GB0412436D0 - Semiconductor package with transparent lid - Google Patents
Semiconductor package with transparent lidInfo
- Publication number
- GB0412436D0 GB0412436D0 GB0412436A GB0412436A GB0412436D0 GB 0412436 D0 GB0412436 D0 GB 0412436D0 GB 0412436 A GB0412436 A GB 0412436A GB 0412436 A GB0412436 A GB 0412436A GB 0412436 D0 GB0412436 D0 GB 0412436D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafers
- wafer
- glass frit
- semiconductor package
- transparent lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
A transparent wafer (101), typically a glass wafer, is placed over a silicon wafer (100) having an integrated circuit with one or more optically active elements (106) provided thereon. The transparent wafer (101) is securely sealed to the silicon wafer (100) by a pattern of glass frit material (104) applied to one or both wafers (100, 101). The glass frit pattern (104) is screen printed on to the appropriate wafer (100, 101) and is arranged so as to surround the or each optically active element or elements (106) of each integrated circuit. The two wafers (100, 101) are aligned and brought together. The wafers (100, 101) are then raised in temperature to cause the glass frit material (105) to reflow and seal the wafers together. In this manner, the glass frit (105) seals the gap between the two wafers (100, 101).
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0412436A GB0412436D0 (en) | 2004-06-04 | 2004-06-04 | Semiconductor package with transparent lid |
EP05748145A EP1751792A1 (en) | 2004-06-04 | 2005-06-06 | Semiconductor package with transparent lid |
PCT/IB2005/001590 WO2005119756A1 (en) | 2004-06-04 | 2005-06-06 | Semiconductor package with transparent lid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0412436A GB0412436D0 (en) | 2004-06-04 | 2004-06-04 | Semiconductor package with transparent lid |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0412436D0 true GB0412436D0 (en) | 2004-07-07 |
Family
ID=32696635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0412436A Ceased GB0412436D0 (en) | 2004-06-04 | 2004-06-04 | Semiconductor package with transparent lid |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1751792A1 (en) |
GB (1) | GB0412436D0 (en) |
WO (1) | WO2005119756A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3166146B1 (en) * | 2015-11-06 | 2019-04-17 | ams AG | Optical package and method of producing an optical package |
DE102020207343A1 (en) | 2020-06-15 | 2021-12-16 | Robert Bosch Gesellschaft mit beschränkter Haftung | Process for the production of optical and / or optoelectronic systems with improved heat dissipation and improved thermal and / or mechanical stability, as well as optical and / or optoelectronic systems obtained by means of this process |
KR102494691B1 (en) * | 2020-09-11 | 2023-02-02 | 주식회사 옵트론텍 | Optical filter carrier, image sensor package having optical filter, and method of fabricating the same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57136869A (en) * | 1981-02-18 | 1982-08-24 | Hitachi Ltd | Solid image pickup device |
JPS5825777A (en) * | 1981-08-07 | 1983-02-16 | Hitachi Ltd | Solid-state image pickup device |
JPS59224145A (en) * | 1983-06-03 | 1984-12-17 | Hitachi Ltd | Semiconductor device |
JPS61131690A (en) * | 1984-11-30 | 1986-06-19 | Toshiba Corp | Solid-state image pick-up device |
JPS6381995A (en) * | 1986-09-26 | 1988-04-12 | Hitachi Ltd | Opto-electronic device and manufacture thereof |
KR940001333A (en) * | 1992-06-16 | 1994-01-11 | 문정환 | Resin-sealed solid state image pickup device package and manufacturing method thereof |
US6583444B2 (en) * | 1997-02-18 | 2003-06-24 | Tessera, Inc. | Semiconductor packages having light-sensitive chips |
EP1216487A1 (en) * | 1999-09-17 | 2002-06-26 | Motorola, Inc. | Semiconductor wafer level package |
WO2002074686A2 (en) * | 2000-12-05 | 2002-09-26 | Analog Devices, Inc. | A method and device for protecting micro electromechanical systems structures during dicing of a wafer |
EP1246235A1 (en) * | 2001-03-26 | 2002-10-02 | European Semiconductor Assembly (Eurasem) B.V. | Method for encapsulating a chip having a sensitive surface |
US6893574B2 (en) * | 2001-10-23 | 2005-05-17 | Analog Devices Inc | MEMS capping method and apparatus |
-
2004
- 2004-06-04 GB GB0412436A patent/GB0412436D0/en not_active Ceased
-
2005
- 2005-06-06 WO PCT/IB2005/001590 patent/WO2005119756A1/en not_active Application Discontinuation
- 2005-06-06 EP EP05748145A patent/EP1751792A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1751792A1 (en) | 2007-02-14 |
WO2005119756A1 (en) | 2005-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |