KR920003347A - 반도체 장치의 캐패시터용 유전체 - Google Patents
반도체 장치의 캐패시터용 유전체 Download PDFInfo
- Publication number
- KR920003347A KR920003347A KR1019900009966A KR900009966A KR920003347A KR 920003347 A KR920003347 A KR 920003347A KR 1019900009966 A KR1019900009966 A KR 1019900009966A KR 900009966 A KR900009966 A KR 900009966A KR 920003347 A KR920003347 A KR 920003347A
- Authority
- KR
- South Korea
- Prior art keywords
- dielectrics
- capacitors
- semiconductor devices
- dielectric
- semiconductor device
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims 3
- 239000004065 semiconductor Substances 0.000 title claims 3
- 239000003989 dielectric material Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1254—Ceramic dielectrics characterised by the ceramic dielectric material based on niobium or tungsteen, tantalum oxides or niobates, tantalates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Insulating Materials (AREA)
- Semiconductor Integrated Circuits (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 (SrO.25 BaO.75)-y Lay Nb 206에서의 La203첨가량에 따른 유전상수의 온도특성을 나타낸 도면.
제2도는 투과전자현미경으로 촬영한 (SrO.25 BaO.75)Nb206의 결정면을 나타낸 도면.
제3도와 제4도는 투과 전자현미경으로 촬영한 (SrO.25 BaO.75)0.94 Lao.04 Nb 206의 결정면을 나타낸 도면이다.
Claims (2)
- (Sr,Ba) Nb 206에 La203를 2몰%이상 첨가시켜 Sr과 Ba를 La로 치환시킴으로써 (Srx Bal-x)1-y Lay Nb 206(0.25≤x≤0.5, 0.04≤y)의 조성을 갖는 것을 특징으로하는 반도체 장치의 캐패시터용 유전체.
- 제1항에 있어서, 상기 유전체를 사용하여 제조된 박막의 캐패시터층을 구비한 것을 특징으로하는 반도체 소자.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900009966A KR930003790B1 (ko) | 1990-07-02 | 1990-07-02 | 반도체 장치의 캐패시터용 유전체 |
GB9020659A GB2245760A (en) | 1990-07-02 | 1990-09-21 | Dielectric medium for capacitor |
US07/637,314 US5124777A (en) | 1990-07-02 | 1991-01-03 | Dielectric medium for capacitor of semiconductor device |
JP3169143A JPH04272610A (ja) | 1990-07-02 | 1991-06-14 | 半導体装置のキャパシタ用誘電体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900009966A KR930003790B1 (ko) | 1990-07-02 | 1990-07-02 | 반도체 장치의 캐패시터용 유전체 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920003347A true KR920003347A (ko) | 1992-02-29 |
KR930003790B1 KR930003790B1 (ko) | 1993-05-10 |
Family
ID=19300800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900009966A KR930003790B1 (ko) | 1990-07-02 | 1990-07-02 | 반도체 장치의 캐패시터용 유전체 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5124777A (ko) |
JP (1) | JPH04272610A (ko) |
KR (1) | KR930003790B1 (ko) |
GB (1) | GB2245760A (ko) |
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US5502488A (en) * | 1991-05-07 | 1996-03-26 | Olympus Optical Co., Ltd. | Solid-state imaging device having a low impedance structure |
US5307169A (en) * | 1991-05-07 | 1994-04-26 | Olympus Optical Co., Ltd. | Solid-state imaging device using high relative dielectric constant material as insulating film |
JPH0685173A (ja) * | 1992-07-17 | 1994-03-25 | Toshiba Corp | 半導体集積回路用キャパシタ |
US5888585A (en) * | 1996-02-08 | 1999-03-30 | Symetrix Corporation | Process for making an integrated circuit with high dielectric constant barium-strontium-niobium oxide |
JP3996767B2 (ja) * | 1999-06-10 | 2007-10-24 | シメトリックス・コーポレーション | 集積回路及び集積回路の形成方法 |
US6495878B1 (en) * | 1999-08-02 | 2002-12-17 | Symetrix Corporation | Interlayer oxide containing thin films for high dielectric constant application |
KR100333669B1 (ko) | 1999-06-28 | 2002-04-24 | 박종섭 | 레드니오비움지르코니움타이타니트 용액 형성 방법 및 그를 이용한 강유전체 캐패시터 제조 방법 |
US7358121B2 (en) * | 2002-08-23 | 2008-04-15 | Intel Corporation | Tri-gate devices and methods of fabrication |
US6909151B2 (en) * | 2003-06-27 | 2005-06-21 | Intel Corporation | Nonplanar device with stress incorporation layer and method of fabrication |
US7456476B2 (en) * | 2003-06-27 | 2008-11-25 | Intel Corporation | Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication |
US7105390B2 (en) * | 2003-12-30 | 2006-09-12 | Intel Corporation | Nonplanar transistors with metal gate electrodes |
US7268058B2 (en) * | 2004-01-16 | 2007-09-11 | Intel Corporation | Tri-gate transistors and methods to fabricate same |
US7154118B2 (en) * | 2004-03-31 | 2006-12-26 | Intel Corporation | Bulk non-planar transistor having strained enhanced mobility and methods of fabrication |
US7579280B2 (en) * | 2004-06-01 | 2009-08-25 | Intel Corporation | Method of patterning a film |
US7042009B2 (en) * | 2004-06-30 | 2006-05-09 | Intel Corporation | High mobility tri-gate devices and methods of fabrication |
US7348284B2 (en) * | 2004-08-10 | 2008-03-25 | Intel Corporation | Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow |
US7071064B2 (en) * | 2004-09-23 | 2006-07-04 | Intel Corporation | U-gate transistors and methods of fabrication |
US7332439B2 (en) * | 2004-09-29 | 2008-02-19 | Intel Corporation | Metal gate transistors with epitaxial source and drain regions |
US7422946B2 (en) | 2004-09-29 | 2008-09-09 | Intel Corporation | Independently accessed double-gate and tri-gate transistors in same process flow |
US7361958B2 (en) | 2004-09-30 | 2008-04-22 | Intel Corporation | Nonplanar transistors with metal gate electrodes |
US20060086977A1 (en) | 2004-10-25 | 2006-04-27 | Uday Shah | Nonplanar device with thinned lower body portion and method of fabrication |
US7193279B2 (en) * | 2005-01-18 | 2007-03-20 | Intel Corporation | Non-planar MOS structure with a strained channel region |
US7518196B2 (en) | 2005-02-23 | 2009-04-14 | Intel Corporation | Field effect transistor with narrow bandgap source and drain regions and method of fabrication |
US20060202266A1 (en) | 2005-03-14 | 2006-09-14 | Marko Radosavljevic | Field effect transistor with metal source/drain regions |
US7858481B2 (en) | 2005-06-15 | 2010-12-28 | Intel Corporation | Method for fabricating transistor with thinned channel |
US7547637B2 (en) | 2005-06-21 | 2009-06-16 | Intel Corporation | Methods for patterning a semiconductor film |
US7279375B2 (en) * | 2005-06-30 | 2007-10-09 | Intel Corporation | Block contact architectures for nanoscale channel transistors |
US7402875B2 (en) | 2005-08-17 | 2008-07-22 | Intel Corporation | Lateral undercut of metal gate in SOI device |
US20070090416A1 (en) | 2005-09-28 | 2007-04-26 | Doyle Brian S | CMOS devices with a single work function gate electrode and method of fabrication |
US7479421B2 (en) | 2005-09-28 | 2009-01-20 | Intel Corporation | Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby |
US7485503B2 (en) | 2005-11-30 | 2009-02-03 | Intel Corporation | Dielectric interface for group III-V semiconductor device |
US7396711B2 (en) * | 2005-12-27 | 2008-07-08 | Intel Corporation | Method of fabricating a multi-cornered film |
US7449373B2 (en) * | 2006-03-31 | 2008-11-11 | Intel Corporation | Method of ion implanting for tri-gate devices |
US7670928B2 (en) * | 2006-06-14 | 2010-03-02 | Intel Corporation | Ultra-thin oxide bonding for S1 to S1 dual orientation bonding |
US8143646B2 (en) | 2006-08-02 | 2012-03-27 | Intel Corporation | Stacking fault and twin blocking barrier for integrating III-V on Si |
ES2489615T3 (es) * | 2007-12-11 | 2014-09-02 | Apoteknos Para La Piel, S.L. | Uso de un compuesto derivado del acido p-hidroxifenil propionico para el tratamiento de la psoriasis |
US8362566B2 (en) | 2008-06-23 | 2013-01-29 | Intel Corporation | Stress in trigate devices using complimentary gate fill materials |
JP6249004B2 (ja) * | 2015-10-06 | 2017-12-20 | Tdk株式会社 | 誘電体組成物および電子部品 |
KR102598752B1 (ko) * | 2018-05-30 | 2023-11-03 | 삼성전자주식회사 | 유전 복합체, 및 이를 포함하는 적층형 커패시터 및 전자 소자 |
KR102608243B1 (ko) * | 2018-07-23 | 2023-11-29 | 삼성전자주식회사 | 세라믹 유전체, 세라믹 전자 부품 및 장치 |
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GB1466387A (en) * | 1973-06-29 | 1977-03-09 | Honeywell Inc | Ferro-electric material |
US4403236A (en) * | 1979-10-09 | 1983-09-06 | Murata Manufacturing Co., Ltd. | Boundary layer type semiconducting ceramic capacitors with high capacitance |
JPS5923043A (ja) * | 1982-07-28 | 1984-02-06 | Hino Motors Ltd | 車両に使用されるエア・アクセル・コントロ−ル系統 |
US4631633A (en) * | 1985-12-23 | 1986-12-23 | North American Philips Corporation | Thin film capacitors and method of making the same |
-
1990
- 1990-07-02 KR KR1019900009966A patent/KR930003790B1/ko not_active IP Right Cessation
- 1990-09-21 GB GB9020659A patent/GB2245760A/en not_active Withdrawn
-
1991
- 1991-01-03 US US07/637,314 patent/US5124777A/en not_active Expired - Lifetime
- 1991-06-14 JP JP3169143A patent/JPH04272610A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US5124777A (en) | 1992-06-23 |
GB2245760A (en) | 1992-01-08 |
GB9020659D0 (en) | 1990-10-31 |
KR930003790B1 (ko) | 1993-05-10 |
JPH04272610A (ja) | 1992-09-29 |
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