KR880004554A - 기판의 회전식 표면처리장치 - Google Patents
기판의 회전식 표면처리장치 Download PDFInfo
- Publication number
- KR880004554A KR880004554A KR870010128A KR870010128A KR880004554A KR 880004554 A KR880004554 A KR 880004554A KR 870010128 A KR870010128 A KR 870010128A KR 870010128 A KR870010128 A KR 870010128A KR 880004554 A KR880004554 A KR 880004554A
- Authority
- KR
- South Korea
- Prior art keywords
- auxiliary chamber
- substrate
- chamber
- surface treatment
- treatment apparatus
- Prior art date
Links
- 238000004381 surface treatment Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 title claims 9
- 239000007788 liquid Substances 0.000 claims 4
- 238000005192 partition Methods 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 연관된 회전식 표면처리장치의 종단면도.
제2도는 제1도의 상부 하우징(5)이 탈리된 상태의 평면도.
Claims (6)
- 대략 원통형으로 그 내부에 처리실을 형성하고 상단부에 개구를 가지며, 상기 개구의 주연부에 테두리를 형성하며 이 개구를 통하여 처리실로 공기를 유입할 수 있도록된 하우징과, 상기 처리실 중앙부에 회동자재로 설치되어 그 상면에 피처리 기판을 고정시킬 수 있는 지지수단과, 기판을 소정 회전속도로 회전시키기 위하여 상기 지지수단과 연계된 회전수단과, 기판의 표면상으로 소정의 처리액을 공급하기 위하여 상기 지지수단 상방에 배설된 처리액 공급수단과, 상기 처리실에 배기를 수행하여 이 처리실 내부에 공기 유동을 야기시키도록 상기 처리실과 연통된 배기수단으로 구성된 기판의 회전식 표면처리장치에 있어서, 상기 지지수단의 직하부에 설치되고 상기 처리실로 유입되는 공기 유동을 정류하기 위하여 회전 중심에서 편심되게 설치되며 주연부를 가지며 이 주연부에 외측으로 연장되면서 하향되는 경사면을 가진 정류판과 ; 기판표면으로부터 처리액의 잉여분을 집적하기 위하여 상기 하우징의 내주연부 저면부에 형성된 제1보조실과 ; 상기 정류판 하방에 형성되고 상기 제1보조실과 구획되고 연통된 제2보조실로 구성된 기판의 회전식 표면처리장치.
- 제1항에 있어서, 상기 제2보조실에 상기 지지수단의 회전 중심에 대하여 대칭으로 최소한 2개의 배기닥트를 연결시키고 이를 배기수단에 연결하여 구성된 기판의 회전식 표면처리장치.
- 제1항에 있어서, 상기 제1보조실에 최소한 1개의 배출구를 설치하여 상기 제1보조실에서 집적된 처리액을 배출하도록 구성된 기판의 회전식 표면처리장치.
- 제2항 도는 제3항에 있어서, 상기 배기닥트와 배출구를 각각 분리하여 상기 제2보조실과 제1보조실에 각각 연결하여 구성된 기판의 회전식 표면처리장치.
- 제1항에 있어서, 상기 제1보조실과 제2보조실 사이에 구획벽을 배설하여 이 구획벽을 상기 처리실의 저면부로부터 상향 연장하여 제1보조실과 제2보조실 사이에 연통하도록 구성된 기판의 회전식 표면처리장치.
- 제1항 또는 제5항에 있어서, 상기 정류판의 주연부가 상기 구획벽의 상단부보다 낮게 위치토록 구성된 기판의 회전식 표면처리장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP223334 | 1986-09-19 | ||
JP?61-223334 | 1986-09-19 | ||
JP61223334A JPS6377569A (ja) | 1986-09-19 | 1986-09-19 | 基板の回転式表面処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880004554A true KR880004554A (ko) | 1988-06-04 |
KR920000674B1 KR920000674B1 (ko) | 1992-01-20 |
Family
ID=16796528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870010128A KR920000674B1 (ko) | 1986-09-19 | 1987-09-12 | 기판의 회전식 표면처리장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4838979A (ko) |
JP (1) | JPS6377569A (ko) |
KR (1) | KR920000674B1 (ko) |
Families Citing this family (54)
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DE3732113C1 (de) * | 1987-09-24 | 1988-10-20 | Convac Gmbh | Einrichtung zur Inline-Belackung von Compact-Discs |
KR970011644B1 (ko) * | 1988-04-08 | 1997-07-12 | 고다까 토시오 | 도포 처리 장치 |
US5230743A (en) * | 1988-05-25 | 1993-07-27 | Semitool, Inc. | Method for single wafer processing in which a semiconductor wafer is contacted with a fluid |
US5168886A (en) * | 1988-05-25 | 1992-12-08 | Semitool, Inc. | Single wafer processor |
US5224504A (en) * | 1988-05-25 | 1993-07-06 | Semitool, Inc. | Single wafer processor |
JP2800008B2 (ja) * | 1988-06-27 | 1998-09-21 | 東京エレクトロン 株式会社 | 回転処理装置及び回転処理方法 |
US5395446A (en) * | 1988-11-21 | 1995-03-07 | Kabushiki Kaisha Toshiba | Semiconductor treatment apparatus |
JPH0628223Y2 (ja) * | 1989-06-14 | 1994-08-03 | 大日本スクリーン製造株式会社 | 回転塗布装置 |
JPH0725256Y2 (ja) * | 1989-09-13 | 1995-06-07 | 東京応化工業株式会社 | スピンナー装置 |
US5169408A (en) * | 1990-01-26 | 1992-12-08 | Fsi International, Inc. | Apparatus for wafer processing with in situ rinse |
JPH0411728A (ja) * | 1990-04-30 | 1992-01-16 | Seiichiro Sogo | 半導体ウェハの洗浄装置 |
US6375741B2 (en) * | 1991-03-06 | 2002-04-23 | Timothy J. Reardon | Semiconductor processing spray coating apparatus |
US5416047A (en) * | 1990-09-07 | 1995-05-16 | Tokyo Electron Limited | Method for applying process solution to substrates |
DE9013668U1 (ko) * | 1990-09-29 | 1992-01-30 | Hamatech Halbleiter-Maschinenbau Und Technologie Gmbh, 7137 Sternenfels, De | |
JP3241058B2 (ja) * | 1991-03-28 | 2001-12-25 | 大日本スクリーン製造株式会社 | 回転式塗布装置及び回転式塗布方法 |
JP3225441B2 (ja) * | 1991-04-23 | 2001-11-05 | 東京エレクトロン株式会社 | 処理装置 |
US5265632A (en) * | 1991-05-08 | 1993-11-30 | Tokyo Electron Limited | Cleaning apparatus |
US5365031A (en) * | 1992-03-23 | 1994-11-15 | Hughes Aircraft Company | Apparatus and method for shielding a workpiece holding mechanism from depreciative effects during workpiece processing |
US5358740A (en) * | 1992-06-24 | 1994-10-25 | Massachusetts Institute Of Technology | Method for low pressure spin coating and low pressure spin coating apparatus |
US6395086B1 (en) * | 1993-04-08 | 2002-05-28 | Chartered Semiconductor Manufacturing Pte Ltd | Shield for wafer station |
JP3142195B2 (ja) * | 1993-07-20 | 2001-03-07 | 大日本スクリーン製造株式会社 | 薬液供給装置 |
US5591264A (en) * | 1994-03-22 | 1997-01-07 | Sony Corporation | Spin coating device |
US5705223A (en) * | 1994-07-26 | 1998-01-06 | International Business Machine Corp. | Method and apparatus for coating a semiconductor wafer |
US5800670A (en) * | 1995-05-20 | 1998-09-01 | Kitano Engineering Co., Ltd. | Spreader of an optical disc |
US5676360A (en) * | 1995-07-11 | 1997-10-14 | Boucher; John N. | Machine tool rotary table locking apparatus |
US5952045A (en) * | 1995-07-27 | 1999-09-14 | Micron Technology, Inc. | Method and apparatus for improved coating of a semiconductor wafer |
US5611886A (en) * | 1995-09-19 | 1997-03-18 | Integrated Solutions, Inc. | Process chamber for semiconductor substrates |
US5952050A (en) * | 1996-02-27 | 1999-09-14 | Micron Technology, Inc. | Chemical dispensing system for semiconductor wafer processing |
US5985031A (en) | 1996-06-21 | 1999-11-16 | Micron Technology, Inc. | Spin coating spindle and chuck assembly |
US5861061A (en) * | 1996-06-21 | 1999-01-19 | Micron Technology, Inc. | Spin coating bowl |
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SG98022A1 (en) * | 1996-09-24 | 2003-08-20 | Tokyo Electron Ltd | Method and apparatus for cleaning treatment |
KR100508575B1 (ko) * | 1996-09-24 | 2005-10-21 | 동경 엘렉트론 주식회사 | 세정처리방법및장치와기판처리용장치 |
JPH10209102A (ja) * | 1997-01-17 | 1998-08-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US5840365A (en) * | 1997-02-07 | 1998-11-24 | The Fairchild Corporation | Method and apparatus for spin-coating compact discs |
US5916368A (en) * | 1997-02-27 | 1999-06-29 | The Fairchild Corporation | Method and apparatus for temperature controlled spin-coating systems |
JP3336898B2 (ja) * | 1997-02-28 | 2002-10-21 | 三菱電機株式会社 | シリコンウエハ表面の不純物回収方法およびその装置 |
US5908661A (en) * | 1997-05-30 | 1999-06-01 | The Fairchild Corporation | Apparatus and method for spin coating substrates |
US5916631A (en) * | 1997-05-30 | 1999-06-29 | The Fairchild Corporation | Method and apparatus for spin-coating chemicals |
TW384505B (en) * | 1997-07-04 | 2000-03-11 | Tokyo Electron Ltd | Coating device |
AU3784299A (en) * | 1998-05-04 | 1999-11-23 | Cfmt, Inc. | Wet processing methods for the manufacture of electronic components |
US6536454B2 (en) * | 2000-07-07 | 2003-03-25 | Sez Ag | Device for treating a disc-shaped object |
TW535991U (en) * | 2002-05-24 | 2003-06-01 | Winbond Electronics Corp | Barrier device |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US20060130767A1 (en) | 2004-12-22 | 2006-06-22 | Applied Materials, Inc. | Purged vacuum chuck with proximity pins |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
JP2007324249A (ja) * | 2006-05-31 | 2007-12-13 | Hitachi High-Technologies Corp | 基板処理装置、基板処理方法、及び基板の製造方法 |
JP5789546B2 (ja) * | 2011-04-26 | 2015-10-07 | 東京エレクトロン株式会社 | 塗布処理装置、塗布現像処理システム、並びに塗布処理方法及びその塗布処理方法を実行させるためのプログラムを記録した記録媒体 |
US20130101372A1 (en) * | 2011-10-19 | 2013-04-25 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
CN103456766B (zh) * | 2013-09-24 | 2016-03-16 | 四川虹视显示技术有限公司 | Oled面板减薄装置、减薄系统及减薄方法 |
US9209062B1 (en) * | 2014-05-28 | 2015-12-08 | Spintrac Systems, Inc. | Removable spin chamber with vacuum attachment |
CN111299070A (zh) * | 2018-12-11 | 2020-06-19 | 聚昌科技股份有限公司 | 消除扰流的液气分离式涂布机结构 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5927229B2 (ja) * | 1979-09-19 | 1984-07-04 | 富士通株式会社 | スピンナ− |
JPS58209744A (ja) * | 1982-05-31 | 1983-12-06 | Dainippon Screen Mfg Co Ltd | 回転式表面処理装置 |
JPS5990928A (ja) * | 1982-11-16 | 1984-05-25 | Dainippon Screen Mfg Co Ltd | 回転式表面処理装置 |
-
1986
- 1986-09-19 JP JP61223334A patent/JPS6377569A/ja active Granted
-
1987
- 1987-09-12 KR KR1019870010128A patent/KR920000674B1/ko not_active IP Right Cessation
- 1987-09-18 US US07/098,476 patent/US4838979A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPS6377569A (ja) | 1988-04-07 |
US4838979A (en) | 1989-06-13 |
KR920000674B1 (ko) | 1992-01-20 |
JPH0468028B2 (ko) | 1992-10-30 |
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A201 | Request for examination | ||
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Payment date: 19971222 Year of fee payment: 7 |
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