KR920007136A - 와이어본딩방법 및 장치 - Google Patents

와이어본딩방법 및 장치 Download PDF

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KR920007136A
KR920007136A KR1019910015656A KR910015656A KR920007136A KR 920007136 A KR920007136 A KR 920007136A KR 1019910015656 A KR1019910015656 A KR 1019910015656A KR 910015656 A KR910015656 A KR 910015656A KR 920007136 A KR920007136 A KR 920007136A
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wire
bonding
bonded member
bonded
flat surface
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KR1019910015656A
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KR950009623B1 (ko
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미쓰기요 다니
아끼라 고도
히데아끼 사사끼
히데오 사라이시
다모쓰 기리노
히로시 하세가와
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가나이 오사무
가부시기가이샤 히다찌세이사꾸쇼
우에야마 데쓰로
가부시기가이샤 히다찌콤퓨터일렉트로닉스
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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Abstract

내용 없음

Description

와이어본딩방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 헤드구동장치의 전체구성을 나타내는 사시도.
제2도는 본 발명에 따른 와이어본딩장치의 전체구성을 나타내는 사시도.

Claims (18)

  1. 본딩패드를 갖춘 배선기판을 테이블상에 세트하고, 최소한 일단에 볼이 형성된 와이어를 와이어이송장치에 세트하고 스텝과, 상기 본딩패드와 상기 볼을 용접하기 위한 본딩헤드와 상기 본딩패드의 상대위치를 조정하는 스텝과, 상기 와이어이송장치를 사용하여 상기 볼과 상기 본딩패드를 접촉시키는 스텝과, 상기 본딩헤드를 저속으로 하향이동시켜서 상기 볼을 압착하여 그 볼에 평탄면을 형성하는 스텝과 상기 본딩헤드를 일단 상향이동시키는 스텝과, 상기 와이어이송장치를 사용하여 상기 본딩헤드와 볼의 상대위치를 조정하는 스텝과, 상기 본딩헤드를 하향 이동시켜서 상기 본딩헤드와 볼을 접촉시키고, 상기 볼에 초음파를 인가하여 볼에 열을 가함으로써 상기 볼과 본딩패드를 용접하는 스텝으로 구성되는 것을 특징으로 하는 와이어본딩방법.
  2. 제1항에 있어서, 상기 본딩헤드를 하향이동시켜서 상기 볼을 압착하는 단계에 있어서 상기 본딩패드에 대한 상기 본딩헤드의 상대속도는 0.5m/sec이하인 것을 특징으로 하는 와이어본딩방법.
  3. 제1항에 있어서, 또한 상기 본딩패에 볼이 용접된 상기 와이어의 만곡될 부분을 만곡부지지장치에 의해 지지하여, 상기 와이어의 만곡될 부분을 상기 다층배선기판의 소정위치로 이동시키는 스텝과, 상기 와이어의 용접되지 않은 자유단부를 지그에 의해 이동시켜서, 상기 와이어의 루팅(routing)을 위해 상기 만곡될 부분을 만곡하는 스텝을 더 포함하는 것을 특징으로 하는 와이어본딩방법.
  4. 피본딩부재에 본딩될 와이어의 본딩부를 압착하여 이 본딩부에 평탄면을 형성하고, 상기 와이어의 본딩부의 상기 평탄면을 상기 피본당부재의 소정위치와 정렬하여, 상기 평탄면과 상기 피본딩부재의 소정위치를 접촉시키고, 상기 와이어의 본딩부와 상기 피본딩부재를 용접하는 것을 특징으로 하는 와이어를 피본딩부재에 본딩하는 와이어본딩방법.
  5. 와이어의 일단을 피본딩부재의 소정위치와 정렬하고, 상기 피본딩부쟁 와이어를 용접하기 위한 본딩헤드에 의해 상기 와이어의 일단을 압착하여 상기 와이어의 일단을 평탄면을 형성하고, 상기 와이어의 일단의 상기 평탄면과 상기 피본딩부재의 소정위치를 재정렬하여, 상기 평탄면과 상기 소정위치를 접촉시키고, 상기 본딩부재를 상기 와이어의 일단에 접촉시켜 상기 와이어의 일단과 상기 피본딩부재를 용접하는 것을 특징으로 하는 와이어를 피본딩부재에 본딩하는 와이어본딩방법.
  6. 제5항에 있어서, 상기 본딩헤드와 상기 피본딩부재중 최소한 어느하나를 상기 와이어를 압착하기 위해 이동시킬때 관성력이 거의 발생하지 않도록 0.6m/sec이하의 속도로 이동시키는 것을 특징으로 하는 와이어본딩방법.
  7. 제5항에 있어서, 일단에 평탄면이 미리 형성된 와이어를 정렬하여 상기 평탄면과 상기 피본딩부재의 소정위치를 접촉시키고, 상기 와이어의 일단과 상기 피본딩부재를 용접하는 것을 특징으로 하는 와이어본딩방법.
  8. 제5항에 있어서, 상기 와이어의 일단과 상기 피본딩부재를 용접할 때 최소한 상기 와이어의 일단이 상기 피본딩부재에 대해 이동하지 않도록 상기 와이어를 지지하는 것을 특징으로 하는 와이어본딩방법.
  9. 피본딩부재에 본딩될 와이어의 본딩부에 평탄면을 형성하는 평탄면형성수단과, 상기 와이어와 상기 피본딩 부재중 최소한 어느 하나를 이동시켜서, 상기 와이어의 평탄면과 상기 피본딩부재의 소정위치가 접촉되도록 이들을 정렬하는 정렬수단과, 본딩헤드를 사용하여 상기 와이어의 본딩부와 상기 피본딩부재를 용접하는 수단으로 구성되는 것을 특징으로 하는 와이어를 피본딩부재에 본딩하는 와이어본딩장치.
  10. 와이어의 일단과 피본딩부재를 용접하는 본딩헤드와, 상기 피본딩부재가 위치되는 테이블과, 상기 본딩헤드와 상기 테이블중 최소한 어느 하나를 이동시켜서, 상기 본딩헤드가 상기 테이블상의 상기 피본딩부재에 대향되도록 이들을 정렬하는 정렬수단과, 상기 와이어를 이송하여 상기 와이어의 일단을 상기 피본딩부재의 소정위치에 지지하기 위한 와이어이송수단과, 상기 본딩헤드와 상기 테이블 사이의 스페이스를 가변시켜서, 상기 테이블에 위치된 상기 피본딩부재상에 이송된 와이어의 일단을 압착할 수 있는 스페이스가변수단과, 상기 본딩헤드를 포함하고, 이 본딩헤드를 사용하여 상기 와이어의 일단과 상기 피본딩부재를 용접하는 용접수단으로 구성되는 것을 특징으로 하는 와이어를 피본딩부재에 본딩하는 와이어본딩장치.
  11. 제10항에 있어서, 상기 스페이스가변수단이 상기 와이어의 일단을 압착할 때 스페이스가변수단은 상기 테이블에 대한 상기 본딩헤드의 상대속도가 용접시의 속도보다 느리고, 관성력이 거의 발생되지 않도록 상기 본딩헤드와 상기 테이블을 상대적으로 이동시킬 수 있는 것을 특징으로 하는 와이어본딩장치.
  12. 제11항에 있어서, 상기 상대속도는 0.6m/sec이하인 것을 특징으로 하는 와이어본딩장치.
  13. 제10항에 있어서, 상기 테이블상에 위치된 상기 피본딩부재의 소정위치에 레이저빔을 조사하는 레이저포인터를 구비한 것을 특징으로 하는 와이어본딩장치.
  14. 제10항에 있어서, 상기 와이어의 만곡될 부분이 상기 피본딩부재에 대해 이동되지 않도록 상기 와이어의 만곡될 부분을 지지하는 만곡부지지수단을 구비한 것을 특징으로 하는 와이어본딩장치.
  15. 제14항에 있어서, 상기 와이어의 만곡될 부분의 위치정밀도의 오차는 30㎛이하인 것을 특징으로 하는 와이어본딩장치.
  16. 제14항에 있어서, 상기 와이어이송수단을 상기 와이어를 지지하는 와이어지지수단을 포함하는 것을 특징으로 하는 와이어본딩장치.
  17. 도전성을 가지며, 일단이 평탄면으로 형성되는 것을 특징으로 하는 본딩와이어.
  18. 제17항에 있어서, 상기 일단을 이에 형성된 2개의 평행한 평탄면을 포함하는 것을 특징으로 하는 본딩와이어.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910015656A 1990-09-10 1991-09-09 와이어본딩방법 및 장치 KR950009623B1 (ko)

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JP2239549A JP2549191B2 (ja) 1990-09-10 1990-09-10 ワイヤボンディング方法、およびその装置
JP90-239549 1990-09-10

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JP3005781B2 (ja) * 1992-08-04 2000-02-07 株式会社新川 ワイヤボンデイング装置のモータ制御回路
DE69405209T2 (de) * 1994-03-31 1998-03-19 Sgs Thomson Microelectronics Verbindungsvorrichtung für elektronische Halbleiter-Einheiter
US5731244A (en) 1996-05-28 1998-03-24 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
JP4631138B2 (ja) * 2000-08-07 2011-02-16 日本電気株式会社 ワイヤボンディング装置
US6892927B2 (en) * 2003-04-24 2005-05-17 Intel Corporation Method and apparatus for bonding a wire to a bond pad on a device
US20060186179A1 (en) * 2005-02-23 2006-08-24 Levine Lee R Apparatus and method for bonding wires
CN102642077B (zh) * 2012-04-13 2015-07-22 精进百思特电动（上海）有限公司 一种超声波端子焊接机
CN103658905A (zh) * 2012-08-30 2014-03-26 深圳市易迈克实业有限公司 一种自动焊接设备
KR102332484B1 (ko) * 2021-04-27 2021-12-01 주식회사 로텍 팬케?? 타입의 슬립링용 브러쉬 및 그 제조방법
CN114131169B (zh) * 2021-11-26 2022-08-23 深圳市鸿光盛业电子有限公司 一种自动封装芯片的热压键合专用设备

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KR950009623B1 (ko) 1995-08-25
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JPH04118942A (ja) 1992-04-20
DE4129933C2 (de) 1996-10-17

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