KR920002780B1 - 화학선에 의한 상이 피복방법 - Google Patents

화학선에 의한 상이 피복방법 Download PDF

Info

Publication number
KR920002780B1
KR920002780B1 KR1019860010889A KR860010889A KR920002780B1 KR 920002780 B1 KR920002780 B1 KR 920002780B1 KR 1019860010889 A KR1019860010889 A KR 1019860010889A KR 860010889 A KR860010889 A KR 860010889A KR 920002780 B1 KR920002780 B1 KR 920002780B1
Authority
KR
South Korea
Prior art keywords
composition
printed circuit
circuit board
epoxycyclohexylmethyl
diepoxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860010889A
Other languages
English (en)
Korean (ko)
Other versions
KR870006820A (ko
Inventor
빅터 콜레스크 죠셉
Original Assignee
유니온 카바이드 코포레이션
티모디 엔. 비숍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유니온 카바이드 코포레이션, 티모디 엔. 비숍 filed Critical 유니온 카바이드 코포레이션
Publication of KR870006820A publication Critical patent/KR870006820A/ko
Application granted granted Critical
Publication of KR920002780B1 publication Critical patent/KR920002780B1/ko
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/10Epoxy resins modified by unsaturated compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872Insulating conformal coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/913Material designed to be responsive to temperature, light, moisture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1019860010889A 1985-12-19 1986-12-18 화학선에 의한 상이 피복방법 Expired KR920002780B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US81075885A 1985-12-19 1985-12-19
US810,758 1985-12-19
US810758 1985-12-19

Publications (2)

Publication Number Publication Date
KR870006820A KR870006820A (ko) 1987-07-14
KR920002780B1 true KR920002780B1 (ko) 1992-04-03

Family

ID=25204631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860010889A Expired KR920002780B1 (ko) 1985-12-19 1986-12-18 화학선에 의한 상이 피복방법

Country Status (8)

Country Link
US (2) US5043221A (enExample)
EP (1) EP0233358B1 (enExample)
JP (1) JPS62230861A (enExample)
KR (1) KR920002780B1 (enExample)
CA (1) CA1312040C (enExample)
DE (1) DE3686941T2 (enExample)
MX (1) MX174472B (enExample)
ZA (1) ZA869519B (enExample)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0276716A3 (en) * 1987-01-30 1989-07-26 General Electric Company Uv curable epoxy resin compositions with delayed cure
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
JPH05110233A (ja) * 1991-10-15 1993-04-30 Cmk Corp プリント配線板の製造方法
US5248752A (en) * 1991-11-12 1993-09-28 Union Carbide Chemicals & Plastics Technology Corporation Polyurethane (meth)acrylates and processes for preparing same
US5667856A (en) * 1992-01-24 1997-09-16 Revlon Consumer Products Corporation Radiation curable pigmented compositions and decorated substrates
US5487927A (en) * 1992-01-24 1996-01-30 Revlon Consumer Products Corporation Decorating method and products
ES2087815B1 (es) * 1993-10-13 1997-02-16 Mecanismos Aux Ind Mejoras introducidas en la patente de invencion n- 9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.
EP0650315A3 (de) * 1993-10-23 1995-06-21 Leonische Drahtwerke Ag Elektrisches Steuergerät, insbesondere zum Einbau in Kraftfahrzeuge.
EP0653763A1 (en) * 1993-11-17 1995-05-17 SOPHIA SYSTEMS Co., Ltd. Ultraviolet hardenable, solventless conductive polymeric material
TW307791B (enExample) * 1994-02-09 1997-06-11 Ciba Sc Holding Ag
US5856373A (en) * 1994-10-31 1999-01-05 Minnesota Mining And Manufacturing Company Dental visible light curable epoxy system with enhanced depth of cure
US5527660A (en) * 1994-11-30 1996-06-18 Polaroid Corporation Laminar imaging medium utilizing hydrophobic cycloaliphatic polyepoxide in the fracturable layers
JP3638660B2 (ja) * 1995-05-01 2005-04-13 松下電器産業株式会社 感光性樹脂組成物、それを用いたサンドブラスト用感光性ドライフィルム及びそれを用いた食刻方法
US5877229A (en) * 1995-07-26 1999-03-02 Lockheed Martin Energy Systems, Inc. High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators
FR2740608B1 (fr) * 1995-10-25 1997-12-19 Giat Ind Sa Procede pour deposer un revetement de protection sur les composants d'une carte electronique
TW475098B (en) * 1995-10-27 2002-02-01 Tokyo Ohka Kogyo Co Ltd Photosensitive resin composition and photosensitive resin laminated film containing the same
US5729185A (en) * 1996-04-29 1998-03-17 Motorola Inc. Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal
US6008266A (en) * 1996-08-14 1999-12-28 International Business Machines Corporation Photosensitive reworkable encapsulant
JP3786480B2 (ja) * 1996-10-14 2006-06-14 Jsr株式会社 光硬化性樹脂組成物
US20010014399A1 (en) * 1997-02-26 2001-08-16 Stanley J. Jasne Conductive uv-curable epoxy formulations
US6277898B1 (en) * 1997-05-21 2001-08-21 Denovus Llc Curable sealant composition
US6174932B1 (en) * 1998-05-20 2001-01-16 Denovus Llc Curable sealant composition
US6858260B2 (en) 1997-05-21 2005-02-22 Denovus Llc Curable sealant composition
US5879859A (en) * 1997-07-16 1999-03-09 International Business Machines Corporation Strippable photoimageable compositions
US7320829B2 (en) 1998-03-05 2008-01-22 Omnova Solutions Inc. Fluorinated polymer and amine resin compositions and products formed therefrom
US6383651B1 (en) 1998-03-05 2002-05-07 Omnova Solutions Inc. Polyester with partially fluorinated side chains
US6686051B1 (en) 1998-03-05 2004-02-03 Omnova Solutions Inc. Cured polyesters containing fluorinated side chains
WO1999045079A1 (en) * 1998-03-05 1999-09-10 Omnova Solutions Inc. Easily cleanable polymer laminates
US6174967B1 (en) 1998-03-20 2001-01-16 Ndsu-Research Foundation Composition of epoxy resin and (cyclo)alkoxy-substituted organosilane
US20060154175A9 (en) * 1998-07-10 2006-07-13 Lawton John A Solid imaging compositions for preparing polypropylene-like articles
US6379866B2 (en) 2000-03-31 2002-04-30 Dsm Desotech Inc Solid imaging compositions for preparing polypropylene-like articles
US6287748B1 (en) 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
US6762002B2 (en) 1998-07-10 2004-07-13 Dsm Desotech, Inc. Solid imaging compositions for preparing polypropylene-like articles
WO2000048044A1 (fr) * 1999-02-15 2000-08-17 Clariant International Ltd. Composition de resine photosensible
US6673889B1 (en) * 1999-06-28 2004-01-06 Omnova Solutions Inc. Radiation curable coating containing polyfuorooxetane
US6403760B1 (en) 1999-12-28 2002-06-11 Omnova Solutions Inc. Monohydric polyfluorooxetane polymer and radiation curable coatings containing a monofunctional polyfluorooxetane polymer
US6962966B2 (en) 1999-12-28 2005-11-08 Omnova Solutions Inc. Monohydric polyfluorooxetane oligomers, polymers, and copolymers and coatings containing the same
US6465565B1 (en) 2000-07-06 2002-10-15 Omnova Solutions, Inc. Anionic waterborne polyurethane dispersions containing polyfluorooxetanes
US6465566B2 (en) 2000-07-06 2002-10-15 Omnova Solutions Inc. Anionic waterborne polyurethane dispersions containing polyfluorooxetanes
US6579914B1 (en) 2000-07-14 2003-06-17 Alcatel Coating compositions for optical waveguides and optical waveguides coated therewith
US6716568B1 (en) 2000-09-15 2004-04-06 Microchem Corp. Epoxy photoresist composition with improved cracking resistance
US6660828B2 (en) 2001-05-14 2003-12-09 Omnova Solutions Inc. Fluorinated short carbon atom side chain and polar group containing polymer, and flow, or leveling, or wetting agents thereof
EP1389224B1 (en) * 2001-05-14 2010-01-13 Omnova Soltions Inc Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups
JP2005509707A (ja) * 2001-11-19 2005-04-14 シエル・インターナシヨネイル・リサーチ・マーチヤツピイ・ベー・ウイ 有機化合物のアルコキシル化方法
ES2396118T3 (es) * 2002-02-01 2013-02-19 Saint-Gobain Glass France S.A. Capa barrera hecha de una resina curable que contiene un poliol polimérico
US6850681B2 (en) * 2002-08-22 2005-02-01 Addison Clear Wave, Llc Radiation-curable flame retardant optical fiber coatings
JP3797348B2 (ja) * 2003-02-24 2006-07-19 コニカミノルタホールディングス株式会社 活性エネルギー線硬化組成物
AU2004261560A1 (en) * 2003-07-28 2005-02-10 Valspar Sourcing, Inc. Metal containers having an easily openable end and method of manufacturing the same
BRPI0415812A (pt) * 2003-11-03 2006-12-26 Union Carbide Chem Plastic método para intensificar a resistência de um revestimento sobre um artigo, composição fotocurável e composição de formulação de encapsulante de led curável termicamente
US20050165127A1 (en) * 2003-12-31 2005-07-28 Dsm Desotech, Inc. Solid imaging compositions for preparing polyethylene-like articles
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof
DE102004008365A1 (de) * 2004-02-20 2005-09-08 Altana Electrical Insulation Gmbh Verfahren zur Herstellung von beschichteten elektrischen Drähten
US7449280B2 (en) * 2004-05-26 2008-11-11 Microchem Corp. Photoimageable coating composition and composite article thereof
US7355832B2 (en) * 2004-07-09 2008-04-08 General Electric Company Methods and arrangements for reducing partial discharges on printed circuit boards
CA2493410C (en) * 2005-01-20 2016-09-27 Intelligent Devices Inc. Assembly, production and quality assurance processes respecting electronic compliance monitor (ecm) tags
US20060223937A1 (en) * 2005-04-04 2006-10-05 Herr Donald E Radiation curable cycloaliphatic barrier sealants
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
JP2008007562A (ja) * 2006-06-27 2008-01-17 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いて得られた半導体装置
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP5130950B2 (ja) * 2008-02-22 2013-01-30 Jsr株式会社 プライマー層形成用放射線硬化性組成物、積層体及び金属表面保護膜の形成方法
MX2011001775A (es) 2008-08-18 2011-06-20 Semblant Global Ltd Revestimiento de polimero de halo-hidrocarburo.
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
JP6966014B1 (ja) * 2021-05-17 2021-11-10 東洋インキScホールディングス株式会社 光硬化性上塗り塗料、積層体およびその製造方法、包装容器用部材およびその製造方法、並びに包装容器

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2890194A (en) * 1956-05-24 1959-06-09 Union Carbide Corp Compositions of epoxides and polycarboxylic acid compounds
US4256828A (en) * 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4193799A (en) * 1976-07-09 1980-03-18 General Electric Company Method of making printing plates and printed circuit
US4108747A (en) * 1976-07-14 1978-08-22 General Electric Company Curable compositions and method for curing such compositions
US4130708A (en) * 1977-12-09 1978-12-19 Ppg Industries, Inc. Siloxane urethane acrylate radiation curable compounds for use in coating compositions
US4231951A (en) * 1978-02-08 1980-11-04 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
US4179400A (en) * 1978-05-09 1979-12-18 W. R. Grace & Co. Process for preparing catalytic solutions of sulfonium salts
US4216288A (en) * 1978-09-08 1980-08-05 General Electric Company Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents
US4297401A (en) * 1978-12-26 1981-10-27 Minnesota Mining & Manufacturing Company Liquid crystal display and photopolymerizable sealant therefor
US4250053A (en) * 1979-05-21 1981-02-10 Minnesota Mining And Manufacturing Company Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems
JPS568428A (en) * 1979-06-19 1981-01-28 Ciba Geigy Ag Photopolymerizing and thermopolymerizing composition
US4250203A (en) * 1979-08-30 1981-02-10 American Can Company Cationically polymerizable compositions containing sulfonium salt photoinitiators and odor suppressants and method of polymerization using same
CA1172790A (en) * 1980-11-24 1984-08-14 Gerald M. Leszyk Radiation curable composition including an acrylated urethane, and unsaturated carboxylic acid, a multifunctional acrylate and a siloxy-containing polycarbinol
JPS5874720A (ja) * 1981-10-30 1983-05-06 Hitachi Ltd 耐熱性樹脂の製法
US4426431A (en) * 1982-09-22 1984-01-17 Eastman Kodak Company Radiation-curable compositions for restorative and/or protective treatment of photographic elements
US4593051A (en) * 1983-02-07 1986-06-03 Union Carbide Corporation Photocopolymerizable compositons based on epoxy and polymer/hydroxyl-containing organic materials
US4585534A (en) * 1983-04-29 1986-04-29 Desoto, Inc. Optical glass fiber coated with cationically curable polyepoxide mixtures
US4497687A (en) * 1983-07-28 1985-02-05 Psi Star, Inc. Aqueous process for etching cooper and other metals
JPS6051717A (ja) * 1983-08-31 1985-03-23 Mitsubishi Electric Corp 紫外線硬化型樹脂組成物
JPS6051770A (ja) * 1983-08-31 1985-03-23 Toyo Ink Mfg Co Ltd 光学用接着剤
US4599401A (en) * 1983-10-27 1986-07-08 Union Carbide Corporation Low viscosity adducts of poly(active hydrogen) organic compounds and a polyepoxide

Also Published As

Publication number Publication date
MX174472B (es) 1994-05-18
ZA869519B (en) 1987-08-26
DE3686941D1 (de) 1992-11-12
JPH058948B2 (enExample) 1993-02-03
EP0233358A2 (en) 1987-08-26
KR870006820A (ko) 1987-07-14
CA1312040C (en) 1992-12-29
US5155143A (en) 1992-10-13
DE3686941T2 (de) 1993-02-18
EP0233358A3 (en) 1988-09-14
JPS62230861A (ja) 1987-10-09
EP0233358B1 (en) 1992-10-07
US5043221A (en) 1991-08-27

Similar Documents

Publication Publication Date Title
KR920002780B1 (ko) 화학선에 의한 상이 피복방법
US4820549A (en) Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition
JP3982499B2 (ja) 活性エネルギー線硬化型樹脂組成物およびその硬化物
EP0346486B1 (en) Resin composition and solder resist resin composition
US4892894A (en) Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US5439779A (en) Aqueous soldermask
JPS59147016A (ja) エポキシ含有有機物質の混合物
JPH04355450A (ja) 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JPH05158240A (ja) フォトソルダーレジスト組成物
WO2012039380A1 (ja) インクジェット用硬化性組成物及び電子部品の製造方法
JP2704661B2 (ja) 不飽和基含有ポリカルボン酸樹脂、これを含む樹脂組成物、ソルダーレジスト樹脂組成物及びそれらの硬化物
JP2010107624A (ja) 感光性樹脂組成物およびそれを用いたフレキシブルプリント配線回路基板の製法ならびにカバー絶縁層を有するフレキシブルプリント配線回路基板
JPH0223351A (ja) フォトソルダーレジスト組成物
JPS63312375A (ja) 樹脂組成物及びソルダ−レジスト樹脂組成物
JPH04345673A (ja) ソルダーレジストインキ組成物及びその硬化物
JP2894460B2 (ja) ソルダーレジストインキ組成物及びその硬化物
JP2001240609A (ja) 活性エネルギー線硬化性樹脂組成物
JPH03134075A (ja) 紫外線により硬化される相似被覆剤
JP2540921B2 (ja) 硬化性組成物
JPS5865717A (ja) 活性エネルギ−線硬化性組成物
KR20020064958A (ko) 활성 에너지선 경화성 수지조성물
JP2014055288A (ja) インクジェット用硬化性組成物及び電子部品の製造方法
JPS59199714A (ja) 紫外線硬化組成物
JPH06228253A (ja) 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP3319620B2 (ja) 不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19950404

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19950404

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000