ceased KR940001333A (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019920010430A KR940001333A (ko) 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법
TW82103391A TW222713B (enrdf_load_stackoverflow) 1992-06-16 1993-04-30
JP12603093A JPH0653462A (ja) 1992-06-16 1993-05-27 樹脂封合形固体撮像素子パッケージおよびその製造方法
DE19934319786 DE4319786A1 (de) 1992-06-16 1993-06-15 In Kunststoff gegossene CCD-Einheit und Verfahren zu deren Herstellung
US08/337,016 US5534725A (en) 1992-06-16 1994-11-07 Resin molded charge coupled device package and method for preparation thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920010430A KR940001333A (ko) 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR940001333A true KR940001333A (ko) 1994-01-11

Family

ID=19334753

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920010430A Ceased KR940001333A (ko) 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법

Country Status (4)

Country Link
JP (1) JPH0653462A (enrdf_load_stackoverflow)
KR (1) KR940001333A (enrdf_load_stackoverflow)
DE (1) DE4319786A1 (enrdf_load_stackoverflow)
TW (1) TW222713B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100806774B1 (ko) * 2007-05-16 2008-02-22 주식회사 펠릭스정보통신 Ａｃ/ｄｃ 변환기 및 이를 이용한 ａｃ/ｄｃ 변환 방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19816309B4 (de) * 1997-04-14 2008-04-03 CiS Institut für Mikrosensorik gGmbH Verfahren zur Direktmontage von Silizium-Sensoren und danach hergestellte Sensoren
DE19724026A1 (de) * 1997-06-06 1998-12-10 Siemens Ag Drucksensor-Bauelement und Verfahren zur Herstellung
US6274927B1 (en) 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
KR100396702B1 (ko) * 2001-01-15 2003-09-03 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조방법
US6861720B1 (en) 2001-08-29 2005-03-01 Amkor Technology, Inc. Placement template and method for placing optical dies
US6784534B1 (en) 2002-02-06 2004-08-31 Amkor Technology, Inc. Thin integrated circuit package having an optically transparent window
EP1625627A2 (de) * 2003-05-19 2006-02-15 X-FAB Semiconductor Foundries AG Herstellen eines in kunststoff eingekapselten optoelektronischen bauelementes und zugehörige verfahren
DE10322751B3 (de) * 2003-05-19 2004-09-30 X-Fab Semiconductor Foundries Ag Verfahren zur Herstellung eines in Kunststoff verschlossenen optoelektronischen Bauelementes
GB0412436D0 (en) * 2004-06-04 2004-07-07 Melexis Nv Semiconductor package with transparent lid
WO2008082565A1 (en) * 2006-12-29 2008-07-10 Tessera, Inc. Microelectronic devices and methods of manufacturing such devices
US11699647B2 (en) 2021-04-15 2023-07-11 Infineon Technologies Ag Pre-molded lead frames for semiconductor packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812420A (en) * 1986-09-30 1989-03-14 Mitsubishi Denki Kabushiki Kaisha Method of producing a semiconductor device having a light transparent window
DE8808815U1 (de) * 1988-06-23 1988-09-15 Heimann Optoelectronics Gmbh, 65199 Wiesbaden Infrarotdetektor
JPH02143466A (ja) * 1988-11-25 1990-06-01 Mitsubishi Electric Corp 半導体装置の製造方法
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
KR940002444B1 (ko) * 1990-11-13 1994-03-24 금성일렉트론 주식회사 반도체 소자의 패키지 어셈블리 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100806774B1 (ko) * 2007-05-16 2008-02-22 주식회사 펠릭스정보통신 Ａｃ/ｄｃ 변환기 및 이를 이용한 ａｃ/ｄｃ 변환 방법

Also Published As

Publication number Publication date
TW222713B (enrdf_load_stackoverflow) 1994-04-21
DE4319786A1 (de) 1993-12-23
JPH0653462A (ja) 1994-02-25

Similar Documents

Publication Publication Date Title
KR960009089B1 (ko) 패키지 성형용 금형 및 그 금형을 이용한 플라스틱 고체촬상소자 패키지 제조방법 및 패키지
US4663833A (en) Method for manufacturing IC plastic package with window
CN100452441C (zh) 光传感器封装
KR0148733B1 (ko) 고체 촬상 소자용 패키지 및 그 제조방법
US5534725A (en) Resin molded charge coupled device package and method for preparation thereof
US6770163B1 (en) Mold and method for encapsulation of electronic device
US5773878A (en) IC packaging lead frame for reducing chip stress and deformation
US6384472B1 (en) Leadless image sensor package structure and method for making the same
KR940022807A (ko) 반도체장치 및 반도체장치용 금형
KR940001333A (ko) 수지봉합형 고체촬상소자 패키지 및 그 제조방법
JPH02129948A (ja) プリモールド型半導体装置
US7740465B2 (en) Casting mold for producing an optical semiconductor module
KR880011939A (ko) 반도체 레이저의 조립방법
KR950007068A (ko) 적층형 반도체 장치의 제조방법 및 그에 따른 반도체 패키지
JP3183715B2 (ja) 樹脂封止型光学素子
JPH0745655A (ja) 半導体素子の封止構造
JPH0312467B2 (enrdf_load_stackoverflow)
JPH06342816A (ja) 半導体装置及びその製造方法並びにそれらに用いるリードフレーム
KR100201392B1 (ko) 적층형 반도체 패키지 및 그 제조방법
KR950006131Y1 (ko) 반도체 패키지용 리드프레임
KR0132439Y1 (ko) 수지봉지형 반도체 패키지의 글래스리드 탑재구조
JP3201063B2 (ja) 半導体装置
JPS6455291A (en) Integrated circuit device
KR950008852B1 (ko) 플라스틱광학소자패키지용리드프레임및그를이용한패키지제조방법
KR930014844A (ko) 플라스틱 타입 고체 촬상소자 패키지 및 그 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19920616

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19920616

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19950228

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19950712

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19950228

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

Patent event date: 19950227

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I