JPH0312467B2 - - Google Patents

Info

Publication number
JPH0312467B2
JPH0312467B2 JP57090683A JP9068382A JPH0312467B2 JP H0312467 B2 JPH0312467 B2 JP H0312467B2 JP 57090683 A JP57090683 A JP 57090683A JP 9068382 A JP9068382 A JP 9068382A JP H0312467 B2 JPH0312467 B2 JP H0312467B2
Authority
JP
Japan
Prior art keywords
chip
transparent body
resin
bonding
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57090683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58207656A (ja
Inventor
Rikuro Sono
Toshio Komuro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57090683A priority Critical patent/JPS58207656A/ja
Publication of JPS58207656A publication Critical patent/JPS58207656A/ja
Publication of JPH0312467B2 publication Critical patent/JPH0312467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Read Only Memory (AREA)
  • Non-Volatile Memory (AREA)
JP57090683A 1982-05-28 1982-05-28 樹脂封止型半導体装置およびその製造方法 Granted JPS58207656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57090683A JPS58207656A (ja) 1982-05-28 1982-05-28 樹脂封止型半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57090683A JPS58207656A (ja) 1982-05-28 1982-05-28 樹脂封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS58207656A JPS58207656A (ja) 1983-12-03
JPH0312467B2 true JPH0312467B2 (enrdf_load_stackoverflow) 1991-02-20

Family

ID=14005325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57090683A Granted JPS58207656A (ja) 1982-05-28 1982-05-28 樹脂封止型半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS58207656A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150351A (ja) * 1984-08-20 1986-03-12 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置
JPS6150353A (ja) * 1984-08-20 1986-03-12 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置
JPS625367U (enrdf_load_stackoverflow) * 1985-03-16 1987-01-13
JPS61188871U (enrdf_load_stackoverflow) * 1985-05-16 1986-11-25

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5541748A (en) * 1978-09-18 1980-03-24 Mitsubishi Electric Corp Semiconductor memory device
JPS5742152A (en) * 1980-08-27 1982-03-09 Nec Corp Resin sealed type semiconductor and manufacture thereof

Also Published As

Publication number Publication date
JPS58207656A (ja) 1983-12-03

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