KR910018513A - 다이 부착용 접착제 조성물 - Google Patents

다이 부착용 접착제 조성물 Download PDF

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KR910018513A
KR910018513A KR1019910006679A KR910006679A KR910018513A KR 910018513 A KR910018513 A KR 910018513A KR 1019910006679 A KR1019910006679 A KR 1019910006679A KR 910006679 A KR910006679 A KR 910006679A KR 910018513 A KR910018513 A KR 910018513A
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composition
weight
resin
composition according
compound
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KR1019910006679A
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KR940004204B1 (ko
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맨-승찬
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미리암 디. 메코너헤이
이. 아이. 듀우판 드 네모아 앤드 캄파니
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/93—Reaction product of a polyhydric phenol and epichlorohydrin or diepoxide, having a molecular weight of over 5,000, e.g. phenoxy resins

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

내용 없음.

Description

다이 부착용 접착제 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (13)

  1. (a)하기(b)성분중에 분산된 편상(片狀)은 입자 60 내지 80중량%, 및 (b)열가소성 페녹시계 수지 92 내지 99.5중량% 및 열가교결합성 수지 8 내지 0.5중량%를 주성분으로 하고, Tg가 80내지 160℃이며, 인장 계수가 0.07×105㎏/㎠(1.0×105psi)이상인, 할라이드를 함유하지 않는 균질한 무정형 고상 중합체 매트릭스 40 내지 20 중량%로 이루어짐을 특징으로 하는, 고표면에너지의 무기 기판에 IC칩을 부착시키기 위한 접착제 조성물.
  2. 제1항에 있어서, 상기(a)성분이 65내지 75중량%의 편상 은인 것을 특징으로 하는 조성물.
  3. 제1항에 있어서, 상기 열 가교결합성 수지가 열 반응성 레졸 수지인 것을 특징으로 하는 조성물.
  4. 제1항에 있어서, 6내지 2중량%의 열 가교결합성 수지를 함유하는 것을 특징으로 하는 조성물.
  5. 제1항에 있어서, 상기 열 가교결합성 수지가 멜라민-프롬알데히드 수지인 것을 특징으로 하는 조성물.
  6. 제1항에 있어서, 상기 페녹시계 수지가 하기 일반식으로 나타내어지는 것을 특징으로 하는 조성물.
    상기 식에서,
    및
    로 이루어지는 군 중에서 선택된다.
  7. 제5항에 있어서, X가인 것을 특징으로 하는 조성물.
  8. 제5항에 있어서, X가인 것을 특징으로 하는 조성물.
  9. 제5항에 있어서, X가인 것을 특징으로 하는 조성물.
  10. 제1항에 있어서, 상기 중합체 매트릭스의 Tg가 100내지 120℃인 것을 특징으로 하는 조성물.
  11. 자기 지지성(self-supporting)리본의 형태를 갖는 제1항에 따른 조성물.
  12. 적어도 한쪽 표면이 제1항에 따른 조성물로 피복된 고에너지 물질 기판 피막.
  13. (a)하기 (b)성분 중에 분산된 미분 편상은 입자 60 내지 80중량%, 및 (b)비휘발성 유기 용매 중에 용해된 열가소성 페녹시계 수지 92 내지 99.5 중량% 및 열 가교결합성 수지 8 내지 0.5 중량%를 주성분으로 하고, Tg가 80 내지 160℃이며, 인장 계수가 0.07×105㎏/㎠(1.0×105psi)이상인, 할라이드를 함유하지 않는 균질한 무정형 고상 중합체 매트릭스 40 내지 20 중량%로 이루어지는 것을 특징으로 하는 후막 페시스트 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910006679A 1989-10-20 1991-04-25 다이 부착용 접착제 조성물 KR940004204B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US515,698 1983-07-21
US42538989A 1989-10-20 1989-10-20
US07/515,698 US5006575A (en) 1989-10-20 1990-04-26 Die attach adhesive composition

Publications (2)

Publication Number Publication Date
KR910018513A true KR910018513A (ko) 1991-11-30
KR940004204B1 KR940004204B1 (ko) 1994-05-17

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KR (1) KR940004204B1 (ko)

Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
US5200264A (en) * 1989-09-05 1993-04-06 Advanced Products, Inc. Thermoset polymer thick film compositions and their use as electrical circuitry
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
US5471017A (en) * 1994-05-31 1995-11-28 Texas Instruments Incorporated No fixture method to cure die attach for bonding IC dies to substrates
US6099959A (en) * 1998-07-01 2000-08-08 International Business Machines Corporation Method of controlling the spread of an adhesive on a circuitized organic substrate
US6426552B1 (en) 2000-05-19 2002-07-30 Micron Technology, Inc. Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
EP1649322A4 (en) 2003-07-17 2007-09-19 Honeywell Int Inc PLANARIZATION FILMS FOR ADVANCED MICROELECTRONIC DEVICES AND APPLICATIONS AND METHODS FOR PRODUCING SAID FILMS
US20050239947A1 (en) * 2004-02-27 2005-10-27 Greenhill David A Polymeric silver layer
EP1736520B1 (en) 2004-03-19 2014-04-30 Sumitomo Bakelite Company, Ltd. Resin composition and semiconductor devices made by using the same
US7392096B2 (en) * 2004-08-19 2008-06-24 Ferrari R Keith Multifunction electrode and method of making same
US7169644B2 (en) * 2004-08-19 2007-01-30 Ferrari R Keith Method of making multifunction electrode
CN102056973B (zh) * 2008-07-22 2014-02-12 E.I.内穆尔杜邦公司 用于薄膜光伏电池的聚合物厚膜银电极组合物
CN112809019B (zh) * 2021-02-07 2022-02-22 深圳市宏达瑞科技有限公司 一种异质结太阳能电池低温银浆用银粉的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587038A (en) * 1980-06-26 1986-05-06 Canon Kabushiki Kaisha Electro-optic display device and a method of producing the same
US4516836A (en) * 1982-09-20 1985-05-14 Crystaloid Electronics Company Conductor for use in electro-optical displays
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
IT1161062B (it) * 1983-02-16 1987-03-11 Italiane Vernici Ind Conduttore elettrico isolato e procedimento per la sua preparazione
US4595606A (en) * 1984-07-18 1986-06-17 Rohm And Haas Company Solderable conductive compositions having high adhesive strength
US4732702A (en) * 1986-02-13 1988-03-22 Hitachi Chemical Company, Ltd. Electroconductive resin paste
US4880570A (en) * 1986-03-31 1989-11-14 Harris Corporation Electroconductive adhesive
JPH0668091B2 (ja) * 1987-10-27 1994-08-31 三菱電機株式会社 熱硬化性絶縁樹脂ペースト

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KR940004204B1 (ko) 1994-05-17

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