JPH06505833A - マルチチップモジュールおよび平坦化パターン化表面を有する集積回路基板 - Google Patents

マルチチップモジュールおよび平坦化パターン化表面を有する集積回路基板

Info

Publication number
JPH06505833A
JPH06505833A JP4507047A JP50704792A JPH06505833A JP H06505833 A JPH06505833 A JP H06505833A JP 4507047 A JP4507047 A JP 4507047A JP 50704792 A JP50704792 A JP 50704792A JP H06505833 A JPH06505833 A JP H06505833A
Authority
JP
Japan
Prior art keywords
layer
conductive layer
etching
copper
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4507047A
Other languages
English (en)
Japanese (ja)
Inventor
セック，ジェイ　マーティン
バーネット，アンドルー　フランク
Original Assignee
ザ、ボーイング、カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ザ、ボーイング、カンパニー filed Critical ザ、ボーイング、カンパニー
Publication of JPH06505833A publication Critical patent/JPH06505833A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP4507047A 1991-02-11 1992-02-10 マルチチップモジュールおよび平坦化パターン化表面を有する集積回路基板 Pending JPH06505833A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US654,880 1991-02-11
US07/654,880 US5187119A (en) 1991-02-11 1991-02-11 Multichip module and integrated circuit substrates having planarized patterned surfaces
PCT/US1992/001140 WO1992014261A1 (en) 1991-02-11 1992-02-10 Multichip module and integrated circuit substrates having planarized patterned surfaces

Publications (1)

Publication Number Publication Date
JPH06505833A true JPH06505833A (ja) 1994-06-30

Family

ID=24626612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4507047A Pending JPH06505833A (ja) 1991-02-11 1992-02-10 マルチチップモジュールおよび平坦化パターン化表面を有する集積回路基板

Country Status (8)

Country Link
US (1) US5187119A (enExample)
EP (1) EP0571547A1 (enExample)
JP (1) JPH06505833A (enExample)
KR (1) KR930703699A (enExample)
CN (1) CN1029274C (enExample)
CA (1) CA2101426A1 (enExample)
TW (1) TW226052B (enExample)
WO (1) WO1992014261A1 (enExample)

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JP2006210473A (ja) * 2005-01-26 2006-08-10 Kyocera Corp 多層配線基板

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US5300813A (en) * 1992-02-26 1994-04-05 International Business Machines Corporation Refractory metal capped low resistivity metal conductor lines and vias
US5384281A (en) * 1992-12-29 1995-01-24 International Business Machines Corporation Non-conformal and oxidizable etch stops for submicron features
US5397741A (en) * 1993-03-29 1995-03-14 International Business Machines Corporation Process for metallized vias in polyimide
JP2947054B2 (ja) * 1994-03-04 1999-09-13 ヤマハ株式会社 配線形成法
US5494854A (en) * 1994-08-17 1996-02-27 Texas Instruments Incorporated Enhancement in throughput and planarity during CMP using a dielectric stack containing HDP-SiO2 films
KR0171069B1 (ko) * 1994-10-27 1999-03-30 문정환 반도체 장치의 접촉부 형성방법
US5851899A (en) * 1996-08-08 1998-12-22 Siemens Aktiengesellschaft Gapfill and planarization process for shallow trench isolation
JPH10163319A (ja) * 1996-11-29 1998-06-19 Hitachi Ltd 半導体集積回路装置の製造方法
US6127721A (en) * 1997-09-30 2000-10-03 Siemens Aktiengesellschaft Soft passivation layer in semiconductor fabrication
US6706623B1 (en) * 1997-12-10 2004-03-16 Texas Instruments Incorporated Method and system for avoiding plasma etch damage
US6093656A (en) * 1998-02-26 2000-07-25 Vlsi Technology, Inc. Method of minimizing dishing during chemical mechanical polishing of semiconductor metals for making a semiconductor device
TW407342B (en) * 1998-06-17 2000-10-01 United Microelectronics Corp Planarization method of damascene structure
US6150256A (en) * 1998-10-30 2000-11-21 International Business Machines Corporation Method for forming self-aligned features
US6225210B1 (en) * 1998-12-09 2001-05-01 Advanced Micro Devices, Inc. High density capping layers with improved adhesion to copper interconnects
JP3708732B2 (ja) 1998-12-25 2005-10-19 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
US6803327B1 (en) 1999-04-05 2004-10-12 Taiwan Semiconductor Manufacturing Company Cost effective polymide process to solve passivation extrusion or damage and SOG delminates
US6358119B1 (en) 1999-06-21 2002-03-19 Taiwan Semiconductor Manufacturing Company Way to remove CU line damage after CU CMP
US6800548B2 (en) * 2002-01-02 2004-10-05 Intel Corporation Method to avoid via poisoning in dual damascene process
CN1314115C (zh) * 2002-03-15 2007-05-02 台湾积体电路制造股份有限公司 多重金属层内连线结构
JP2005191408A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd コイル導電体とその製造方法およびこれを用いた電子部品
US7426780B2 (en) 2004-11-10 2008-09-23 Enpirion, Inc. Method of manufacturing a power module
US7462317B2 (en) 2004-11-10 2008-12-09 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
US7688172B2 (en) * 2005-10-05 2010-03-30 Enpirion, Inc. Magnetic device having a conductive clip
US8139362B2 (en) * 2005-10-05 2012-03-20 Enpirion, Inc. Power module with a magnetic device having a conductive clip
US8701272B2 (en) * 2005-10-05 2014-04-22 Enpirion, Inc. Method of forming a power module with a magnetic device having a conductive clip
US8631560B2 (en) * 2005-10-05 2014-01-21 Enpirion, Inc. Method of forming a magnetic device having a conductive clip
US20070138405A1 (en) * 2005-12-16 2007-06-21 3M Innovative Properties Company Corona etching
US7955868B2 (en) * 2007-09-10 2011-06-07 Enpirion, Inc. Method of forming a micromagnetic device
US7920042B2 (en) 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
US7952459B2 (en) * 2007-09-10 2011-05-31 Enpirion, Inc. Micromagnetic device and method of forming the same
US8018315B2 (en) * 2007-09-10 2011-09-13 Enpirion, Inc. Power converter employing a micromagnetic device
US8133529B2 (en) * 2007-09-10 2012-03-13 Enpirion, Inc. Method of forming a micromagnetic device
US8686698B2 (en) * 2008-04-16 2014-04-01 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8541991B2 (en) 2008-04-16 2013-09-24 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US9246390B2 (en) * 2008-04-16 2016-01-26 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8692532B2 (en) 2008-04-16 2014-04-08 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US9054086B2 (en) * 2008-10-02 2015-06-09 Enpirion, Inc. Module having a stacked passive element and method of forming the same
US8153473B2 (en) * 2008-10-02 2012-04-10 Empirion, Inc. Module having a stacked passive element and method of forming the same
US8339802B2 (en) * 2008-10-02 2012-12-25 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8266793B2 (en) * 2008-10-02 2012-09-18 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8698463B2 (en) * 2008-12-29 2014-04-15 Enpirion, Inc. Power converter with a dynamically configurable controller based on a power conversion mode
US9548714B2 (en) * 2008-12-29 2017-01-17 Altera Corporation Power converter with a dynamically configurable controller and output filter
US8867295B2 (en) 2010-12-17 2014-10-21 Enpirion, Inc. Power converter for a memory module
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US9509217B2 (en) 2015-04-20 2016-11-29 Altera Corporation Asymmetric power flow controller for a power converter and method of operating the same
CN112533395B (zh) * 2020-12-21 2021-12-24 北京同方信息安全技术股份有限公司 印制电路板中埋入电阻的方法及其印制电路板
CN114190002A (zh) * 2021-12-09 2022-03-15 上达电子（深圳）股份有限公司 一种柔性封装基板半埋入式厚铜精细线路的成型方法

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JP2006210473A (ja) * 2005-01-26 2006-08-10 Kyocera Corp 多層配線基板

Also Published As

Publication number Publication date
WO1992014261A1 (en) 1992-08-20
CA2101426A1 (en) 1992-08-12
EP0571547A1 (en) 1993-12-01
TW226052B (enExample) 1994-07-01
US5187119A (en) 1993-02-16
EP0571547A4 (enExample) 1994-02-09
CN1029274C (zh) 1995-07-05
CN1070287A (zh) 1993-03-24
KR930703699A (ko) 1993-11-30

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