CN114131169B - 一种自动封装芯片的热压键合专用设备 - Google Patents
一种自动封装芯片的热压键合专用设备 Download PDFInfo
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- CN114131169B CN114131169B CN202111421487.7A CN202111421487A CN114131169B CN 114131169 B CN114131169 B CN 114131169B CN 202111421487 A CN202111421487 A CN 202111421487A CN 114131169 B CN114131169 B CN 114131169B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Basic Packing Technique (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111421487.7A CN114131169B (zh) | 2021-11-26 | 2021-11-26 | 一种自动封装芯片的热压键合专用设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202111421487.7A CN114131169B (zh) | 2021-11-26 | 2021-11-26 | 一种自动封装芯片的热压键合专用设备 |
Publications (2)
Publication Number | Publication Date |
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CN114131169A CN114131169A (zh) | 2022-03-04 |
CN114131169B true CN114131169B (zh) | 2022-08-23 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202111421487.7A Active CN114131169B (zh) | 2021-11-26 | 2021-11-26 | 一种自动封装芯片的热压键合专用设备 |
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CN (1) | CN114131169B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5251805A (en) * | 1990-09-10 | 1993-10-12 | Hitachi, Ltd. | Wire bonding method and apparatus |
CN103311165A (zh) * | 2012-08-03 | 2013-09-18 | 铜陵三佳山田科技有限公司 | 一种用于半导体引线框架的无损送料装置 |
CN204303871U (zh) * | 2014-12-11 | 2015-04-29 | 浙江亿谷电子科技有限公司 | 一种热电发电芯片自动烫压封装机 |
CN206657800U (zh) * | 2017-04-19 | 2017-11-21 | 深圳市奥赛瑞科技有限公司 | 全自动粘片键合设备 |
WO2019066722A1 (en) * | 2017-09-28 | 2019-04-04 | Rokko Systems Pte Ltd | SYSTEM AND METHOD FOR RETURN CHIP MOUNTING |
CN112216669A (zh) * | 2020-09-10 | 2021-01-12 | 安徽龙芯微科技有限公司 | 一种高稳定性的封装引线框架及封装件生产方法 |
CN212740042U (zh) * | 2019-12-07 | 2021-03-19 | 唐山海泰新能科技股份有限公司 | 一种可微调的焊带贴膜装置 |
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2021
- 2021-11-26 CN CN202111421487.7A patent/CN114131169B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5251805A (en) * | 1990-09-10 | 1993-10-12 | Hitachi, Ltd. | Wire bonding method and apparatus |
CN103311165A (zh) * | 2012-08-03 | 2013-09-18 | 铜陵三佳山田科技有限公司 | 一种用于半导体引线框架的无损送料装置 |
CN204303871U (zh) * | 2014-12-11 | 2015-04-29 | 浙江亿谷电子科技有限公司 | 一种热电发电芯片自动烫压封装机 |
CN206657800U (zh) * | 2017-04-19 | 2017-11-21 | 深圳市奥赛瑞科技有限公司 | 全自动粘片键合设备 |
WO2019066722A1 (en) * | 2017-09-28 | 2019-04-04 | Rokko Systems Pte Ltd | SYSTEM AND METHOD FOR RETURN CHIP MOUNTING |
CN212740042U (zh) * | 2019-12-07 | 2021-03-19 | 唐山海泰新能科技股份有限公司 | 一种可微调的焊带贴膜装置 |
CN112216669A (zh) * | 2020-09-10 | 2021-01-12 | 安徽龙芯微科技有限公司 | 一种高稳定性的封装引线框架及封装件生产方法 |
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Effective date of registration: 20220803 Address after: B2301, block B, Zhantao science and technology building, intersection of Minzhi Avenue and Gongye East Road, Xinniu community, Minzhi street, Longhua District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Hongguang Shengye Electronics Co.,Ltd. Address before: 518000 Guangdong province Shenzhen Baoan District Sha Jing Street Post Pavilion community Post Pavilion Maoshan Industrial Park Arts crafts emporium, all science and Technology Innovation Park, Chuang Chuang building 20 story F Applicant before: SHENZHEN XIANJIN CONNECTION TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20221114 Address after: 518000 Guangdong province Shenzhen Baoan District Sha Jing Street Post Pavilion community Post Pavilion Maoshan Industrial Park Arts crafts emporium, all science and Technology Innovation Park, Chuang Chuang building 20 story F Patentee after: SHENZHEN XIANJIN CONNECTION TECHNOLOGY Co.,Ltd. Address before: B2301, block B, Zhantao science and technology building, intersection of Minzhi Avenue and Gongye East Road, Xinniu community, Minzhi street, Longhua District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Hongguang Shengye Electronics Co.,Ltd. |