KR920022412A - 세정장치 및 세정방법 - Google Patents

세정장치 및 세정방법 Download PDF

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KR920022412A
KR920022412A KR1019920007937A KR920007937A KR920022412A KR 920022412 A KR920022412 A KR 920022412A KR 1019920007937 A KR1019920007937 A KR 1019920007937A KR 920007937 A KR920007937 A KR 920007937A KR 920022412 A KR920022412 A KR 920022412A
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Prior art keywords
cleaning
liquid
opening
supplying
container
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KR1019920007937A
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KR0175072B1 (ko
Inventor
신야 무라카미
유우지 가키카와
신이치이로 이즈미
노리유키 아나이
다카미 사토오
히로후미 시라이시
코지 하라다
다카유키 도모에다
히로시 다나카
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시끼가이샤
다카시마 히로시
도오교오 에레구토론 사가 가부시끼가이샤
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Priority claimed from JP13167391A external-priority patent/JPH04334579A/ja
Priority claimed from JP3135301A external-priority patent/JP3038449B2/ja
Priority claimed from JP3135303A external-priority patent/JP2979268B2/ja
Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시끼가이샤, 다카시마 히로시, 도오교오 에레구토론 사가 가부시끼가이샤 filed Critical 이노우에 아키라
Publication of KR920022412A publication Critical patent/KR920022412A/ko
Application granted granted Critical
Publication of KR0175072B1 publication Critical patent/KR0175072B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

내용 없음.

Description

세정장치 및 세정방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는, 본 발명이 적용되는 세정 시스템의 개요를 나타낸 평면 레이아웃도면,
제2도는 세정 처리조를 나타낸 사시도,
제3도는, 세정 처리부를 나타낸 평면 레이아웃도면.

Claims (21)

  1. 피처리체를 반출 및 반입하기 위한 개구부(35)를 가지며, 처리액에 의하여 피처리체를 세정하기 위한 세정처리실과, 상기 개구부(35)를 개폐하기 위한 개폐수단과, 상기 개구수단을 세정하기 위한 세정수단을 구비하는 세정장치.
  2. 제1항에 있어서, 상기 개폐수단은, 상기 개구부(35)에 대응하여 설치된 케이싱과 케이싱내를 이동하여 상기 개구부(35)를 열거나 닫게하는 셔터(36)와, 셔터(36)를 열림위치와 닫힘위치 사이에서 이동시키는 구동수단을 갖추고 있는 세정장치.
  3. 제2항에 있어서, 상기 세정수단은 상기 개폐수단에 세정액을 공급하기 위한 노즐(84)을 가지고 있는 세정장치.
  4. 제2항에 있어서, 상기 케이싱내에 클린에어의 다운플로우를 형성하는 수단을 가지고 있는 세정장치.
  5. 제2항에 있어서, 상기 구동수단은, 실린더(51)와 실린더(51)에 대하여 진출 및 퇴입가능한 플런저(52)를 가지며, 플런저(52)가 상기 셔터에 부착되어 있는 세정장치.
  6. 제5항에 있어서, 상기 케이싱과 상기 플런저(52)와의 사이를 시일하는 시일수단을 가지고 있는 세정장치.
  7. 제6항에 있어서, 상기 케이싱내에 형성하는 밀폐공간에 가스를 공급하는 가스공급수단을 가지고 있는 세정장치.
  8. 제1항에 있어서, 상기 처리실 밖에 피처리체를 상기 세정처리실에 대하여 반입 및 반출하기 위한 반송기구(19), (22), (25)를 가지고있는 세정장치.
  9. 제8항에 있어서, 상기 반송기구를 수용하는 하우징(128)을 가지고 있는 세정장치.
  10. 제9항에 있어서, 상기 하우징(128)내에 클린에어의 다운플로우를 형성하는 수단을 가지고 있는 세정장치.
  11. 제1항에 있어서, 상기 세정처리실은 세정처리액(L)이 저유되는 세정탱크를 가지고 있으며, 세정탱크내의 세정처리액(L)에 피처리체가 잠김으로써 피처리체가 세정되는 세정장치.
  12. 세정처리액(L)이 저유되고, 피처리체를 세정처리액(L)에 의하여 세정하는 세정처리용기와, 세정처리용기에형성되고, 이 용기로부터 세정액을 배출하기 위한 세정 처리액(L) 배출구(95)와, 세정처리액(L)이 배출되어서 피처리체의 적어도 일부가 노출하였을 때에, 피처리체에 세정액을 공급하는 세정액 공급수단과를 구비하는 세정장치.
  13. 제12항에 있어서, 상기 세정처리용기에 형성되고, 이 용기에 세정처리액(L)을 공급하기 위한 세정처리액 공급구(97)를 가지는 세정장치.
  14. 제12항에 있어서, 상기 세정액 2공급수단은, 피처리체에 세정액을 공급하기 위한 노즐(84)을 가지고 있는 세정장치.
  15. 제14항에 있어서, 상기 세정액 공급수단은, 상기 노즐(84)을 세정하기 위한 세정위치와, 세정위치와는 다른 퇴피위치와의 사이에서 위치를 전환하기 위한 전환수단을 가지고 있는 세정장치.
  16. 제12항에 있어서, 상기 세정처리용기내의 세정처리액(L)을 버블링하기 위한 버블링수단을 가지고 있는 세정장치.
  17. 제12항에 있어서, 상기 세정처리용기내의 세정처리액(L)에 잠긴 피처리체의 부상을 방지하기 위한 부상방지수단을 가지고 있는 세정장치.
  18. 제17항에 있어서, 상기 부상방지수단은, 상기 피처리체의 바로 위에 설치되고 피처리체의 부상을 저지하는 부상방지부재와, 이 부상방지부재를 부상방지위치와 부상방지위치와는 다른 퇴피위치와의 사이에서 이동시키는 구동수단과를 가지는 세정장치.
  19. 제18항에 있어서, 상기 구동수단은 상기 부상방지부재를 회전이동시키는 세정장치.
  20. 제19항에 있어서, 상기 구동수단은 상기 부상방지부재를 직선이동시키는 세정장치.
  21. 세정처리용기내에 세정처리액(L)을 공급하는 공정과, 세정처리용기내의 세정처리액(L)에 피처리체를 반입하는 공정과, 상기 세정처리용기로부터 적어도 1회 세정처리액(L)을 배출하는 공정과, 세정처리액(L)의 배출에 의하여 적어도 피처리체의 일부가 노출하였을때에, 피처리체에 세정액을 공급하는 공정을 구비하는 세정방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920007937A 1991-05-08 1992-05-08 세정장치 및 세정방법 KR0175072B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP13167391A JPH04334579A (ja) 1991-05-08 1991-05-08 洗浄装置
JP91-131673 1991-05-08
JP91-135303 1991-05-13
JP3135301A JP3038449B2 (ja) 1991-05-13 1991-05-13 洗浄方法及び洗浄装置
JP3135303A JP2979268B2 (ja) 1991-05-13 1991-05-13 洗浄装置
JP91-135301 1991-05-13
JP91-140736 1991-05-17

Publications (2)

Publication Number Publication Date
KR920022412A true KR920022412A (ko) 1992-12-19
KR0175072B1 KR0175072B1 (ko) 1999-04-01

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Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3146841B2 (ja) * 1994-03-28 2001-03-19 信越半導体株式会社 ウエーハのリンス装置
US6833035B1 (en) * 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
JPH08108125A (ja) * 1994-10-13 1996-04-30 Sony Disc Technol:Kk 液供給装置
KR0166831B1 (ko) * 1995-12-18 1999-02-01 문정환 반도체 웨이퍼 세정장치 및 방법
KR970053126A (ko) * 1995-12-30 1997-07-29 김광호 물반점 방지를 위한 반도체 장치의 세정 방법 및 장치
TW363903B (en) * 1996-03-11 1999-07-11 Memc Electronic Materials Spa Apparatus for use in automatically cleaning semiconductor wafers and methods for drying a semiconductor wafer in the automatic drying machine
JP2000500926A (ja) * 1996-04-22 2000-01-25 ステアーグ ミクロテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング 流体コンテナ内で基板を処理するための装置および方法
DE19654903C2 (de) * 1996-04-24 1998-09-24 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
DE19616402C2 (de) * 1996-04-24 2001-11-29 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
US6240938B1 (en) 1996-05-29 2001-06-05 Steag Microtech Gmbh Device for treating substrates in a fluid container
US5922138A (en) * 1996-08-12 1999-07-13 Tokyo Electron Limited Liquid treatment method and apparatus
US5975097A (en) * 1996-09-02 1999-11-02 Tokyo Electron Limited Processing apparatus for target processing substrate
KR100508575B1 (ko) * 1996-09-24 2005-10-21 동경 엘렉트론 주식회사 세정처리방법및장치와기판처리용장치
SG98022A1 (en) * 1996-09-24 2003-08-20 Tokyo Electron Ltd Method and apparatus for cleaning treatment
US6045624A (en) * 1996-09-27 2000-04-04 Tokyo Electron Limited Apparatus for and method of cleaning objects to be processed
US6001189A (en) * 1996-09-30 1999-12-14 Micron Technology, Inc. Method for reducing gaseous species of contamination in wet processes
JP3171807B2 (ja) 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
US7067018B2 (en) * 1997-05-05 2006-06-27 Semitool, Inc. Automated system for handling and processing wafers within a carrier
JP3932618B2 (ja) * 1997-09-30 2007-06-20 ソニー株式会社 薬液処理装置
JP3075350B2 (ja) * 1997-12-03 2000-08-14 日本電気株式会社 薬液処理方法および薬液処理装置
US6273107B1 (en) 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
KR100635836B1 (ko) * 1998-03-25 2006-10-18 다이낑 고오교 가부시키가이샤 반도체 제조장치용 불소고무계 성형품의 세정방법 및세정된 성형품
KR100265286B1 (ko) * 1998-04-20 2000-10-02 윤종용 반도체장치 제조용 케미컬 순환공급장치 및 이의 구동방법
TW380284B (en) * 1998-09-09 2000-01-21 Promos Technologies Inc Method for improving etching uniformity during a wet etching process
US6495004B1 (en) * 1998-10-05 2002-12-17 Ebara Corporation Substrate plating apparatus
US6328809B1 (en) 1998-10-09 2001-12-11 Scp Global Technologies, Inc. Vapor drying system and method
US6219936B1 (en) * 1998-11-24 2001-04-24 Toho Kasei Co., Ltd. Wafer drying device and method
AU5173100A (en) 1999-05-27 2000-12-18 Lam Research Corporation Apparatus and methods for drying batches of wafers
KR20010027028A (ko) * 1999-09-10 2001-04-06 이계안 공작물의 세정용 로보트 시스템
US6364762B1 (en) 1999-09-30 2002-04-02 Lam Research Corporation Wafer atmospheric transport module having a controlled mini-environment
US6318389B1 (en) 1999-10-29 2001-11-20 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
DE60012005T2 (de) 2000-01-17 2005-07-14 Toho Kasei Co., Ltd. Verfahren und vorrichtung zur trocknung eines substrats
JP4021125B2 (ja) * 2000-06-02 2007-12-12 東京エレクトロン株式会社 ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置
JP3802446B2 (ja) * 2002-05-15 2006-07-26 東邦化成株式会社 基板乾燥方法およびその装置
JP2004327962A (ja) * 2003-04-07 2004-11-18 Matsushita Electric Ind Co Ltd レジストの剥離装置及び剥離方法
JP4176564B2 (ja) * 2003-06-23 2008-11-05 株式会社東芝 ウェハ移載装置及びこれを用いた半導体装置の製造方法
US8877178B2 (en) * 2003-12-19 2014-11-04 The Iams Company Methods of use of probiotic bifidobacteria for companion animals
JP2006140492A (ja) * 2004-11-11 2006-06-01 Samsung Electronics Co Ltd 半導体素子製造に使用される乾式クリーニング装置
US20070174993A1 (en) * 2006-02-02 2007-08-02 Dever Kerry L Filter cleaning system for floor cleaning apparatus
US8474468B2 (en) * 2006-09-30 2013-07-02 Tokyo Electron Limited Apparatus and method for thermally processing a substrate with a heated liquid
US7479463B2 (en) * 2007-03-09 2009-01-20 Tokyo Electron Limited Method for heating a chemically amplified resist layer carried on a rotating substrate
US9383138B2 (en) * 2007-03-30 2016-07-05 Tokyo Electron Limited Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
US20080241400A1 (en) * 2007-03-31 2008-10-02 Tokyo Electron Limited Vacuum assist method and system for reducing intermixing of lithography layers
US20090087566A1 (en) * 2007-09-27 2009-04-02 Masahiro Kimura Substrate treating apparatus and substrate treating method
DE102009033586A1 (de) * 2009-07-16 2011-01-20 Rena Gmbh Trägerloses Handhabungssystem
DE102009035341A1 (de) * 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Vorrichtung zur Reinigung von Substraten an einem Träger
US8950414B2 (en) * 2009-07-31 2015-02-10 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and storage medium
CN102194473A (zh) * 2010-03-03 2011-09-21 株式会社日立高新技术 清洗方法及其装置
JP5704997B2 (ja) * 2010-09-10 2015-04-22 株式会社スギノマシン タレット式洗浄装置
JP6289241B2 (ja) * 2013-06-20 2018-03-07 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
CN104253063B (zh) * 2013-06-28 2017-12-01 上海华虹宏力半导体制造有限公司 一种用于防止晶片偏移掉落的装置
JP6386307B2 (ja) * 2014-09-01 2018-09-05 株式会社荏原製作所 リンス槽および該リンス槽を用いた基板洗浄方法
TWI552934B (zh) * 2014-11-05 2016-10-11 台灣茂矽電子股份有限公司 防浮裝置及其適用之晶舟
US10460984B2 (en) 2015-04-15 2019-10-29 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating electrode and semiconductor device
US11194259B2 (en) * 2018-08-30 2021-12-07 Taiwan Semiconductor Manufacturing Co., Ltd. Equipment module with enhanced protection from airborne contaminants, and method of operation
BE1026754B1 (nl) * 2018-10-30 2020-06-04 Indusclean Nv Reiniging van industriële componenten
US11430672B2 (en) * 2019-03-04 2022-08-30 Applied Materials, Inc. Drying environments for reducing substrate defects
CN114289390A (zh) * 2021-12-30 2022-04-08 湖南科技大学 硅料清洗系统

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271871A (en) * 1975-12-11 1977-06-15 Nec Corp Washing apparatus
JPS53144265A (en) * 1977-05-23 1978-12-15 Hitachi Ltd Etching device
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4319930A (en) * 1980-03-28 1982-03-16 Daiwa Can Company, Limited Method for multi-stage washing
JPS5783036A (en) * 1980-11-10 1982-05-24 Seiichiro Sogo Cleaning device for semiconductor material
US4316750A (en) * 1981-01-16 1982-02-23 Western Electric Company, Inc. Apparatus and method for cleaning a flux station of a soldering system
US4564280A (en) * 1982-10-28 1986-01-14 Fujitsu Limited Method and apparatus for developing resist film including a movable nozzle arm
US4671206A (en) * 1983-06-20 1987-06-09 Hoppestad Lamont I Article support rack
JPS60223130A (ja) * 1984-04-19 1985-11-07 Sharp Corp 基板の洗滌乾燥方法及びその装置
JPS6178124A (ja) * 1984-09-26 1986-04-21 Oki Electric Ind Co Ltd 半導体ウエハの自動洗浄装置
JPS6197836A (ja) * 1984-10-18 1986-05-16 Hitachi Electronics Eng Co Ltd ウエ−ハのエツチング装置
US4575299A (en) * 1984-10-24 1986-03-11 Interlab, Inc. Automated work transfer system for chemical processing baths
US4693777A (en) * 1984-11-30 1987-09-15 Kabushiki Kaisha Toshiba Apparatus for producing semiconductor devices
JPH0691062B2 (ja) * 1985-04-24 1994-11-14 日本電気株式会社 半導体スライスの洗浄方法
US4674521A (en) * 1985-05-20 1987-06-23 Machine Technology, Inc. Rinsing apparatus and method
US4664133A (en) * 1985-07-26 1987-05-12 Fsi Corporation Wafer processing machine
US4753258A (en) * 1985-08-06 1988-06-28 Aigo Seiichiro Treatment basin for semiconductor material
JPS6314434A (ja) * 1986-07-04 1988-01-21 Dainippon Screen Mfg Co Ltd 基板表面処理方法および装置
US4861385A (en) * 1986-10-02 1989-08-29 Aisaburo Yagishita Article washing method
US4817652A (en) * 1987-03-26 1989-04-04 Regents Of The University Of Minnesota System for surface and fluid cleaning
JP2733771B2 (ja) * 1988-07-29 1998-03-30 日本テキサス・インスツルメンツ株式会社 液体による処理装置
JPH0644098Y2 (ja) * 1989-02-27 1994-11-14 黒谷 信子 半導体ウェハーの洗浄用バブラー
US5095925A (en) * 1989-03-13 1992-03-17 Elledge David M Aseptic cleaning apparatus
US5000795A (en) * 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
US5000208A (en) * 1990-06-21 1991-03-19 Micron Technology, Inc. Wafer rinser/dryer
US4997490A (en) * 1990-08-02 1991-03-05 Bold Plastics, Inc. Method of cleaning and rinsing wafers
US5069235A (en) * 1990-08-02 1991-12-03 Bold Plastics, Inc. Apparatus for cleaning and rinsing wafers
US5399204A (en) * 1990-12-18 1995-03-21 The Gillette Company Aqueous cleaning method
GB9203020D0 (en) * 1992-02-13 1992-03-25 Anderson Mitchell R An apparatus for the automated storage,re-heating and reuse of detergent solution for the washing of milk pipeline systems on dairy farms

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US5782990A (en) 1998-07-21
US5671764A (en) 1997-09-30
KR0175072B1 (ko) 1999-04-01
US5887604A (en) 1999-03-30

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