KR920000674B1 - 기판의 회전식 표면처리장치 - Google Patents

기판의 회전식 표면처리장치 Download PDF

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Publication number
KR920000674B1
KR920000674B1 KR1019870010128A KR870010128A KR920000674B1 KR 920000674 B1 KR920000674 B1 KR 920000674B1 KR 1019870010128 A KR1019870010128 A KR 1019870010128A KR 870010128 A KR870010128 A KR 870010128A KR 920000674 B1 KR920000674 B1 KR 920000674B1
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KR
South Korea
Prior art keywords
chamber
substrate
auxiliary chamber
processing
auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870010128A
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English (en)
Korean (ko)
Other versions
KR880004554A (ko
Inventor
마사미 니시다
노부토시 오오가미
Original Assignee
다이닛뽕스쿠링세이소오가부시키가이샤
이시다 도쿠지로오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이닛뽕스쿠링세이소오가부시키가이샤, 이시다 도쿠지로오 filed Critical 다이닛뽕스쿠링세이소오가부시키가이샤
Publication of KR880004554A publication Critical patent/KR880004554A/ko
Application granted granted Critical
Publication of KR920000674B1 publication Critical patent/KR920000674B1/ko
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
KR1019870010128A 1986-09-19 1987-09-12 기판의 회전식 표면처리장치 Expired KR920000674B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP?61-223334 1986-09-19
JP223334 1986-09-19
JP61223334A JPS6377569A (ja) 1986-09-19 1986-09-19 基板の回転式表面処理装置

Publications (2)

Publication Number Publication Date
KR880004554A KR880004554A (ko) 1988-06-04
KR920000674B1 true KR920000674B1 (ko) 1992-01-20

Family

ID=16796528

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870010128A Expired KR920000674B1 (ko) 1986-09-19 1987-09-12 기판의 회전식 표면처리장치

Country Status (3)

Country Link
US (1) US4838979A (enExample)
JP (1) JPS6377569A (enExample)
KR (1) KR920000674B1 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3732113C1 (de) * 1987-09-24 1988-10-20 Convac Gmbh Einrichtung zur Inline-Belackung von Compact-Discs
KR970011644B1 (ko) * 1988-04-08 1997-07-12 고다까 토시오 도포 처리 장치
US5230743A (en) * 1988-05-25 1993-07-27 Semitool, Inc. Method for single wafer processing in which a semiconductor wafer is contacted with a fluid
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
JP2800008B2 (ja) * 1988-06-27 1998-09-21 東京エレクトロン 株式会社 回転処理装置及び回転処理方法
US5395446A (en) * 1988-11-21 1995-03-07 Kabushiki Kaisha Toshiba Semiconductor treatment apparatus
JPH0628223Y2 (ja) * 1989-06-14 1994-08-03 大日本スクリーン製造株式会社 回転塗布装置
JPH0725256Y2 (ja) * 1989-09-13 1995-06-07 東京応化工業株式会社 スピンナー装置
US5169408A (en) * 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
JPH0411728A (ja) * 1990-04-30 1992-01-16 Seiichiro Sogo 半導体ウェハの洗浄装置
US6375741B2 (en) 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5416047A (en) * 1990-09-07 1995-05-16 Tokyo Electron Limited Method for applying process solution to substrates
DE9013668U1 (de) * 1990-09-29 1992-01-30 HAMATECH Halbleiter-Maschinenbau und Technologie GmbH, 7137 Sternenfels Vorrichtung für die Halbleitertechnik
JP3241058B2 (ja) * 1991-03-28 2001-12-25 大日本スクリーン製造株式会社 回転式塗布装置及び回転式塗布方法
JP3225441B2 (ja) * 1991-04-23 2001-11-05 東京エレクトロン株式会社 処理装置
US5265632A (en) * 1991-05-08 1993-11-30 Tokyo Electron Limited Cleaning apparatus
US5365031A (en) * 1992-03-23 1994-11-15 Hughes Aircraft Company Apparatus and method for shielding a workpiece holding mechanism from depreciative effects during workpiece processing
US5358740A (en) * 1992-06-24 1994-10-25 Massachusetts Institute Of Technology Method for low pressure spin coating and low pressure spin coating apparatus
US6395086B1 (en) * 1993-04-08 2002-05-28 Chartered Semiconductor Manufacturing Pte Ltd Shield for wafer station
JP3142195B2 (ja) * 1993-07-20 2001-03-07 大日本スクリーン製造株式会社 薬液供給装置
US5591264A (en) * 1994-03-22 1997-01-07 Sony Corporation Spin coating device
US5705223A (en) * 1994-07-26 1998-01-06 International Business Machine Corp. Method and apparatus for coating a semiconductor wafer
US5800670A (en) * 1995-05-20 1998-09-01 Kitano Engineering Co., Ltd. Spreader of an optical disc
US5676360A (en) * 1995-07-11 1997-10-14 Boucher; John N. Machine tool rotary table locking apparatus
US5952045A (en) * 1995-07-27 1999-09-14 Micron Technology, Inc. Method and apparatus for improved coating of a semiconductor wafer
US5611886A (en) * 1995-09-19 1997-03-18 Integrated Solutions, Inc. Process chamber for semiconductor substrates
US5952050A (en) * 1996-02-27 1999-09-14 Micron Technology, Inc. Chemical dispensing system for semiconductor wafer processing
US5985031A (en) 1996-06-21 1999-11-16 Micron Technology, Inc. Spin coating spindle and chuck assembly
US5861061A (en) 1996-06-21 1999-01-19 Micron Technology, Inc. Spin coating bowl
US5759273A (en) * 1996-07-16 1998-06-02 Micron Technology, Inc. Cross-section sample staining tool
SG103277A1 (en) * 1996-09-24 2004-04-29 Tokyo Electron Ltd Method and apparatus for cleaning treatment
KR100508575B1 (ko) * 1996-09-24 2005-10-21 동경 엘렉트론 주식회사 세정처리방법및장치와기판처리용장치
JPH10209102A (ja) * 1997-01-17 1998-08-07 Dainippon Screen Mfg Co Ltd 基板処理装置
US5840365A (en) * 1997-02-07 1998-11-24 The Fairchild Corporation Method and apparatus for spin-coating compact discs
US5916368A (en) * 1997-02-27 1999-06-29 The Fairchild Corporation Method and apparatus for temperature controlled spin-coating systems
JP3336898B2 (ja) * 1997-02-28 2002-10-21 三菱電機株式会社 シリコンウエハ表面の不純物回収方法およびその装置
US5916631A (en) * 1997-05-30 1999-06-29 The Fairchild Corporation Method and apparatus for spin-coating chemicals
US5908661A (en) * 1997-05-30 1999-06-01 The Fairchild Corporation Apparatus and method for spin coating substrates
TW384505B (en) * 1997-07-04 2000-03-11 Tokyo Electron Ltd Coating device
AU3784299A (en) * 1998-05-04 1999-11-23 Cfmt, Inc. Wet processing methods for the manufacture of electronic components
US6536454B2 (en) * 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
TW535991U (en) * 2002-05-24 2003-06-01 Winbond Electronics Corp Barrier device
US7371022B2 (en) 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
JP2007324249A (ja) * 2006-05-31 2007-12-13 Hitachi High-Technologies Corp 基板処理装置、基板処理方法、及び基板の製造方法
JP5789546B2 (ja) * 2011-04-26 2015-10-07 東京エレクトロン株式会社 塗布処理装置、塗布現像処理システム、並びに塗布処理方法及びその塗布処理方法を実行させるためのプログラムを記録した記録媒体
US20130101372A1 (en) * 2011-10-19 2013-04-25 Lam Research Ag Method and apparatus for processing wafer-shaped articles
CN103456766B (zh) * 2013-09-24 2016-03-16 四川虹视显示技术有限公司 Oled面板减薄装置、减薄系统及减薄方法
US9209062B1 (en) * 2014-05-28 2015-12-08 Spintrac Systems, Inc. Removable spin chamber with vacuum attachment
CN111299070A (zh) * 2018-12-11 2020-06-19 聚昌科技股份有限公司 消除扰流的液气分离式涂布机结构
JP7454989B2 (ja) * 2019-06-05 2024-03-25 東京エレクトロン株式会社 基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927229B2 (ja) * 1979-09-19 1984-07-04 富士通株式会社 スピンナ−
JPS58209744A (ja) * 1982-05-31 1983-12-06 Dainippon Screen Mfg Co Ltd 回転式表面処理装置
JPS5990928A (ja) * 1982-11-16 1984-05-25 Dainippon Screen Mfg Co Ltd 回転式表面処理装置

Also Published As

Publication number Publication date
JPS6377569A (ja) 1988-04-07
JPH0468028B2 (enExample) 1992-10-30
US4838979A (en) 1989-06-13
KR880004554A (ko) 1988-06-04

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