KR930004502A - 환원제를 이용한 전해구리 도금방법 - Google Patents

환원제를 이용한 전해구리 도금방법 Download PDF

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Publication number
KR930004502A
KR930004502A KR1019920014557A KR920014557A KR930004502A KR 930004502 A KR930004502 A KR 930004502A KR 1019920014557 A KR1019920014557 A KR 1019920014557A KR 920014557 A KR920014557 A KR 920014557A KR 930004502 A KR930004502 A KR 930004502A
Authority
KR
South Korea
Prior art keywords
plating method
salts
copper
electrolytic copper
reducing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019920014557A
Other languages
English (en)
Korean (ko)
Inventor
다케시 미우라
마사루 세이타
Original Assignee
가와시마 도시오
니뽄리로날 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가와시마 도시오, 니뽄리로날 가부시키가이샤 filed Critical 가와시마 도시오
Publication of KR930004502A publication Critical patent/KR930004502A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/916—Sequential electrolytic and nonelectrolytic, or nonelectrolytic and electrolytic coating from the same bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1019920014557A 1991-08-15 1992-08-13 환원제를 이용한 전해구리 도금방법 Withdrawn KR930004502A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3205101A JPH0544075A (ja) 1991-08-15 1991-08-15 無電解銅めつき代替銅ストライクめつき方法
JP205101/1991 1991-08-15

Publications (1)

Publication Number Publication Date
KR930004502A true KR930004502A (ko) 1993-03-22

Family

ID=16501437

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920014557A Withdrawn KR930004502A (ko) 1991-08-15 1992-08-13 환원제를 이용한 전해구리 도금방법

Country Status (5)

Country Link
US (1) US5454930A (enExample)
EP (1) EP0530568A3 (enExample)
JP (1) JPH0544075A (enExample)
KR (1) KR930004502A (enExample)
TW (1) TW241316B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100782782B1 (ko) * 2006-11-23 2007-12-05 주식회사 포스코 프레스 교정기와 형상계측기를 이용한 판재형상 교정방법

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ES2155075T3 (es) * 1993-03-18 2001-05-01 Atotech Usa Inc Metodo de revestimiento por inmersion, auto-acelerante y auto-renovador, sin formaldehido.
JP3208410B2 (ja) 1997-04-07 2001-09-10 奥野製薬工業株式会社 非導電性プラスチック成形品への電気めっき方法
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6113771A (en) * 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
JP2000173868A (ja) * 1998-12-01 2000-06-23 Nichicon Corp アルミニウム電解コンデンサ駆動用電解液
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
DE19918833C2 (de) * 1999-04-22 2002-10-31 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
JP2004513221A (ja) 2000-05-23 2004-04-30 アプライド　マテリアルズ　インコーポレイテッド 銅シード層の異常を克服し表面形状サイズ及びアスペクト比を調整する方法と装置
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
WO2002029137A2 (en) * 2000-10-03 2002-04-11 Applied Materials,Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
ATE466975T1 (de) * 2000-12-13 2010-05-15 Imec Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US20040020780A1 (en) * 2001-01-18 2004-02-05 Hey H. Peter W. Immersion bias for use in electro-chemical plating system
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US20040253450A1 (en) * 2001-05-24 2004-12-16 Shipley Company, L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
JP4843164B2 (ja) * 2001-08-21 2011-12-21 日本リーロナール有限会社 銅−樹脂複合材料の形成方法
EP1322146A1 (en) * 2001-12-18 2003-06-25 Phoenix Precision Technology Corporation Method of electroplating solder bumps on an organic circuit board
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US20040200725A1 (en) * 2003-04-09 2004-10-14 Applied Materials Inc. Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US6977049B2 (en) * 2003-12-31 2005-12-20 The Boc Group, Inc. Treatment process for industrial waste stream
US20050139548A1 (en) * 2003-12-31 2005-06-30 The Boc Group, Inc. Extraction and oxidation process
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
JP2008031536A (ja) * 2006-07-31 2008-02-14 Ebara Udylite Kk ダイレクトプレーティング方法
EP2305856A1 (en) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
DE102010012204B4 (de) 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
CN102127781A (zh) * 2011-02-25 2011-07-20 湖南大学 适用于印制板孔金属化的电化镀铜
JP5996244B2 (ja) * 2011-04-19 2016-09-21 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 半導体上の銅のめっき
CN103526239A (zh) * 2013-10-08 2014-01-22 昆山纯柏精密五金有限公司 一种铜电镀液以及五金件的镀铜方法
JP6474410B2 (ja) * 2013-12-09 2019-02-27 アヴニ 電気化学的に不活性なカチオンを含む銅電着浴
CN114408858B (zh) * 2022-01-05 2023-03-17 北京科技大学 一种室温可吸氢锆基复合材料的制备方法
CN118308711B (zh) * 2024-03-20 2025-01-24 深圳市豪龙新材料技术有限公司 一种酸性光亮镀铜剂及其制备方法

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US2644787A (en) * 1950-01-05 1953-07-07 Eckert Mauchly Comp Corp Electrodeposition of a magnetic coating
US4228201A (en) * 1977-06-06 1980-10-14 Nathan Feldstein Method for rendering a non-platable semiconductor substrate platable
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
US4459184A (en) * 1980-08-12 1984-07-10 Macdermid, Inc. Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
WO1982000666A1 (en) * 1980-08-12 1982-03-04 Macdermid Inc Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
JPS57145969A (en) * 1981-03-04 1982-09-09 Agency Of Ind Science & Technol Chemical plating method
NL8105922A (nl) * 1981-12-31 1983-07-18 Philips Nv Werkwijze voor het partieel metalliseren van elektrisch geleidende niet-metallische patronen.
US4877450A (en) * 1989-02-23 1989-10-31 Learonal, Inc. Formaldehyde-free electroless copper plating solutions
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper
JPH04120290A (ja) * 1990-02-26 1992-04-21 Ishihara Chem Co Ltd 電気銅めっき液

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100782782B1 (ko) * 2006-11-23 2007-12-05 주식회사 포스코 프레스 교정기와 형상계측기를 이용한 판재형상 교정방법

Also Published As

Publication number Publication date
TW241316B (enExample) 1995-02-21
EP0530568A3 (en) 1993-08-25
EP0530568A2 (en) 1993-03-10
US5454930A (en) 1995-10-03
JPH0544075A (ja) 1993-02-23

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19920813

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid