KR840001343A - 방사(radiation)중합성 혼합물과 이들로부터 제조되는 광중합성복사물 - Google Patents

방사(radiation)중합성 혼합물과 이들로부터 제조되는 광중합성복사물 Download PDF

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KR840001343A
KR840001343A KR1019820003838A KR820003838A KR840001343A KR 840001343 A KR840001343 A KR 840001343A KR 1019820003838 A KR1019820003838 A KR 1019820003838A KR 820003838 A KR820003838 A KR 820003838A KR 840001343 A KR840001343 A KR 840001343A
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South Korea
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compound
group
polymerizable
spinning
photopolymerizable
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KR1019820003838A
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KR880002535B1 (ko
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게이젤레르 울리휘 (외 1)
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베르라우페르, 에울레르
훽스트 아크티엔 게젤샤프트
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Application filed by 베르라우페르, 에울레르, 훽스트 아크티엔 게젤샤프트 filed Critical 베르라우페르, 에울레르
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Graft Or Block Polymers (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Prostheses (AREA)
  • Pinball Game Machines (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)

Abstract

내용 없음

Description

방사(radiation)중합성 혼합물과 이들로부터 제조되는 광중합성복사물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. (a) 2개 이상의 에틸렌성 불포화 말단기를 갖고 또 유리레디칼 반응이 개시될 수 있는 첨가제의 첨가로 사슬중합반응을 일으켜 교차결합 중합체를 형성할 수 있는 화합물, (b) 중합성 결합제와 (c) 방사(radiation)에 의해 활성화시킬 수 있고, 또 초가로 중합성 결합제 (b); (a) 화합물의 중합 생성물과/또는 그 자신과 열에 의해 교차 결합할 수 있으며, 또 교차 결합기가 에폭시기로서 3개 이상의 에폭시기를 갖는 화합물(d)를 갖는 중합개시제를 함유하는 방사 중합성 혼합물.
  2. 제1항에 있어서 교체결합성 화합물을 0.5내지 30중량%함유하는 방사 중합성 혼합물.
  3. 제1항에 있어서, 교체결합성 화합물을 함유하고, 교차결합기로서 에폭시기 또는 일반식-CH2-C-R을 갖는기를 함유하며 또 이 화합물에서 -CH2OR기는 고리형 카복사미드의 개방사슬 질소원자나 또는 포름알데히드와 축합할 수 있는 화합물의 방향족 탄소원자와 결합되는 방사 중합성 혼합물(단, 여기서 R는 수소원자 또는 저급알킬, 아실 또는 하이드록시 알킬기이다.)
  4. 제1항에 있어서 교체결합성 화합물이 2개 이상의 교차결합기를 함유하는 방사 중합성 혼합물.
  5. 제1항에 있어서, 교체결합성 화합물로서 사용피복용매에 불용성인 에폭시 화합물을 함유하는 방사 중합성 혼합물.
  6. 제1항에 있어서, 중합성 화합물이 불포화기로서 아크릴레이트기 또는 메틸크릴레이트기를 함유하는 방사 중합성 혼합물.
  7. 제1항에 있어서 중합성 결합제가 물에 불용성이고, 또 알카리 수용액에는 가용성이거나 적어도 팽윤성인 방사 중합성 혼합물.
  8. (a) 2개 이상의 에틸렌성 불포화 말단기를 갖고, 또 유리레디칼 반응이 개시될 수 있는 첨가제의 첨가로 사슬중합반응을 일으켜 교차결합 중합체를 형성할 수 있는 화합물, (b) 중합성 결합제와 (c) 광중합성 개시제를 함유하는 이동기능 열경화 광중합성층과 유연성을 갖는 투명한 임시지지체를 갖고 또 광중합성층이 추가로 중합성 결합체(b), (a)화합물의 중합 생성물과/또는 그 자신과 열에 의해 교차결합을 할 수 있으며, 또 교차결합기가 에폭시기로서 3개 이상의 에폭시기를 갖는 화합물 (d)를 함유하는 광중합성복사질.
  9. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR8203838A 1981-08-28 1982-08-26 조사 중합성 혼합물 및 이로부터 제조한 광중합성 복사재료 KR880002535B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813134123 DE3134123A1 (de) 1981-08-28 1981-08-28 Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial
DEP3134123.3 1981-08-28

Publications (2)

Publication Number Publication Date
KR840001343A true KR840001343A (ko) 1984-04-30
KR880002535B1 KR880002535B1 (ko) 1988-11-28

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KR8203838A KR880002535B1 (ko) 1981-08-28 1982-08-26 조사 중합성 혼합물 및 이로부터 제조한 광중합성 복사재료

Country Status (15)

Country Link
US (1) US4438189A (ko)
EP (1) EP0073444B1 (ko)
JP (1) JPS5842040A (ko)
KR (1) KR880002535B1 (ko)
AT (1) ATE18470T1 (ko)
AU (1) AU552582B2 (ko)
CA (1) CA1185389A (ko)
DE (2) DE3134123A1 (ko)
ES (1) ES8400608A1 (ko)
FI (1) FI73841C (ko)
HK (1) HK28187A (ko)
IL (1) IL66659A (ko)
MY (1) MY8700458A (ko)
SG (1) SG6787G (ko)
ZA (1) ZA825843B (ko)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990846A (ja) * 1982-11-16 1984-05-25 Toray Ind Inc 感放射線材料
JPS59218441A (ja) * 1983-04-25 1984-12-08 Nippon Soda Co Ltd 発色性感光性樹脂組成物
DE3328285A1 (de) * 1983-08-05 1985-02-21 Basf Ag, 6700 Ludwigshafen Verfahren zur herstellung von lichtgehaerteten schichten mit definierter haerte
DE3329443A1 (de) * 1983-08-16 1985-03-07 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch und daraus hergestelltes kopiermaterial
US4476215A (en) * 1983-11-25 1984-10-09 Minnesota Mining And Manufacturing Company Negative-acting photoresist composition
DE3565013D1 (en) * 1984-02-10 1988-10-20 Ciba Geigy Ag Process for the preparation of a protection layer or a relief pattern
DE3412992A1 (de) * 1984-04-06 1985-10-24 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht
DE3418190A1 (de) * 1984-05-16 1985-11-21 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Verfahren zur datenspeicherung in und datenauslesung aus resistschichten
US4600683A (en) * 1985-04-22 1986-07-15 International Business Machines Corp. Cross-linked polyalkenyl phenol based photoresist compositions
US4931381A (en) * 1985-08-12 1990-06-05 Hoechst Celanese Corporation Image reversal negative working O-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment
US5256522A (en) * 1985-08-12 1993-10-26 Hoechst Celanese Corporation Image reversal negative working O-naphthoquinone diazide and cross-linking compound containing photoresist process with thermal curing
US5217840A (en) * 1985-08-12 1993-06-08 Hoechst Celanese Corporation Image reversal negative working o-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment and element produced therefrom
DE3662952D1 (en) * 1985-08-12 1989-05-24 Hoechst Celanese Corp Process for obtaining negative images from positive photoresists
US4755446A (en) * 1987-01-12 1988-07-05 E. I. Du Pont De Nemours And Company Photosensitive compositions containing microcapsules concentrated in surface layer
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
US5070002A (en) * 1988-09-13 1991-12-03 Amp-Akzo Corporation Photoimageable permanent resist
US5178988A (en) * 1988-09-13 1993-01-12 Amp-Akzo Corporation Photoimageable permanent resist
US5114830A (en) * 1988-10-28 1992-05-19 W. R. Grace & Co.-Conn. Solder mask resins having improved stability containing a multifunctional epoxide and a partial ester or styrene-maleic anhydride copolymer
DE3931467A1 (de) * 1989-09-21 1991-04-04 Hoechst Ag Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske
US5217847A (en) * 1989-10-25 1993-06-08 Hercules Incorporated Liquid solder mask composition
US5153102A (en) * 1990-08-10 1992-10-06 Industrial Technology Research Institute Alkalline-solution-developable liquid photographic composition
US5206116A (en) * 1991-03-04 1993-04-27 Shipley Company Inc. Light-sensitive composition for use as a soldermask and process
GB9105561D0 (en) * 1991-03-15 1991-05-01 Coates Brothers Plc Image formation
GB2257549B (en) * 1991-07-06 1995-05-03 Motorola Israel Ltd Modular data/control equipment
JP2706859B2 (ja) * 1991-07-30 1998-01-28 富士写真フイルム株式会社 光硬化性樹脂組成物、保護層の形成方法及びカラーフイルター
GB2259916A (en) * 1991-09-27 1993-03-31 Coates Brothers Plc Solder-resist, heat-curable compositions
JP2989064B2 (ja) * 1991-12-16 1999-12-13 日本ゼオン株式会社 金属蒸着膜のパターン形成方法
JP2814746B2 (ja) * 1992-02-24 1998-10-27 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー プリント回路のための柔軟性の水性処理可能な光画像形成性永久被膜
JPH08319456A (ja) * 1995-04-28 1996-12-03 E I Du Pont De Nemours & Co 印刷回路用の水系処理可能な軟質の光画像化可能耐久被覆材
US5643657A (en) * 1995-04-28 1997-07-01 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
US6482551B1 (en) * 1998-03-24 2002-11-19 Inphase Technologies Optical article and process for forming article
DE60205664T2 (de) * 2001-12-06 2006-03-02 Huntsman Advanced Materials (Switzerland) Gmbh Wärmehärtbare harzzusammensetzung
AU2002356681A1 (en) * 2001-12-06 2003-06-17 Vantico Ag Resin composition
US20050082468A1 (en) * 2003-09-15 2005-04-21 Konstandinos Zamfes Drilling Cutting Analyzer System and methods of applications.
US20080202811A1 (en) * 2003-09-15 2008-08-28 Konstandinos Zamfes Drilling Cutting Analyzer System and Methods of Applications
JP4401262B2 (ja) * 2004-02-02 2010-01-20 富士フイルム株式会社 平版印刷版原版
US20060154180A1 (en) 2005-01-07 2006-07-13 Kannurpatti Anandkumar R Imaging element for use as a recording element and process of using the imaging element
JP2006301404A (ja) * 2005-04-22 2006-11-02 Tokyo Ohka Kogyo Co Ltd 現像液組成物およびその製造方法、ならびにレジストパターンの形成方法
US7618766B2 (en) * 2005-12-21 2009-11-17 E. I. Du Pont De Nemours And Company Flame retardant photoimagable coverlay compositions and methods relating thereto
US7846639B2 (en) 2006-06-30 2010-12-07 E. I. Du Pont De Nemours And Company Imaging element having a photoluminescent tag and process of using the imaging element to form a recording element
US7527915B2 (en) * 2006-07-19 2009-05-05 E. I. Du Pont De Nemours And Company Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto
US7780801B2 (en) * 2006-07-26 2010-08-24 International Business Machines Corporation Flux composition and process for use thereof
GB2525041B (en) 2014-04-11 2021-11-03 Sam Systems 2012 Ltd Sound capture method and apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3776729A (en) * 1971-02-22 1973-12-04 Ibm Photosensitive dielectric composition and process of using the same
US4025348A (en) 1974-05-10 1977-05-24 Hitachi Chemical Company, Ltd. Photosensitive resin compositions
US4043819A (en) 1974-06-11 1977-08-23 Ciba-Geigy Ag Photo-polymerizable material for the preparation of stable polymeric images and process for making them by photopolymerization in a matrix
JPS592018B2 (ja) 1975-03-26 1984-01-17 住友化学工業株式会社 カイリヨウサレタカンコウセイジユシソセイブツカラナルゲンケイ
EP0002040B1 (de) * 1977-11-21 1981-12-30 Ciba-Geigy Ag Verfahren zur Herstellung von Lötstoppmasken auf gedruckten Schaltungen mit Druckkontaktierungsbohrungen
DE2822190A1 (de) 1978-05-20 1979-11-22 Hoechst Ag Photopolymerisierbares gemisch
US4296196A (en) 1978-05-20 1981-10-20 Hoechst Aktiengesellschaft Photopolymerizable mixture in a transfer element
US4278752A (en) 1978-09-07 1981-07-14 E. I. Du Pont De Nemours And Company Flame retardant radiation sensitive element
US4361640A (en) 1981-10-02 1982-11-30 E. I. Du Pont De Nemours And Company Aqueous developable photopolymer compositions containing terpolymer binder

Also Published As

Publication number Publication date
FI822966L (fi) 1983-03-01
ES515332A0 (es) 1983-11-01
AU8721782A (en) 1983-03-03
ZA825843B (en) 1983-06-29
AU552582B2 (en) 1986-06-05
IL66659A (en) 1985-11-29
CA1185389A (en) 1985-04-09
ES8400608A1 (es) 1983-11-01
EP0073444A2 (de) 1983-03-09
FI73841B (fi) 1987-07-31
HK28187A (en) 1987-04-16
FI73841C (fi) 1987-11-09
US4438189A (en) 1984-03-20
KR880002535B1 (ko) 1988-11-28
IL66659A0 (en) 1982-12-31
JPS5842040A (ja) 1983-03-11
EP0073444A3 (en) 1983-06-15
DE3134123A1 (de) 1983-03-17
ATE18470T1 (de) 1986-03-15
DE3269632D1 (en) 1986-04-10
EP0073444B1 (de) 1986-03-05
SG6787G (en) 1987-06-05
FI822966A0 (fi) 1982-08-26
MY8700458A (en) 1987-12-31

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