KR920003347A - 반도체 장치의 캐패시터용 유전체 - Google Patents

반도체 장치의 캐패시터용 유전체 Download PDF

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Publication number
KR920003347A
KR920003347A KR1019900009966A KR900009966A KR920003347A KR 920003347 A KR920003347 A KR 920003347A KR 1019900009966 A KR1019900009966 A KR 1019900009966A KR 900009966 A KR900009966 A KR 900009966A KR 920003347 A KR920003347 A KR 920003347A
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KR
South Korea
Prior art keywords
dielectrics
capacitors
semiconductor devices
dielectric
semiconductor device
Prior art date
Application number
KR1019900009966A
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English (en)
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KR930003790B1 (ko
Inventor
이상인
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019900009966A priority Critical patent/KR930003790B1/ko
Priority to GB9020659A priority patent/GB2245760A/en
Priority to US07/637,314 priority patent/US5124777A/en
Priority to JP3169143A priority patent/JPH04272610A/ja
Publication of KR920003347A publication Critical patent/KR920003347A/ko
Application granted granted Critical
Publication of KR930003790B1 publication Critical patent/KR930003790B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1254Ceramic dielectrics characterised by the ceramic dielectric material based on niobium or tungsteen, tantalum oxides or niobates, tantalates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Insulating Materials (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

내용 없음

Description

반도체 장치의 캐패시터용 유전체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 (SrO.25 BaO.75)-y Lay Nb 206에서의 La203첨가량에 따른 유전상수의 온도특성을 나타낸 도면.
제2도는 투과전자현미경으로 촬영한 (SrO.25 BaO.75)Nb206의 결정면을 나타낸 도면.
제3도와 제4도는 투과 전자현미경으로 촬영한 (SrO.25 BaO.75)0.94 Lao.04 Nb 206의 결정면을 나타낸 도면이다.

Claims (2)

  1. (Sr,Ba) Nb 206에 La203를 2몰%이상 첨가시켜 Sr과 Ba를 La로 치환시킴으로써 (Srx Bal-x)1-y Lay Nb 206(0.25≤x≤0.5, 0.04≤y)의 조성을 갖는 것을 특징으로하는 반도체 장치의 캐패시터용 유전체.
  2. 제1항에 있어서, 상기 유전체를 사용하여 제조된 박막의 캐패시터층을 구비한 것을 특징으로하는 반도체 소자.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900009966A 1990-07-02 1990-07-02 반도체 장치의 캐패시터용 유전체 KR930003790B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019900009966A KR930003790B1 (ko) 1990-07-02 1990-07-02 반도체 장치의 캐패시터용 유전체
GB9020659A GB2245760A (en) 1990-07-02 1990-09-21 Dielectric medium for capacitor
US07/637,314 US5124777A (en) 1990-07-02 1991-01-03 Dielectric medium for capacitor of semiconductor device
JP3169143A JPH04272610A (ja) 1990-07-02 1991-06-14 半導体装置のキャパシタ用誘電体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900009966A KR930003790B1 (ko) 1990-07-02 1990-07-02 반도체 장치의 캐패시터용 유전체

Publications (2)

Publication Number Publication Date
KR920003347A true KR920003347A (ko) 1992-02-29
KR930003790B1 KR930003790B1 (ko) 1993-05-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900009966A KR930003790B1 (ko) 1990-07-02 1990-07-02 반도체 장치의 캐패시터용 유전체

Country Status (4)

Country Link
US (1) US5124777A (ko)
JP (1) JPH04272610A (ko)
KR (1) KR930003790B1 (ko)
GB (1) GB2245760A (ko)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5502488A (en) * 1991-05-07 1996-03-26 Olympus Optical Co., Ltd. Solid-state imaging device having a low impedance structure
US5307169A (en) * 1991-05-07 1994-04-26 Olympus Optical Co., Ltd. Solid-state imaging device using high relative dielectric constant material as insulating film
JPH0685173A (ja) * 1992-07-17 1994-03-25 Toshiba Corp 半導体集積回路用キャパシタ
US5888585A (en) * 1996-02-08 1999-03-30 Symetrix Corporation Process for making an integrated circuit with high dielectric constant barium-strontium-niobium oxide
JP3996767B2 (ja) * 1999-06-10 2007-10-24 シメトリックス・コーポレーション 集積回路及び集積回路の形成方法
US6495878B1 (en) * 1999-08-02 2002-12-17 Symetrix Corporation Interlayer oxide containing thin films for high dielectric constant application
KR100333669B1 (ko) 1999-06-28 2002-04-24 박종섭 레드니오비움지르코니움타이타니트 용액 형성 방법 및 그를 이용한 강유전체 캐패시터 제조 방법
US7358121B2 (en) * 2002-08-23 2008-04-15 Intel Corporation Tri-gate devices and methods of fabrication
US6909151B2 (en) * 2003-06-27 2005-06-21 Intel Corporation Nonplanar device with stress incorporation layer and method of fabrication
US7456476B2 (en) * 2003-06-27 2008-11-25 Intel Corporation Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication
US7105390B2 (en) * 2003-12-30 2006-09-12 Intel Corporation Nonplanar transistors with metal gate electrodes
US7268058B2 (en) * 2004-01-16 2007-09-11 Intel Corporation Tri-gate transistors and methods to fabricate same
US7154118B2 (en) * 2004-03-31 2006-12-26 Intel Corporation Bulk non-planar transistor having strained enhanced mobility and methods of fabrication
US7579280B2 (en) * 2004-06-01 2009-08-25 Intel Corporation Method of patterning a film
US7042009B2 (en) * 2004-06-30 2006-05-09 Intel Corporation High mobility tri-gate devices and methods of fabrication
US7348284B2 (en) * 2004-08-10 2008-03-25 Intel Corporation Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow
US7071064B2 (en) * 2004-09-23 2006-07-04 Intel Corporation U-gate transistors and methods of fabrication
US7332439B2 (en) * 2004-09-29 2008-02-19 Intel Corporation Metal gate transistors with epitaxial source and drain regions
US7422946B2 (en) 2004-09-29 2008-09-09 Intel Corporation Independently accessed double-gate and tri-gate transistors in same process flow
US7361958B2 (en) 2004-09-30 2008-04-22 Intel Corporation Nonplanar transistors with metal gate electrodes
US20060086977A1 (en) 2004-10-25 2006-04-27 Uday Shah Nonplanar device with thinned lower body portion and method of fabrication
US7193279B2 (en) * 2005-01-18 2007-03-20 Intel Corporation Non-planar MOS structure with a strained channel region
US7518196B2 (en) 2005-02-23 2009-04-14 Intel Corporation Field effect transistor with narrow bandgap source and drain regions and method of fabrication
US20060202266A1 (en) 2005-03-14 2006-09-14 Marko Radosavljevic Field effect transistor with metal source/drain regions
US7858481B2 (en) 2005-06-15 2010-12-28 Intel Corporation Method for fabricating transistor with thinned channel
US7547637B2 (en) 2005-06-21 2009-06-16 Intel Corporation Methods for patterning a semiconductor film
US7279375B2 (en) * 2005-06-30 2007-10-09 Intel Corporation Block contact architectures for nanoscale channel transistors
US7402875B2 (en) 2005-08-17 2008-07-22 Intel Corporation Lateral undercut of metal gate in SOI device
US20070090416A1 (en) 2005-09-28 2007-04-26 Doyle Brian S CMOS devices with a single work function gate electrode and method of fabrication
US7479421B2 (en) 2005-09-28 2009-01-20 Intel Corporation Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby
US7485503B2 (en) 2005-11-30 2009-02-03 Intel Corporation Dielectric interface for group III-V semiconductor device
US7396711B2 (en) * 2005-12-27 2008-07-08 Intel Corporation Method of fabricating a multi-cornered film
US7449373B2 (en) * 2006-03-31 2008-11-11 Intel Corporation Method of ion implanting for tri-gate devices
US7670928B2 (en) * 2006-06-14 2010-03-02 Intel Corporation Ultra-thin oxide bonding for S1 to S1 dual orientation bonding
US8143646B2 (en) 2006-08-02 2012-03-27 Intel Corporation Stacking fault and twin blocking barrier for integrating III-V on Si
ES2489615T3 (es) * 2007-12-11 2014-09-02 Apoteknos Para La Piel, S.L. Uso de un compuesto derivado del acido p-hidroxifenil propionico para el tratamiento de la psoriasis
US8362566B2 (en) 2008-06-23 2013-01-29 Intel Corporation Stress in trigate devices using complimentary gate fill materials
JP6249004B2 (ja) * 2015-10-06 2017-12-20 Tdk株式会社 誘電体組成物および電子部品
KR102598752B1 (ko) * 2018-05-30 2023-11-03 삼성전자주식회사 유전 복합체, 및 이를 포함하는 적층형 커패시터 및 전자 소자
KR102608243B1 (ko) * 2018-07-23 2023-11-29 삼성전자주식회사 세라믹 유전체, 세라믹 전자 부품 및 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1466387A (en) * 1973-06-29 1977-03-09 Honeywell Inc Ferro-electric material
US4403236A (en) * 1979-10-09 1983-09-06 Murata Manufacturing Co., Ltd. Boundary layer type semiconducting ceramic capacitors with high capacitance
JPS5923043A (ja) * 1982-07-28 1984-02-06 Hino Motors Ltd 車両に使用されるエア・アクセル・コントロ−ル系統
US4631633A (en) * 1985-12-23 1986-12-23 North American Philips Corporation Thin film capacitors and method of making the same

Also Published As

Publication number Publication date
US5124777A (en) 1992-06-23
GB2245760A (en) 1992-01-08
GB9020659D0 (en) 1990-10-31
KR930003790B1 (ko) 1993-05-10
JPH04272610A (ja) 1992-09-29

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