MX174472B - Revestimientos conformes curados con radiacion actinica - Google Patents

Revestimientos conformes curados con radiacion actinica

Info

Publication number
MX174472B
MX174472B MX004711A MX471186A MX174472B MX 174472 B MX174472 B MX 174472B MX 004711 A MX004711 A MX 004711A MX 471186 A MX471186 A MX 471186A MX 174472 B MX174472 B MX 174472B
Authority
MX
Mexico
Prior art keywords
conformed
substrates
actinic radiation
optionally
coating
Prior art date
Application number
MX004711A
Other languages
English (en)
Inventor
Joseph Victor Koleske
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Publication of MX174472B publication Critical patent/MX174472B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/913—Material designed to be responsive to temperature, light, moisture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)

Abstract

La presente invención se refiere a un método para revestir tableros de circuito impreso, substrato de metal y de polímero que consiste de: 1) poner en contacto los substratos con una formulación de revestimiento conformable que consiste esencialmente de: A) una cantidad predominante de por lo menos un epóxido cicloalifático que tiene uno o más grupos oxirano; B) por lo menos un poliol de polieter; C) un fotoiniciador; D) opcionalmente un surfactante; y E) opcionalmnete, un colorante fluorescente; 2) curar los substratos cubiertos con un revestimiento integral que llene las especificaciones de MIL-1-46058C (MODIFICACION 6)
MX004711A 1985-12-19 1986-12-18 Revestimientos conformes curados con radiacion actinica MX174472B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81075885A 1985-12-19 1985-12-19

Publications (1)

Publication Number Publication Date
MX174472B true MX174472B (es) 1994-05-18

Family

ID=25204631

Family Applications (1)

Application Number Title Priority Date Filing Date
MX004711A MX174472B (es) 1985-12-19 1986-12-18 Revestimientos conformes curados con radiacion actinica

Country Status (8)

Country Link
US (2) US5043221A (es)
EP (1) EP0233358B1 (es)
JP (1) JPS62230861A (es)
KR (1) KR920002780B1 (es)
CA (1) CA1312040C (es)
DE (1) DE3686941T2 (es)
MX (1) MX174472B (es)
ZA (1) ZA869519B (es)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0276716A3 (en) * 1987-01-30 1989-07-26 General Electric Company Uv curable epoxy resin compositions with delayed cure
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
JPH05110233A (ja) * 1991-10-15 1993-04-30 Cmk Corp プリント配線板の製造方法
US5248752A (en) * 1991-11-12 1993-09-28 Union Carbide Chemicals & Plastics Technology Corporation Polyurethane (meth)acrylates and processes for preparing same
US5667856A (en) * 1992-01-24 1997-09-16 Revlon Consumer Products Corporation Radiation curable pigmented compositions and decorated substrates
US5487927A (en) * 1992-01-24 1996-01-30 Revlon Consumer Products Corporation Decorating method and products
ES2087815B1 (es) * 1993-10-13 1997-02-16 Mecanismos Aux Ind Mejoras introducidas en la patente de invencion n- 9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.
EP0650315A3 (de) * 1993-10-23 1995-06-21 Leonische Drahtwerke Ag Elektrisches Steuergerät, insbesondere zum Einbau in Kraftfahrzeuge.
JPH07268065A (ja) * 1993-11-17 1995-10-17 Sophia Syst:Kk 紫外線硬化型の無溶媒導電性ポリマー材料
TW307791B (es) * 1994-02-09 1997-06-11 Ciba Sc Holding Ag
US5856373A (en) * 1994-10-31 1999-01-05 Minnesota Mining And Manufacturing Company Dental visible light curable epoxy system with enhanced depth of cure
US5527660A (en) * 1994-11-30 1996-06-18 Polaroid Corporation Laminar imaging medium utilizing hydrophobic cycloaliphatic polyepoxide in the fracturable layers
JP3638660B2 (ja) * 1995-05-01 2005-04-13 松下電器産業株式会社 感光性樹脂組成物、それを用いたサンドブラスト用感光性ドライフィルム及びそれを用いた食刻方法
US5877229A (en) * 1995-07-26 1999-03-02 Lockheed Martin Energy Systems, Inc. High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators
FR2740608B1 (fr) * 1995-10-25 1997-12-19 Giat Ind Sa Procede pour deposer un revetement de protection sur les composants d'une carte electronique
TW475098B (en) * 1995-10-27 2002-02-01 Tokyo Ohka Kogyo Co Ltd Photosensitive resin composition and photosensitive resin laminated film containing the same
US5729185A (en) * 1996-04-29 1998-03-17 Motorola Inc. Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal
US6008266A (en) * 1996-08-14 1999-12-28 International Business Machines Corporation Photosensitive reworkable encapsulant
JP3786480B2 (ja) * 1996-10-14 2006-06-14 Ｊｓｒ株式会社 光硬化性樹脂組成物
US20010014399A1 (en) * 1997-02-26 2001-08-16 Stanley J. Jasne Conductive uv-curable epoxy formulations
US6858260B2 (en) 1997-05-21 2005-02-22 Denovus Llc Curable sealant composition
US6174932B1 (en) * 1998-05-20 2001-01-16 Denovus Llc Curable sealant composition
US6277898B1 (en) * 1997-05-21 2001-08-21 Denovus Llc Curable sealant composition
US5879859A (en) * 1997-07-16 1999-03-09 International Business Machines Corporation Strippable photoimageable compositions
US7320829B2 (en) 1998-03-05 2008-01-22 Omnova Solutions Inc. Fluorinated polymer and amine resin compositions and products formed therefrom
US6383651B1 (en) 1998-03-05 2002-05-07 Omnova Solutions Inc. Polyester with partially fluorinated side chains
CA2322815C (en) * 1998-03-05 2007-03-13 Omnova Solutions Inc. Easily cleanable polymer laminates
US6686051B1 (en) 1998-03-05 2004-02-03 Omnova Solutions Inc. Cured polyesters containing fluorinated side chains
US6174967B1 (en) 1998-03-20 2001-01-16 Ndsu-Research Foundation Composition of epoxy resin and (cyclo)alkoxy-substituted organosilane
US6379866B2 (en) * 2000-03-31 2002-04-30 Dsm Desotech Inc Solid imaging compositions for preparing polypropylene-like articles
US6762002B2 (en) 1998-07-10 2004-07-13 Dsm Desotech, Inc. Solid imaging compositions for preparing polypropylene-like articles
US20060154175A9 (en) * 1998-07-10 2006-07-13 Lawton John A Solid imaging compositions for preparing polypropylene-like articles
US6287748B1 (en) * 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
KR100668244B1 (ko) * 1999-02-15 2007-01-17 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 감광성 수지 조성물
US6673889B1 (en) * 1999-06-28 2004-01-06 Omnova Solutions Inc. Radiation curable coating containing polyfuorooxetane
US6962966B2 (en) 1999-12-28 2005-11-08 Omnova Solutions Inc. Monohydric polyfluorooxetane oligomers, polymers, and copolymers and coatings containing the same
US6403760B1 (en) 1999-12-28 2002-06-11 Omnova Solutions Inc. Monohydric polyfluorooxetane polymer and radiation curable coatings containing a monofunctional polyfluorooxetane polymer
US6465566B2 (en) 2000-07-06 2002-10-15 Omnova Solutions Inc. Anionic waterborne polyurethane dispersions containing polyfluorooxetanes
US6465565B1 (en) 2000-07-06 2002-10-15 Omnova Solutions, Inc. Anionic waterborne polyurethane dispersions containing polyfluorooxetanes
US6579914B1 (en) 2000-07-14 2003-06-17 Alcatel Coating compositions for optical waveguides and optical waveguides coated therewith
US6716568B1 (en) 2000-09-15 2004-04-06 Microchem Corp. Epoxy photoresist composition with improved cracking resistance
JP4017988B2 (ja) * 2001-05-14 2007-12-05 オムノバ ソリューソンズ インコーポレーティッド ペンダントフッ素化炭素基を有する環状モノマー由来のポリマー界面活性剤
US6660828B2 (en) 2001-05-14 2003-12-09 Omnova Solutions Inc. Fluorinated short carbon atom side chain and polar group containing polymer, and flow, or leveling, or wetting agents thereof
EP1448663B1 (en) * 2001-11-19 2009-07-15 Shell Internationale Researchmaatschappij B.V. Process for the alkoxylation of organic compounds
ES2396118T3 (es) * 2002-02-01 2013-02-19 Saint-Gobain Glass France S.A. Capa barrera hecha de una resina curable que contiene un poliol polimérico
US6850681B2 (en) * 2002-08-22 2005-02-01 Addison Clear Wave, Llc Radiation-curable flame retardant optical fiber coatings
JP3797348B2 (ja) * 2003-02-24 2006-07-19 コニカミノルタホールディングス株式会社 活性エネルギー線硬化組成物
CN1852771A (zh) * 2003-07-28 2006-10-25 瓦尔斯帕供应公司 具有可易于开启的端面的金属容器及其制造方法
CN1875045A (zh) * 2003-11-03 2006-12-06 联合碳化化学及塑料技术公司 更韧的脂环族环氧树脂
US20050165127A1 (en) * 2003-12-31 2005-07-28 Dsm Desotech, Inc. Solid imaging compositions for preparing polyethylene-like articles
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof
DE102004008365A1 (de) * 2004-02-20 2005-09-08 Altana Electrical Insulation Gmbh Verfahren zur Herstellung von beschichteten elektrischen Drähten
US7449280B2 (en) * 2004-05-26 2008-11-11 Microchem Corp. Photoimageable coating composition and composite article thereof
US7355832B2 (en) * 2004-07-09 2008-04-08 General Electric Company Methods and arrangements for reducing partial discharges on printed circuit boards
CA2493410C (en) * 2005-01-20 2016-09-27 Intelligent Devices Inc. Assembly, production and quality assurance processes respecting electronic compliance monitor (ecm) tags
US20060223937A1 (en) * 2005-04-04 2006-10-05 Herr Donald E Radiation curable cycloaliphatic barrier sealants
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
JP2008007562A (ja) * 2006-06-27 2008-01-17 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いて得られた半導体装置
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP5130950B2 (ja) * 2008-02-22 2013-01-30 Ｊｓｒ株式会社 プライマー層形成用放射線硬化性組成物、積層体及び金属表面保護膜の形成方法
WO2010020753A2 (en) 2008-08-18 2010-02-25 Semblant Limited Halo-hydrocarbon polymer coating
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
JP6966014B1 (ja) * 2021-05-17 2021-11-10 東洋インキＳｃホールディングス株式会社 光硬化性上塗り塗料、積層体およびその製造方法、包装容器用部材およびその製造方法、並びに包装容器

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2890194A (en) * 1956-05-24 1959-06-09 Union Carbide Corp Compositions of epoxides and polycarboxylic acid compounds
US4256828A (en) * 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4193799A (en) * 1976-07-09 1980-03-18 General Electric Company Method of making printing plates and printed circuit
US4108747A (en) * 1976-07-14 1978-08-22 General Electric Company Curable compositions and method for curing such compositions
US4130708A (en) * 1977-12-09 1978-12-19 Ppg Industries, Inc. Siloxane urethane acrylate radiation curable compounds for use in coating compositions
US4231951A (en) * 1978-02-08 1980-11-04 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
US4179400A (en) * 1978-05-09 1979-12-18 W. R. Grace & Co. Process for preparing catalytic solutions of sulfonium salts
US4216288A (en) * 1978-09-08 1980-08-05 General Electric Company Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents
US4297401A (en) * 1978-12-26 1981-10-27 Minnesota Mining & Manufacturing Company Liquid crystal display and photopolymerizable sealant therefor
US4250053A (en) * 1979-05-21 1981-02-10 Minnesota Mining And Manufacturing Company Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems
JPS568428A (en) * 1979-06-19 1981-01-28 Ciba Geigy Ag Photopolymerizing and thermopolymerizing composition
US4250203A (en) * 1979-08-30 1981-02-10 American Can Company Cationically polymerizable compositions containing sulfonium salt photoinitiators and odor suppressants and method of polymerization using same
CA1172790A (en) * 1980-11-24 1984-08-14 Gerald M. Leszyk Radiation curable composition including an acrylated urethane, and unsaturated carboxylic acid, a multifunctional acrylate and a siloxy-containing polycarbinol
JPS5874720A (ja) * 1981-10-30 1983-05-06 Hitachi Ltd 耐熱性樹脂の製法
US4426431A (en) * 1982-09-22 1984-01-17 Eastman Kodak Company Radiation-curable compositions for restorative and/or protective treatment of photographic elements
US4593051A (en) * 1983-02-07 1986-06-03 Union Carbide Corporation Photocopolymerizable compositons based on epoxy and polymer/hydroxyl-containing organic materials
US4585534A (en) * 1983-04-29 1986-04-29 Desoto, Inc. Optical glass fiber coated with cationically curable polyepoxide mixtures
US4497687A (en) * 1983-07-28 1985-02-05 Psi Star, Inc. Aqueous process for etching cooper and other metals
JPS6051717A (ja) * 1983-08-31 1985-03-23 Mitsubishi Electric Corp 紫外線硬化型樹脂組成物
JPS6051770A (ja) * 1983-08-31 1985-03-23 Toyo Ink Mfg Co Ltd 光学用接着剤
US4599401A (en) * 1983-10-27 1986-07-08 Union Carbide Corporation Low viscosity adducts of poly(active hydrogen) organic compounds and a polyepoxide

Also Published As

Publication number Publication date
ZA869519B (en) 1987-08-26
KR920002780B1 (ko) 1992-04-03
US5155143A (en) 1992-10-13
EP0233358B1 (en) 1992-10-07
DE3686941T2 (de) 1993-02-18
EP0233358A2 (en) 1987-08-26
JPH058948B2 (es) 1993-02-03
DE3686941D1 (de) 1992-11-12
US5043221A (en) 1991-08-27
JPS62230861A (ja) 1987-10-09
CA1312040C (en) 1992-12-29
KR870006820A (ko) 1987-07-14
EP0233358A3 (en) 1988-09-14

Similar Documents

Publication Publication Date Title
MX174472B (es) Revestimientos conformes curados con radiacion actinica
BR9500677A (pt) Método para decorar um substrato com folha de estampagem a quente,composição de polímero curável por radiação,e recipiente tendo uma superfície interna e uma superfície externa
ATE132169T1 (de) Härtbare zusammensetzungen
ATE7545T1 (de) Verfahren zur maskierung ausgewaehlter bereiche elektrischer leiterplatten; maskierte leiterplatte und elektrische leiterplatten, die komponenten tragen.
ATE544095T1 (de) Verfahren zur herstellung einer druckplatte
ATE163021T1 (de) Verfahren zur beschichtung von leiterplatten
NZ215103A (en) Cathodic electrodepositable resin compositions comprising epoxy resin/amine adduct and low tg crosslinking agent; coating baths and coated articles
BR8704705A (pt) Processo de laminacao de uma pelicula fotopolimerizavel sobre um substrato
BR9510299A (pt) Processo de eletrodeposição catódica utilizando a composição de revestimento curável de carbonato cíclico
TW290583B (es)
AU539029B2 (en) Repair + manufacture of printed circuit boards
KR870005044A (ko) 포트라이프가 긴 2성분 경화 조성물
BR8604549A (pt) Processo de fabricacao da composicao de revestimento foto-protetor,placas e circuitos impressos de multicamadas fabricadas com a mesma e metodos de fabricacao dos mesmos
MX193717B (es) Metodo para la deposicion electrolitica catodica que utiliza una composicion de recubrimiento curable de carbonato ciclico.
BR8602441A (pt) Processo para curar uma pelicula de uma composicao de revestimento e composicao de revestimento resultante
BR9306959A (pt) Processo de cura por feixe eletrónico de tábua envernizada
IT1153191B (it) Procedimento e composizione per rivestire un substrato metallico con un film polimerico
MX9301080A (es) Metodo y aparato para aplicar y curar un revestimiento sobre un tablero de circuito.
BR8106819A (pt) Banho de eletrodeposicao e processo para eletrodeposicao de niquel sobre um substrato
EP0127682A4 (en) METHOD FOR MOUNTING ELECTRONIC COMPONENTS.
ATE96978T1 (de) Verfahren zum herstellen von durchkontaktierten leiterplatten mit sehr kleinen oder keinen loetraendern um die durchkontaktierungsloecher.
BR8602440A (pt) Processo para curar uma pelicula de uma composicao de revestimento e composicao de revestimento resultante
ES2049708T1 (es) Agentes endurecedores flexibles.
JPS5647460A (en) Method of electrolytically coating electroconductive substrate with phenol resin protection film
BR8200500A (pt) Processo de fixacao de uma armadura metalica sobre um dieletrico de isolador e isolador obtido pelo mesmo