JPS55141736A - Method for wirebonding and wirebonder - Google Patents

Method for wirebonding and wirebonder

Info

Publication number
JPS55141736A
JPS55141736A JP4902779A JP4902779A JPS55141736A JP S55141736 A JPS55141736 A JP S55141736A JP 4902779 A JP4902779 A JP 4902779A JP 4902779 A JP4902779 A JP 4902779A JP S55141736 A JPS55141736 A JP S55141736A
Authority
JP
Japan
Prior art keywords
wedge
memory
descending
speed
wirebonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4902779A
Other languages
Japanese (ja)
Other versions
JPS6341215B2 (en
Inventor
Kazuhisa Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4902779A priority Critical patent/JPS55141736A/en
Priority to GB8013084A priority patent/GB2047596A/en
Priority to DE19803015683 priority patent/DE3015683A1/en
Publication of JPS55141736A publication Critical patent/JPS55141736A/en
Publication of JPS6341215B2 publication Critical patent/JPS6341215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0555—Shape
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To shorten the descending time of a wedge and to increase the bonding speed by measuring the standard position of the wedge beforehand with respect to the individual body to be bonded, and by determining the range of low-speed descending operation.
CONSTITUTION: A wedge is descended and contacted with a pad electrode and leads. The contact is detected by a wedge contact detector 10, and the output from a rotary encoder 12 is stored in a memory 14. Then, the low-speed operation range while the wedge is descending to the pad electrode and the leads is decreased. Based on the result, the up-and-down profile is determined. The result is stored in the memory 14. Then, the signal which follows the up-and-down profile of the wedge is output from the memory to drive a motor 6, thereby wirebonding is performed.
COPYRIGHT: (C)1980,JPO&Japio
JP4902779A 1979-04-23 1979-04-23 Method for wirebonding and wirebonder Granted JPS55141736A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4902779A JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder
GB8013084A GB2047596A (en) 1979-04-23 1980-04-21 Method of wire-bonding and wire-bonder
DE19803015683 DE3015683A1 (en) 1979-04-23 1980-04-23 MICRO WELDING METHOD AND DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4902779A JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60212495A Division JPS6193638A (en) 1985-09-27 1985-09-27 Wire bonder

Publications (2)

Publication Number Publication Date
JPS55141736A true JPS55141736A (en) 1980-11-05
JPS6341215B2 JPS6341215B2 (en) 1988-08-16

Family

ID=12819608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4902779A Granted JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Country Status (3)

Country Link
JP (1) JPS55141736A (en)
DE (1) DE3015683A1 (en)
GB (1) GB2047596A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
KR880701152A (en) * 1986-05-16 1988-07-25 파라사트 파하드 Manual Wire Bonding Device
JP2755667B2 (en) * 1989-03-27 1998-05-20 株式会社東芝 Motor drive circuit and wire bonding device
JP2549191B2 (en) * 1990-09-10 1996-10-30 株式会社日立製作所 Wire bonding method and apparatus thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method

Also Published As

Publication number Publication date
JPS6341215B2 (en) 1988-08-16
GB2047596A (en) 1980-12-03
DE3015683A1 (en) 1980-11-13

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