KR870006820A - 화학선에 의한 상이 피복방법 - Google Patents
화학선에 의한 상이 피복방법 Download PDFInfo
- Publication number
- KR870006820A KR870006820A KR860010889A KR860010889A KR870006820A KR 870006820 A KR870006820 A KR 870006820A KR 860010889 A KR860010889 A KR 860010889A KR 860010889 A KR860010889 A KR 860010889A KR 870006820 A KR870006820 A KR 870006820A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- photoinitiator
- epoxide
- surfactant
- parts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/913—Material designed to be responsive to temperature, light, moisture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Polyesters Or Polycarbonates (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (17)
- 하나이상의 옥시란 그룹을 갖는 하나이상의 시클로지방족 에폭사이드 상당량, 하나이상의 폴리에테르폴리올, 광개시제, 임의성분인 계면활성제 및 임의성분인 형광염료로 주로 이루어진 상이(conformal)피복배합물과 지지체를 접촉시키고, 접촉된 지지체를 화확선으로 경화시킨 다음, MIL-1-46058C (AMENDMENT 6)의 조건에 부합하는 일체(integral) 피복물로 피복된 지지체를 회수함을 특징으로 하여, 인쇄회로기판, 금속 및 중합체 지지체를 피복시키는 방법.
- 제1항에 있어서, 상이 피복 배합물이 시클로 지방족 에폭사이드 약 60내지 약 89 중량부, 폴리에테르 폴리올 약 10내지 약 35중량부, 광개시제 약 1내지 약 5중량부, 계면활성제 0내지 약 1중량부 및 형광염료 0내지 약 0.1 중량부로 이루어진 방법.
- 제1항에 있어서, 시클로지방족 에폭사이드가 3,4-에폭시시클로헥실메틸-3,4-에폭시시클로헥산 카복실레이트인 방법.
- 제3항에 있어서, 시클로지방족 에폭사이드가 비스(3,4-에폭시시클로헥실메틸) 아디페이트인 방법.
- 제3항에 있어서, 시클로지방족 에폭사이드가 2-(3,4-에폭시시클로헥실-5,5-스피로-3,4-에폭시)시클로헥산-메타-디옥산인 방법.
- 제1항에 있어서, 에폭사이드가 3,4-에폭시시클로헥실메틸, 3,4-에폭시시클로헥산 카복실레이트 및 4-비닐시클로헥산 모노에폭사이드의 혼합물인 방법.
- 제1항에 있어서, 에폭사이드 성분의 모노에폭사이드 반응성 회석제 50중량 %이하를 함유하는 방법.
- 제1항에 있어서, 폴리에테르 폴리올이 약 600내지 약 3000의 분자량을 갖는 테르라메틸렌 옥사이드 폴리올인 방법.
- 제1항에 있어서, 광개시제가 헥사풀루오로 안티모네이트 오늄염인 방법.
- 제1항에 있어서, 광개시제가 아릴술포늄 헥사플루오로안티모네이트 염인 방법.
- 제1항에 있어서, 계면활성제가 하기 구조식을 갖는 실리콘-에틸렌 옥사이드 공중합체인 방법.
- 제1항에 있어서, 계면활성제가 비이온성 플루오로화된 알킬 에스테르인 방법.
- 제1항에 있어서, 상이 피복 용액이 착색 가능한 양의 형광 염료를 함유하는 방법.
- 제1항에 있어서, 화학선이 자외선인 방법.
- 제1항에 있어서, 화학선이 전자빔인 방법.
- 제1항의 방법에 의해 수득된 일체적으로 피복된 인쇄회로 기판.
- 제1항의 방법에 의해 부분적으로 피복된 인쇄회로 기판.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81075885A | 1985-12-19 | 1985-12-19 | |
US810,758 | 1985-12-19 | ||
US810758 | 1985-12-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870006820A true KR870006820A (ko) | 1987-07-14 |
KR920002780B1 KR920002780B1 (ko) | 1992-04-03 |
Family
ID=25204631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860010889A KR920002780B1 (ko) | 1985-12-19 | 1986-12-18 | 화학선에 의한 상이 피복방법 |
Country Status (8)
Country | Link |
---|---|
US (2) | US5043221A (ko) |
EP (1) | EP0233358B1 (ko) |
JP (1) | JPS62230861A (ko) |
KR (1) | KR920002780B1 (ko) |
CA (1) | CA1312040C (ko) |
DE (1) | DE3686941T2 (ko) |
MX (1) | MX174472B (ko) |
ZA (1) | ZA869519B (ko) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0276716A3 (en) * | 1987-01-30 | 1989-07-26 | General Electric Company | Uv curable epoxy resin compositions with delayed cure |
US5194930A (en) * | 1991-09-16 | 1993-03-16 | International Business Machines | Dielectric composition and solder interconnection structure for its use |
JPH05110233A (ja) * | 1991-10-15 | 1993-04-30 | Cmk Corp | プリント配線板の製造方法 |
US5248752A (en) * | 1991-11-12 | 1993-09-28 | Union Carbide Chemicals & Plastics Technology Corporation | Polyurethane (meth)acrylates and processes for preparing same |
US5667856A (en) * | 1992-01-24 | 1997-09-16 | Revlon Consumer Products Corporation | Radiation curable pigmented compositions and decorated substrates |
US5487927A (en) * | 1992-01-24 | 1996-01-30 | Revlon Consumer Products Corporation | Decorating method and products |
ES2087815B1 (es) * | 1993-10-13 | 1997-02-16 | Mecanismos Aux Ind | Mejoras introducidas en la patente de invencion n- 9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes. |
EP0650315A3 (de) * | 1993-10-23 | 1995-06-21 | Leonische Drahtwerke Ag | Elektrisches Steuergerät, insbesondere zum Einbau in Kraftfahrzeuge. |
JPH07268065A (ja) * | 1993-11-17 | 1995-10-17 | Sophia Syst:Kk | 紫外線硬化型の無溶媒導電性ポリマー材料 |
TW307791B (ko) * | 1994-02-09 | 1997-06-11 | Ciba Sc Holding Ag | |
US5856373A (en) * | 1994-10-31 | 1999-01-05 | Minnesota Mining And Manufacturing Company | Dental visible light curable epoxy system with enhanced depth of cure |
US5527660A (en) * | 1994-11-30 | 1996-06-18 | Polaroid Corporation | Laminar imaging medium utilizing hydrophobic cycloaliphatic polyepoxide in the fracturable layers |
JP3638660B2 (ja) * | 1995-05-01 | 2005-04-13 | 松下電器産業株式会社 | 感光性樹脂組成物、それを用いたサンドブラスト用感光性ドライフィルム及びそれを用いた食刻方法 |
US5877229A (en) * | 1995-07-26 | 1999-03-02 | Lockheed Martin Energy Systems, Inc. | High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators |
FR2740608B1 (fr) * | 1995-10-25 | 1997-12-19 | Giat Ind Sa | Procede pour deposer un revetement de protection sur les composants d'une carte electronique |
TW475098B (en) * | 1995-10-27 | 2002-02-01 | Tokyo Ohka Kogyo Co Ltd | Photosensitive resin composition and photosensitive resin laminated film containing the same |
US5729185A (en) * | 1996-04-29 | 1998-03-17 | Motorola Inc. | Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal |
US6008266A (en) * | 1996-08-14 | 1999-12-28 | International Business Machines Corporation | Photosensitive reworkable encapsulant |
JP3786480B2 (ja) * | 1996-10-14 | 2006-06-14 | Jsr株式会社 | 光硬化性樹脂組成物 |
US20010014399A1 (en) * | 1997-02-26 | 2001-08-16 | Stanley J. Jasne | Conductive uv-curable epoxy formulations |
US6858260B2 (en) | 1997-05-21 | 2005-02-22 | Denovus Llc | Curable sealant composition |
US6277898B1 (en) * | 1997-05-21 | 2001-08-21 | Denovus Llc | Curable sealant composition |
US6174932B1 (en) * | 1998-05-20 | 2001-01-16 | Denovus Llc | Curable sealant composition |
US5879859A (en) * | 1997-07-16 | 1999-03-09 | International Business Machines Corporation | Strippable photoimageable compositions |
US6686051B1 (en) | 1998-03-05 | 2004-02-03 | Omnova Solutions Inc. | Cured polyesters containing fluorinated side chains |
US7320829B2 (en) | 1998-03-05 | 2008-01-22 | Omnova Solutions Inc. | Fluorinated polymer and amine resin compositions and products formed therefrom |
US6383651B1 (en) | 1998-03-05 | 2002-05-07 | Omnova Solutions Inc. | Polyester with partially fluorinated side chains |
JP2002505218A (ja) | 1998-03-05 | 2002-02-19 | オムノヴア ソリユーシヨンズ インコーポレーテツド | 清掃容易なポリマーラミネート |
US6174967B1 (en) | 1998-03-20 | 2001-01-16 | Ndsu-Research Foundation | Composition of epoxy resin and (cyclo)alkoxy-substituted organosilane |
US6762002B2 (en) | 1998-07-10 | 2004-07-13 | Dsm Desotech, Inc. | Solid imaging compositions for preparing polypropylene-like articles |
US20060154175A9 (en) * | 1998-07-10 | 2006-07-13 | Lawton John A | Solid imaging compositions for preparing polypropylene-like articles |
US6287748B1 (en) | 1998-07-10 | 2001-09-11 | Dsm N.V. | Solid imaging compositions for preparing polyethylene-like articles |
US6379866B2 (en) | 2000-03-31 | 2002-04-30 | Dsm Desotech Inc | Solid imaging compositions for preparing polypropylene-like articles |
EP1087260A4 (en) * | 1999-02-15 | 2002-01-16 | Clariant Finance Bvi Ltd | PHOTOSENSITIVE RESIN COMPOSITION |
US6673889B1 (en) * | 1999-06-28 | 2004-01-06 | Omnova Solutions Inc. | Radiation curable coating containing polyfuorooxetane |
US6403760B1 (en) | 1999-12-28 | 2002-06-11 | Omnova Solutions Inc. | Monohydric polyfluorooxetane polymer and radiation curable coatings containing a monofunctional polyfluorooxetane polymer |
US6962966B2 (en) | 1999-12-28 | 2005-11-08 | Omnova Solutions Inc. | Monohydric polyfluorooxetane oligomers, polymers, and copolymers and coatings containing the same |
US6465565B1 (en) | 2000-07-06 | 2002-10-15 | Omnova Solutions, Inc. | Anionic waterborne polyurethane dispersions containing polyfluorooxetanes |
US6465566B2 (en) | 2000-07-06 | 2002-10-15 | Omnova Solutions Inc. | Anionic waterborne polyurethane dispersions containing polyfluorooxetanes |
US6579914B1 (en) | 2000-07-14 | 2003-06-17 | Alcatel | Coating compositions for optical waveguides and optical waveguides coated therewith |
US6716568B1 (en) | 2000-09-15 | 2004-04-06 | Microchem Corp. | Epoxy photoresist composition with improved cracking resistance |
US6660828B2 (en) | 2001-05-14 | 2003-12-09 | Omnova Solutions Inc. | Fluorinated short carbon atom side chain and polar group containing polymer, and flow, or leveling, or wetting agents thereof |
CA2447132C (en) * | 2001-05-14 | 2008-10-07 | Omnova Solutions Inc. | Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups |
CN1589289A (zh) * | 2001-11-19 | 2005-03-02 | 国际壳牌研究有限公司 | 环氧树脂的聚合方法 |
EP1470191B1 (en) * | 2002-02-01 | 2012-11-21 | Saint-Gobain Glass France S.A. | Barrier layer made of a curable resin containing polymeric polyol |
US6850681B2 (en) * | 2002-08-22 | 2005-02-01 | Addison Clear Wave, Llc | Radiation-curable flame retardant optical fiber coatings |
JP3797348B2 (ja) * | 2003-02-24 | 2006-07-19 | コニカミノルタホールディングス株式会社 | 活性エネルギー線硬化組成物 |
EP1651360A1 (en) * | 2003-07-28 | 2006-05-03 | Valspar Sourcing, Inc. | Metal containers having an easily openable end and method of manufacturing the same |
WO2005044890A1 (en) * | 2003-11-03 | 2005-05-19 | Union Carbide Chemicals & Plastics Technology Corporation | Tougher cycloaliphatic epoxide resins |
US20050165127A1 (en) * | 2003-12-31 | 2005-07-28 | Dsm Desotech, Inc. | Solid imaging compositions for preparing polyethylene-like articles |
US20050260522A1 (en) * | 2004-02-13 | 2005-11-24 | William Weber | Permanent resist composition, cured product thereof, and use thereof |
DE102004008365A1 (de) * | 2004-02-20 | 2005-09-08 | Altana Electrical Insulation Gmbh | Verfahren zur Herstellung von beschichteten elektrischen Drähten |
US7449280B2 (en) * | 2004-05-26 | 2008-11-11 | Microchem Corp. | Photoimageable coating composition and composite article thereof |
US7355832B2 (en) * | 2004-07-09 | 2008-04-08 | General Electric Company | Methods and arrangements for reducing partial discharges on printed circuit boards |
CA2493410C (en) * | 2005-01-20 | 2016-09-27 | Intelligent Devices Inc. | Assembly, production and quality assurance processes respecting electronic compliance monitor (ecm) tags |
US20060223937A1 (en) * | 2005-04-04 | 2006-10-05 | Herr Donald E | Radiation curable cycloaliphatic barrier sealants |
DE102005040126A1 (de) * | 2005-08-25 | 2007-03-01 | Altana Electrical Insulation Gmbh | Überzugsmasse |
JP2008007562A (ja) * | 2006-06-27 | 2008-01-17 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いて得られた半導体装置 |
GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
JP5130950B2 (ja) * | 2008-02-22 | 2013-01-30 | Jsr株式会社 | プライマー層形成用放射線硬化性組成物、積層体及び金属表面保護膜の形成方法 |
MX2011001775A (es) | 2008-08-18 | 2011-06-20 | Semblant Global Ltd | Revestimiento de polimero de halo-hidrocarburo. |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
JP6966014B1 (ja) * | 2021-05-17 | 2021-11-10 | 東洋インキScホールディングス株式会社 | 光硬化性上塗り塗料、積層体およびその製造方法、包装容器用部材およびその製造方法、並びに包装容器 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2890194A (en) * | 1956-05-24 | 1959-06-09 | Union Carbide Corp | Compositions of epoxides and polycarboxylic acid compounds |
US4256828A (en) * | 1975-09-02 | 1981-03-17 | Minnesota Mining And Manufacturing Company | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4193799A (en) * | 1976-07-09 | 1980-03-18 | General Electric Company | Method of making printing plates and printed circuit |
US4108747A (en) * | 1976-07-14 | 1978-08-22 | General Electric Company | Curable compositions and method for curing such compositions |
US4130708A (en) * | 1977-12-09 | 1978-12-19 | Ppg Industries, Inc. | Siloxane urethane acrylate radiation curable compounds for use in coating compositions |
US4231951A (en) * | 1978-02-08 | 1980-11-04 | Minnesota Mining And Manufacturing Company | Complex salt photoinitiator |
US4179400A (en) * | 1978-05-09 | 1979-12-18 | W. R. Grace & Co. | Process for preparing catalytic solutions of sulfonium salts |
US4216288A (en) * | 1978-09-08 | 1980-08-05 | General Electric Company | Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents |
US4297401A (en) * | 1978-12-26 | 1981-10-27 | Minnesota Mining & Manufacturing Company | Liquid crystal display and photopolymerizable sealant therefor |
US4250053A (en) * | 1979-05-21 | 1981-02-10 | Minnesota Mining And Manufacturing Company | Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems |
JPS568428A (en) * | 1979-06-19 | 1981-01-28 | Ciba Geigy Ag | Photopolymerizing and thermopolymerizing composition |
US4250203A (en) * | 1979-08-30 | 1981-02-10 | American Can Company | Cationically polymerizable compositions containing sulfonium salt photoinitiators and odor suppressants and method of polymerization using same |
CA1172790A (en) * | 1980-11-24 | 1984-08-14 | Gerald M. Leszyk | Radiation curable composition including an acrylated urethane, and unsaturated carboxylic acid, a multifunctional acrylate and a siloxy-containing polycarbinol |
JPS5874720A (ja) * | 1981-10-30 | 1983-05-06 | Hitachi Ltd | 耐熱性樹脂の製法 |
US4426431A (en) * | 1982-09-22 | 1984-01-17 | Eastman Kodak Company | Radiation-curable compositions for restorative and/or protective treatment of photographic elements |
US4593051A (en) * | 1983-02-07 | 1986-06-03 | Union Carbide Corporation | Photocopolymerizable compositons based on epoxy and polymer/hydroxyl-containing organic materials |
US4585534A (en) * | 1983-04-29 | 1986-04-29 | Desoto, Inc. | Optical glass fiber coated with cationically curable polyepoxide mixtures |
US4497687A (en) * | 1983-07-28 | 1985-02-05 | Psi Star, Inc. | Aqueous process for etching cooper and other metals |
JPS6051770A (ja) * | 1983-08-31 | 1985-03-23 | Toyo Ink Mfg Co Ltd | 光学用接着剤 |
JPS6051717A (ja) * | 1983-08-31 | 1985-03-23 | Mitsubishi Electric Corp | 紫外線硬化型樹脂組成物 |
US4599401A (en) * | 1983-10-27 | 1986-07-08 | Union Carbide Corporation | Low viscosity adducts of poly(active hydrogen) organic compounds and a polyepoxide |
-
1986
- 1986-12-05 CA CA 524637 patent/CA1312040C/en not_active Expired - Lifetime
- 1986-12-18 ZA ZA869519A patent/ZA869519B/xx unknown
- 1986-12-18 DE DE8686117632T patent/DE3686941T2/de not_active Expired - Fee Related
- 1986-12-18 KR KR1019860010889A patent/KR920002780B1/ko not_active IP Right Cessation
- 1986-12-18 MX MX004711A patent/MX174472B/es unknown
- 1986-12-18 EP EP19860117632 patent/EP0233358B1/en not_active Expired - Lifetime
- 1986-12-18 JP JP61300197A patent/JPS62230861A/ja active Granted
-
1989
- 1989-11-30 US US07/443,447 patent/US5043221A/en not_active Expired - Lifetime
-
1991
- 1991-03-25 US US07/674,168 patent/US5155143A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
MX174472B (es) | 1994-05-18 |
US5043221A (en) | 1991-08-27 |
ZA869519B (en) | 1987-08-26 |
DE3686941D1 (de) | 1992-11-12 |
JPS62230861A (ja) | 1987-10-09 |
CA1312040C (en) | 1992-12-29 |
KR920002780B1 (ko) | 1992-04-03 |
JPH058948B2 (ko) | 1993-02-03 |
EP0233358B1 (en) | 1992-10-07 |
US5155143A (en) | 1992-10-13 |
DE3686941T2 (de) | 1993-02-18 |
EP0233358A3 (en) | 1988-09-14 |
EP0233358A2 (en) | 1987-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR870006820A (ko) | 화학선에 의한 상이 피복방법 | |
US5264325A (en) | Composition for photo imaging | |
EP0385122B1 (en) | Improved composition for photo imaging | |
US6576382B2 (en) | Composition for photoimaging | |
KR0130577B1 (ko) | 자외선-경화성 실리콘 박리제 조성물 | |
US5300402A (en) | Composition for photo imaging | |
US5439766A (en) | Composition for photo imaging | |
US4428807A (en) | Composition containing polymerizable entities having oxirane groups and terminal olefinic unsaturation in combination with free-radical and cationic photopolymerizations means | |
GB1401889A (en) | Polymerizable epoxy compositions | |
KR930009212B1 (ko) | 무전해 도금-내성 잉크 조성물 | |
US5278010A (en) | Composition for photo imaging | |
KR910016816A (ko) | Un 경화성 예비 가교 결합된 에폭시 관능성 실리콘 | |
KR870011825A (ko) | 무전해 도금용 광-경화성 레지스트 수지조성물 및 이로부터 만든 인쇄회로판 | |
KR910016817A (ko) | Uv경화성 에폭시 실리콘 | |
US4319974A (en) | UV Curable compositions and substrates treated therewith | |
US5439779A (en) | Aqueous soldermask | |
KR900013348A (ko) | 포지티브형 감광성 전착도료 조성물 및 회로판의 제조방법 | |
KR910012810A (ko) | 가시방사선 감광성 조성물 | |
US5747223A (en) | Composition for photoimaging | |
KR960029905A (ko) | 수용성 감광성 수지 조성물 및 이것을 사용한 블랙 매트릭스 패턴의 형성 방법 | |
KR960701916A (ko) | 에폭시 수지, 이의 제조 방법 및 이를 함유하는 광경화성 수지 조성물 및 분체 도료용 수지 조성물(Epoxy Resin, Process for Producing the Same, and Photocurable Resin Composition and Powder Coating Resin Composition Both Containing Said Resin) | |
US4367251A (en) | UV Curable compositions and substrates treated therewith | |
JPH05171084A (ja) | 化学めっき用レジスト樹脂組成物 | |
KR940009754A (ko) | 화학적으로 강화된 네가티브 포토레지스트 | |
KR960017796A (ko) | 메트아크릴산 트리플루오로에틸을 주성분으로 하는 광(光) 교차결합 가능 조성물과 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |