KR930703699A - 패턴된 평면화 표면을 갖는 멀티칩 모듈 및 집적회로기판 - Google Patents

패턴된 평면화 표면을 갖는 멀티칩 모듈 및 집적회로기판

Info

Publication number
KR930703699A
KR930703699A KR1019930702379A KR930702379A KR930703699A KR 930703699 A KR930703699 A KR 930703699A KR 1019930702379 A KR1019930702379 A KR 1019930702379A KR 930702379 A KR930702379 A KR 930702379A KR 930703699 A KR930703699 A KR 930703699A
Authority
KR
South Korea
Prior art keywords
conductor layer
shape
conductor
substrate
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019930702379A
Other languages
English (en)
Korean (ko)
Inventor
마틴 세치 제이
프랭크 번네트 앤드류
Original Assignee
제이. 피터 몬
더 보잉 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이. 피터 몬, 더 보잉 컴파니 filed Critical 제이. 피터 몬
Publication of KR930703699A publication Critical patent/KR930703699A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1019930702379A 1991-02-11 1992-02-10 패턴된 평면화 표면을 갖는 멀티칩 모듈 및 집적회로기판 Withdrawn KR930703699A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/654,880 US5187119A (en) 1991-02-11 1991-02-11 Multichip module and integrated circuit substrates having planarized patterned surfaces
US654,880 1991-02-11
PCT/US1992/001140 WO1992014261A1 (en) 1991-02-11 1992-02-10 Multichip module and integrated circuit substrates having planarized patterned surfaces

Publications (1)

Publication Number Publication Date
KR930703699A true KR930703699A (ko) 1993-11-30

Family

ID=24626612

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930702379A Withdrawn KR930703699A (ko) 1991-02-11 1992-02-10 패턴된 평면화 표면을 갖는 멀티칩 모듈 및 집적회로기판

Country Status (8)

Country Link
US (1) US5187119A (enExample)
EP (1) EP0571547A1 (enExample)
JP (1) JPH06505833A (enExample)
KR (1) KR930703699A (enExample)
CN (1) CN1029274C (enExample)
CA (1) CA2101426A1 (enExample)
TW (1) TW226052B (enExample)
WO (1) WO1992014261A1 (enExample)

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US5391516A (en) * 1991-10-10 1995-02-21 Martin Marietta Corp. Method for enhancement of semiconductor device contact pads
US5300813A (en) * 1992-02-26 1994-04-05 International Business Machines Corporation Refractory metal capped low resistivity metal conductor lines and vias
US5384281A (en) * 1992-12-29 1995-01-24 International Business Machines Corporation Non-conformal and oxidizable etch stops for submicron features
US5397741A (en) * 1993-03-29 1995-03-14 International Business Machines Corporation Process for metallized vias in polyimide
JP2947054B2 (ja) * 1994-03-04 1999-09-13 ヤマハ株式会社 配線形成法
US5494854A (en) * 1994-08-17 1996-02-27 Texas Instruments Incorporated Enhancement in throughput and planarity during CMP using a dielectric stack containing HDP-SiO2 films
KR0171069B1 (ko) * 1994-10-27 1999-03-30 문정환 반도체 장치의 접촉부 형성방법
US5851899A (en) * 1996-08-08 1998-12-22 Siemens Aktiengesellschaft Gapfill and planarization process for shallow trench isolation
JPH10163319A (ja) * 1996-11-29 1998-06-19 Hitachi Ltd 半導体集積回路装置の製造方法
US6127721A (en) * 1997-09-30 2000-10-03 Siemens Aktiengesellschaft Soft passivation layer in semiconductor fabrication
US6706623B1 (en) * 1997-12-10 2004-03-16 Texas Instruments Incorporated Method and system for avoiding plasma etch damage
US6093656A (en) * 1998-02-26 2000-07-25 Vlsi Technology, Inc. Method of minimizing dishing during chemical mechanical polishing of semiconductor metals for making a semiconductor device
TW407342B (en) * 1998-06-17 2000-10-01 United Microelectronics Corp Planarization method of damascene structure
US6150256A (en) * 1998-10-30 2000-11-21 International Business Machines Corporation Method for forming self-aligned features
US6225210B1 (en) * 1998-12-09 2001-05-01 Advanced Micro Devices, Inc. High density capping layers with improved adhesion to copper interconnects
JP3708732B2 (ja) * 1998-12-25 2005-10-19 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
US6803327B1 (en) 1999-04-05 2004-10-12 Taiwan Semiconductor Manufacturing Company Cost effective polymide process to solve passivation extrusion or damage and SOG delminates
US6358119B1 (en) 1999-06-21 2002-03-19 Taiwan Semiconductor Manufacturing Company Way to remove CU line damage after CU CMP
US6800548B2 (en) * 2002-01-02 2004-10-05 Intel Corporation Method to avoid via poisoning in dual damascene process
CN1176488C (zh) * 2002-03-15 2004-11-17 台湾积体电路制造股份有限公司 测试金属层间介电层强度的方法
JP2005191408A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd コイル導電体とその製造方法およびこれを用いた電子部品
US7426780B2 (en) 2004-11-10 2008-09-23 Enpirion, Inc. Method of manufacturing a power module
US7462317B2 (en) 2004-11-10 2008-12-09 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
JP4578254B2 (ja) * 2005-01-26 2010-11-10 京セラ株式会社 多層配線基板
US8631560B2 (en) * 2005-10-05 2014-01-21 Enpirion, Inc. Method of forming a magnetic device having a conductive clip
US8701272B2 (en) * 2005-10-05 2014-04-22 Enpirion, Inc. Method of forming a power module with a magnetic device having a conductive clip
US8139362B2 (en) * 2005-10-05 2012-03-20 Enpirion, Inc. Power module with a magnetic device having a conductive clip
US7688172B2 (en) * 2005-10-05 2010-03-30 Enpirion, Inc. Magnetic device having a conductive clip
US20070138405A1 (en) * 2005-12-16 2007-06-21 3M Innovative Properties Company Corona etching
US7920042B2 (en) * 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
US8018315B2 (en) * 2007-09-10 2011-09-13 Enpirion, Inc. Power converter employing a micromagnetic device
US8133529B2 (en) * 2007-09-10 2012-03-13 Enpirion, Inc. Method of forming a micromagnetic device
US7955868B2 (en) * 2007-09-10 2011-06-07 Enpirion, Inc. Method of forming a micromagnetic device
US7952459B2 (en) * 2007-09-10 2011-05-31 Enpirion, Inc. Micromagnetic device and method of forming the same
US8692532B2 (en) 2008-04-16 2014-04-08 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8686698B2 (en) * 2008-04-16 2014-04-01 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US9246390B2 (en) * 2008-04-16 2016-01-26 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8541991B2 (en) 2008-04-16 2013-09-24 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8153473B2 (en) * 2008-10-02 2012-04-10 Empirion, Inc. Module having a stacked passive element and method of forming the same
US8266793B2 (en) * 2008-10-02 2012-09-18 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8339802B2 (en) * 2008-10-02 2012-12-25 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US9054086B2 (en) * 2008-10-02 2015-06-09 Enpirion, Inc. Module having a stacked passive element and method of forming the same
US9548714B2 (en) * 2008-12-29 2017-01-17 Altera Corporation Power converter with a dynamically configurable controller and output filter
US8698463B2 (en) * 2008-12-29 2014-04-15 Enpirion, Inc. Power converter with a dynamically configurable controller based on a power conversion mode
US8867295B2 (en) 2010-12-17 2014-10-21 Enpirion, Inc. Power converter for a memory module
EP2602818A1 (en) * 2011-12-09 2013-06-12 Ipdia An interposer device
US9509217B2 (en) 2015-04-20 2016-11-29 Altera Corporation Asymmetric power flow controller for a power converter and method of operating the same
CN112533395B (zh) * 2020-12-21 2021-12-24 北京同方信息安全技术股份有限公司 印制电路板中埋入电阻的方法及其印制电路板
CN114190002A (zh) * 2021-12-09 2022-03-15 上达电子（深圳）股份有限公司 一种柔性封装基板半埋入式厚铜精细线路的成型方法

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JPS63215056A (ja) * 1987-03-04 1988-09-07 Matsushita Electronics Corp 半導体装置の製造方法
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US4952275A (en) * 1989-12-15 1990-08-28 Microelectronics And Computer Technology Corporation Copper etching solution and method

Also Published As

Publication number Publication date
CN1029274C (zh) 1995-07-05
JPH06505833A (ja) 1994-06-30
TW226052B (enExample) 1994-07-01
CA2101426A1 (en) 1992-08-12
US5187119A (en) 1993-02-16
CN1070287A (zh) 1993-03-24
EP0571547A1 (en) 1993-12-01
EP0571547A4 (enExample) 1994-02-09
WO1992014261A1 (en) 1992-08-20

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