KR960015776A - 액공급장치 - Google Patents
액공급장치 Download PDFInfo
- Publication number
- KR960015776A KR960015776A KR1019950034513A KR19950034513A KR960015776A KR 960015776 A KR960015776 A KR 960015776A KR 1019950034513 A KR1019950034513 A KR 1019950034513A KR 19950034513 A KR19950034513 A KR 19950034513A KR 960015776 A KR960015776 A KR 960015776A
- Authority
- KR
- South Korea
- Prior art keywords
- processing liquid
- cup
- discharge means
- processing
- discharging
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 54
- 238000007599 discharging Methods 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 1
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract 3
- 239000002699 waste material Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/5762—With leakage or drip collecting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 발명의 목적은 처리대상에 대하여 처리액을 토출하는 처리액토출수단에 처리액을 공급하는 액공급장치에 있어서, 처리액을 쓸데없이 버리지 않고, 고품질의 처리액을 공급할 수 있는 액공급장치를 제안하는데 있다.
그 구성은 프로세스의 기다리는 시간동안에 처리액토출부(11)에서 소정량의 처리액(6)을 토출하고 이 처리액(6)을 밀폐된 컵(12)을 거쳐서 액탱크(16)에 송출하여 순환시키도록함으로써 처리액(6)을 쓸데없이 버리지 않고, 고품질의 처리액(6)을 공급할 수 있는 액공급장치(10)를 실현할 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 액공급장치의 일실시예의 구성을 나타내는 약선도이다,
제2도는 처리액 토출부 및 순환컵의 구성을 나타내는 단면도이다,
제3도는 액토출장치의 구성을 나타내는 약선도이다.
Claims (7)
- 처리대상에 대하여 처리액을 토출하는 처리액 토출수단에 상기 처리액을 공급하는 액공급장치에 있어서, 상기 처리액 토출수단이 상기 처리액 대상에 대하여 처리액을 토출하고 있지 않을 때 상기 처리액 토출수단이 토출하는 처리액을 순환시켜서 재차 상기 처리액 토출수단에 부여하는 순환수단을 구비한 것을 특징으로 하는 액공급장치.
- 제1항에 있어서, 상기 순환수단은, 상기 처리액 토출수단에서 토출되는 처리액을 받는 컵과, 상기 컵으로 받은 처리액을 도입하는 처리액 저장탱크와, 상기 처리액 저장탱크에 설치되어 상기 처리액을 소망의 온도로 조정하는 히터와를 구비하고, 상기 처리액 토출수단에서 토출된 처리액을 상기 컵 및 상기 처리액 저장탱크를 거쳐서 재차 상기 처리액 토출수단에 부여하는 것을 특징으로 하는 액공급장치.
- 제2항에 있어서, 상기 순환수단은, 상기 컵과 상기 처리액 저장탱크와의 경로 및 또는 상기 저장탱크와 상기 처리액 토출수단과의 경로에 상기 처리액중의 불순물을 제거하는 필터를 구비한 것을 특징으로 하는 액공급장치.
- 제2항에 있어서, 상기 처리액 토출수단은, 상기 처리액을 토출하는 노즐과, 상기 노즐의 측편으로 연장하도록 설치된 플랜지와, 상기 플랜지의 상기 컵과 대향하는 위치에 설치된 밀폐부재와를 구비하고, 상기 컵에 대하여 처리액을 토출할 때 상기 컵내를 밀폐하도록 한 것을 특징으로 하는 액공급장치.
- 제2항에 있어서, 상기 처리액 토출수단은 상기 처리액을 토출하는 노즐과, 상기 노즐의 측편으로 연장하도록 설치된 플랜지와를 구비하는 동시에 상기 컵은 상기 플랜지와 대향하는 위치에 밀폐부재를 구비하고, 상기 컵에 대하여 처리액을 토출할 때 상기 컵내를 밀폐하도록 한 것을 특징으로 하는 액공급장치.
- 제2항, 제3항, 제4항, 또는 제5항에 있어서, 상기 컵에 질소가스를 도입하는 파이프를 연결하도록 한 것을 특징으로 하는 액공급장치.
- 제2항, 제3항, 제4항, 제5항 또는 제6항에 있어서, 상기 처리액 토출수단은 상기처리액을 토출하는 토출구가 메시형태로 형성된 것을 특징으로 하는 액공급장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP94-275954 | 1994-10-13 | ||
JP6275954A JPH08108125A (ja) | 1994-10-13 | 1994-10-13 | 液供給装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960015776A true KR960015776A (ko) | 1996-05-22 |
Family
ID=17562744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950034513A KR960015776A (ko) | 1994-10-13 | 1995-10-09 | 액공급장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5778911A (ko) |
JP (1) | JPH08108125A (ko) |
KR (1) | KR960015776A (ko) |
CN (1) | CN1137948A (ko) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19534521C1 (de) * | 1995-09-06 | 1996-11-21 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum Behandeln von sich in Werkstücke erstreckende Löcher oder Vertiefungen mit flüssigen Behandlungsmitteln und Anwendung des Verfahrens zur Behandlung von Leiterplatten |
KR0183834B1 (ko) * | 1996-03-30 | 1999-04-15 | 김광호 | 반도체 제조 장치 및 이를 이용한 웨이퍼 처리 방법 |
US5975097A (en) * | 1996-09-02 | 1999-11-02 | Tokyo Electron Limited | Processing apparatus for target processing substrate |
KR100508575B1 (ko) * | 1996-09-24 | 2005-10-21 | 동경 엘렉트론 주식회사 | 세정처리방법및장치와기판처리용장치 |
SG98022A1 (en) * | 1996-09-24 | 2003-08-20 | Tokyo Electron Ltd | Method and apparatus for cleaning treatment |
JP3511441B2 (ja) * | 1996-11-29 | 2004-03-29 | 忠弘 大見 | 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法 |
US6516816B1 (en) * | 1999-04-08 | 2003-02-11 | Applied Materials, Inc. | Spin-rinse-dryer |
KR100393204B1 (ko) * | 2000-05-16 | 2003-07-31 | 삼성전자주식회사 | 씨엠피용 슬러리의 공급 방법 및 장치 |
US7479205B2 (en) * | 2000-09-22 | 2009-01-20 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
DE10053305C2 (de) * | 2000-10-27 | 2003-02-27 | Weitmann & Konrad Fa | Flüssigkeitsauftragsvorrichtung |
US20030036273A1 (en) * | 2001-08-14 | 2003-02-20 | Applied Materials, Inc. | Shield for capturing fluid displaced from a substrate |
EP1293589A3 (en) * | 2001-09-17 | 2004-10-13 | Nissan Motor Company, Limited | Apparatus for pretreatment prior to painting |
EP1347496A3 (en) * | 2002-03-12 | 2006-05-03 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus and substrate treating method |
CN1565045A (zh) * | 2002-07-26 | 2005-01-12 | 应用材料公司 | 旋转-清洗-干燥器用的亲水部件 |
CN1265246C (zh) * | 2003-07-11 | 2006-07-19 | 友达光电股份有限公司 | 一种光刻胶涂敷装置 |
TWI362059B (en) * | 2004-11-25 | 2012-04-11 | Az Electronic Mat Ip Japan Kk | Photoresist coating solution supply system and method for supplying photoresist coating solution using thereof, and photoresist coating system using thereof |
EP1836951B1 (en) * | 2005-05-25 | 2009-10-14 | Fujinon Corporation | Water feeding device for an endoscope |
CN102059192B (zh) * | 2006-12-27 | 2012-10-10 | 上村工业株式会社 | 表面处理装置 |
US8950414B2 (en) * | 2009-07-31 | 2015-02-10 | Tokyo Electron Limited | Liquid processing apparatus, liquid processing method, and storage medium |
JP5220707B2 (ja) * | 2009-07-31 | 2013-06-26 | 東京エレクトロン株式会社 | 液処理装置、液処理方法、プログラムおよびプログラム記録媒体 |
JP5313074B2 (ja) * | 2009-07-31 | 2013-10-09 | 東京エレクトロン株式会社 | 液処理装置、液処理方法、プログラムおよびプログラム記録媒体 |
CN102327840A (zh) * | 2011-05-31 | 2012-01-25 | 昆山能缇精密电子有限公司 | 单机点胶机 |
CN102319656B (zh) * | 2011-09-21 | 2013-06-12 | 上海先进半导体制造股份有限公司 | Hmds自动供应系统及其自动供应的方法 |
JP6001896B2 (ja) * | 2012-03-27 | 2016-10-05 | 株式会社Screenセミコンダクターソリューションズ | 基板洗浄装置およびそれを備えた基板処理装置 |
WO2015175790A1 (en) * | 2014-05-15 | 2015-11-19 | Tokyo Electron Limited | Method and apparatus for increased recirculation and filtration in a photoresist dispense system |
CN104826771B (zh) * | 2015-05-04 | 2018-08-10 | 上海华力微电子有限公司 | 减少聚合物产生的光刻化学品喷涂系统及控制方法 |
JP6551203B2 (ja) * | 2015-12-11 | 2019-07-31 | 株式会社デンソー | 洗浄ノズル |
JP6887836B2 (ja) * | 2017-03-16 | 2021-06-16 | 株式会社Screenホールディングス | 処理液供給装置、基板処理装置、および処理液供給方法 |
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US1674668A (en) * | 1924-06-26 | 1928-06-26 | Marvel Equipment Company | Dispensing pump |
US3087517A (en) * | 1959-12-21 | 1963-04-30 | Magnuson Eng Inc | Liquid filling machine and method |
DE2058667B1 (de) * | 1970-11-28 | 1972-05-25 | Weitmann & Konrad | Vorrichtung in Druckereimaschinen,insbesondere Offsetmaschinen,zum Aufbringen von Fluessigkeit auf bewegte Flaechen |
US4190015A (en) * | 1977-12-08 | 1980-02-26 | Machine Technology, Inc. | Apparatus for dispensing liquid to spinning workpieces |
US4277080A (en) * | 1978-03-16 | 1981-07-07 | Smitty's, Inc. | Quick hitch power frame |
NZ190520A (en) * | 1978-05-29 | 1982-11-23 | Tybar Eng Pty Ltd | Patterned application of liquid to moving strip |
DE3300494A1 (de) * | 1983-01-08 | 1984-07-12 | Robert Bosch Gmbh, 7000 Stuttgart | Drehstromgenerator fuer fahrzeuge, insbesondere mit einem klauenpol-laeufer |
US4644983A (en) * | 1985-03-20 | 1987-02-24 | Texaco Limited | Spill reducing system |
US4745422A (en) * | 1985-11-18 | 1988-05-17 | Kabushiki Kaisha Toshiba | Automatic developing apparatus |
US4923743A (en) * | 1987-06-15 | 1990-05-08 | Milliken Research Corporation | Apparatus and method for spraying moving substrates |
EP0325192B1 (de) * | 1988-01-18 | 1992-09-09 | Biac Holding Ag | Verfahren zum Entfernen von Schmutzflecken aus einem textilen Flächengebilde und Vorrichtung zur Durchführung des Verfahrens |
DE3915844C1 (ko) * | 1989-05-16 | 1990-12-06 | Eduard Kuesters Maschinenfabrik Gmbh & Co Kg, 4150 Krefeld, De | |
US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
JP3168612B2 (ja) * | 1991-06-27 | 2001-05-21 | ソニー株式会社 | レジスト塗布装置 |
JPH0562962A (ja) * | 1991-08-29 | 1993-03-12 | Hitachi Ltd | 板状物処理治具およびそれが使用された板状物処理方法 |
US5201958A (en) * | 1991-11-12 | 1993-04-13 | Electronic Controls Design, Inc. | Closed-loop dual-cycle printed circuit board cleaning apparatus and method |
JPH05166773A (ja) * | 1991-12-13 | 1993-07-02 | Fujitsu Ltd | 半導体基板の洗浄方法および装置 |
US5275658A (en) * | 1991-12-13 | 1994-01-04 | Tokyo Electron Limited | Liquid supply apparatus |
US5289222A (en) * | 1992-06-26 | 1994-02-22 | Semiconductor Systems, Inc. | Drain arrangement for photoresist coating apparatus |
-
1994
- 1994-10-13 JP JP6275954A patent/JPH08108125A/ja active Pending
-
1995
- 1995-10-04 US US08/539,265 patent/US5778911A/en not_active Expired - Fee Related
- 1995-10-09 KR KR1019950034513A patent/KR960015776A/ko not_active Application Discontinuation
- 1995-10-13 CN CN95119936A patent/CN1137948A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1137948A (zh) | 1996-12-18 |
US5778911A (en) | 1998-07-14 |
JPH08108125A (ja) | 1996-04-30 |
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