KR910018480A - 반도체 장치 캡슐 봉입 에폭시 수지 조성물 - Google Patents

반도체 장치 캡슐 봉입 에폭시 수지 조성물 Download PDF

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Publication number
KR910018480A
KR910018480A KR1019910005291A KR910005291A KR910018480A KR 910018480 A KR910018480 A KR 910018480A KR 1019910005291 A KR1019910005291 A KR 1019910005291A KR 910005291 A KR910005291 A KR 910005291A KR 910018480 A KR910018480 A KR 910018480A
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KR
South Korea
Prior art keywords
epoxy resin
composition
average particle
particle diameter
fused silica
Prior art date
Application number
KR1019910005291A
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English (en)
Other versions
KR950011902B1 (ko
Inventor
시로오 혼다
야스시 사와무라
마사유끼 다나까
게이지 가야바
도시히로 데시바
Original Assignee
원본미기재
도오레 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15923390A external-priority patent/JP2964559B2/ja
Priority claimed from JP33972190A external-priority patent/JP2964634B2/ja
Application filed by 원본미기재, 도오레 가부시끼가이샤 filed Critical 원본미기재
Publication of KR910018480A publication Critical patent/KR910018480A/ko
Application granted granted Critical
Publication of KR950011902B1 publication Critical patent/KR950011902B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

반도체 장치 캡슐 봉입 에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. (i) 비페닐 골격을 가진 이관능성 에폭시 수지(a1)와 나프탈렌 골격을 가진 이관능성 에폭시(a2)중 적어도 하나를 필수 성분으로 함유한 에폭시수지(A) (ii) 경화제 및 (iii) 평균 입경이 10㎛ 이하인 분쇄 융용 실리카(C1)97 내지 50wt%와 평균입경이 4㎛ 이하인 구형 용융 실리카(C2) 3내지 50wt%를 이루어지는 용융실리카(C)를 함유한 충전제로 이루어지고, 구형 용융 실리카의 평균 입경이 분쇄 용융 실리카의 평균입경보다 작고 충전제의 양이 조성물 총량에 대해 75내지 90wt%인 것을 특징으로하는 반도체 장치 캡슐 봉입 에폭시 수지 조성물.
  2. 제1항에 있어서, 분쇄 용융 실리카의 평균 입경이 7㎛ 미만인 것을 특징으로하는 조성물.
  3. 제1항에 있어서, 경화제가 페놀형 경화제인것을 특징으로하는 조성물.
  4. 제1항에 있어서, 스티렌형 블록 공중합체(D)를 더 포함하는 것을 특징으로 하는 조성물.
  5. 제1항에 있어서, (1) 에틸렌과 α-올레핀으로 이루어지는 군으로부터 선택한 적어도 한 화합물과 (2)불포화 카르복실산과 그 유도체로 이루어지는 군으로부터 선택한 적어도 한 화합물과의 공중합체(E)를 더 포함하는 것을 특징으로하는 조성물.
  6. 제1항에 있어서, 비페닐 골격을 가진 이관능성 에폭시 수지(a1)가 하기 식(I) :
    으로 나타내는 화합물인것을 특징으로 하는 조성물.
    식중 R1내지 R8은 별개로 수소원자, 할로겐 원자 또는 탄소수가 1내지 4인 저급 알킬기이다.
  7. 제1항에 있어서, 나프탈렌 골격을 가진 이관능성 에폭시 수지(a2)가 하기식(II) :
    으로 나타내는 화합물인것을 특징으로 하는 조성물.
    식중, R9내지 R16중 별개로로 나타내는 기를 나타내고 나머지는 별개로 수소원자, 할로겐원자 또는 탄소수가 1내지 4인 저급 알킬기를 나타낸다.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910005291A 1990-04-04 1991-04-02 반도체 장치 캡슐 봉입 에폭시 수지 조성물 KR950011902B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP9001890 1990-04-04
JP2-90018 1990-04-04
JP2-159233 1990-06-18
JP15923190 1990-06-18
JP2-159231 1990-06-18
JP15923390A JP2964559B2 (ja) 1990-06-18 1990-06-18 半導体封止用エポキシ樹脂組成物
JP2-339721 1990-11-30
JP33972190A JP2964634B2 (ja) 1990-11-30 1990-11-30 エポキシ組成物

Publications (2)

Publication Number Publication Date
KR910018480A true KR910018480A (ko) 1991-11-30
KR950011902B1 KR950011902B1 (ko) 1995-10-12

Family

ID=27467726

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910005291A KR950011902B1 (ko) 1990-04-04 1991-04-02 반도체 장치 캡슐 봉입 에폭시 수지 조성물

Country Status (5)

Country Link
US (1) US5360837A (ko)
EP (1) EP0450944B1 (ko)
KR (1) KR950011902B1 (ko)
CA (1) CA2039669A1 (ko)
DE (1) DE69113666T2 (ko)

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JP3359410B2 (ja) * 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法
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Also Published As

Publication number Publication date
CA2039669A1 (en) 1991-10-05
DE69113666D1 (de) 1995-11-16
US5360837A (en) 1994-11-01
KR950011902B1 (ko) 1995-10-12
EP0450944A3 (en) 1992-01-15
DE69113666T2 (de) 1996-05-09
EP0450944A2 (en) 1991-10-09
EP0450944B1 (en) 1995-10-11

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