KR830010403A - 방사선-중합성 혼합물 및 그 광중합 복사물집 - Google Patents

방사선-중합성 혼합물 및 그 광중합 복사물집 Download PDF

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KR830010403A
KR830010403A KR1019820001623A KR820001623A KR830010403A KR 830010403 A KR830010403 A KR 830010403A KR 1019820001623 A KR1019820001623 A KR 1019820001623A KR 820001623 A KR820001623 A KR 820001623A KR 830010403 A KR830010403 A KR 830010403A
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South Korea
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radiation
polymerizable
group
compound
integer
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KR1019820001623A
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KR890000802B1 (ko
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헤르비히 발테르
데케르 루돌프
시코라 헬가
에르베스 크루트
Original Assignee
윌리 웨트라우훠, 크루트 에울러
덱스트 아크티엔 게젤샤프트
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Publication of KR830010403A publication Critical patent/KR830010403A/ko
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Publication of KR890000802B1 publication Critical patent/KR890000802B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
    • C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Production Of Liquid Hydrocarbon Mixture For Refining Petroleum (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Dental Preparations (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Cephalosporin Compounds (AREA)

Abstract

내용 없음

Description

방사선-중합성 혼합물 및 그 광중합 복사물집
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. a) 2개 이상의 말단 에틸렌성 불포화 그룹을 가지며 유리기에 의해 개시되는 첨가에 의한 직쇄 중합 방법으로 가고 결합 중합체를 형성할 수 있는 화합물. b) 중합성 결합제 및 c) 방사선으로 활성화될 수 있는 중합개시제와 그 이외에 d)분자내에 2개의 에폭시그룹 및 1500 이하의 분자량을 갖는 혼합물을 함유하는 방사선-중합성 혼합물
  2. 2개의 에폭시그룹 1.5 내지 10중량%로 된 화합물을 함유하는 방사선-중합성 혼합물
  3. 제1항에 있어서, 2개의 에폭시그룹을 갖는 화합물은 디하이드릭알콜 및 페놀의 비스-글리시딜에테르인 방사선-중합성 혼합물
  4. 제3항에 있어서, 2개의 에폭시 그룹을 갖는 화합물은 다음 일반식
    (여기서 Z는 탄소수 2내지 6의 알킬렌 또는 히드록시알킬렌 그룹이며) 또는
    (R1는 수소원자 또는 메틸그룹 n1및 n2는 0 내지 10의 정수 n3는 0 또는 1 내지 4의 정수) 그룹에 대응하는 방사선-중합성 혼합물
  5. 제1항에 있어서 중합성 화합물이 불포화 그룹으로 아크릴에이트 또는 메타크릴에이트그룹을 함유하는 방사선-중합성 혼합물
  6. 제5항에 있어서 사용된 중합성 화합물이 디하이드릭 또는 폴리하이드릭 1급 알콜의 아크릴에이트 또는 메타크릴에이트의 혼합물 및 하기 일반식의 폴리우레탄인 방사선 중합성 혼합물
    여기서 Q는 저급알킬그룹에 의하여 미치환 또는 치환되고 연결부분으로 저급알킬렌 그룹을 함유하는 2가의 단핵 또는 2핵 방향족기이며 X는 -O-PH-X′-PH-O- 및 -OOC-(CH2)y-COO- 그룹중의 하나(여기서 Ph는 임의로 치환된 페닐렌 그룹이고 X′는 탄소원자 1 내지 4의 알킬렌 그룹이고 Y는 2내지 12의 정수)이며 R은 수소원자 또는 메틸그룹 AK는 탄소원자 2내지 4의 알킬렌기 m은 4 내지 50의 정수 n는 1 내지 6의 정수 0는 4 내지 20의 정수이다.
  7. 제1항에 있어서 중합성 결합제는 수불응성이며 알카리. 수용액에서 용해 또는 적어도 팽윤되는 방사선-중합성 혼합물
  8. 제1항에 있어서 한개는 투사에 의하여 색깔이 변하며 200℃ 이상에서 색깔이 손실되며 다른 한개는 투사 및 200℃이상에서 변화가 없는 2개의 염료를 함유하는 방사선-중합성 혼합물
  9. a) 2개 이상의 말단 에틸렌성 불포화된 그룹을 가지며 유리기에 의해 개시되는 첨가에 의한 직쇄 중합 방법으로 가고 결합 중합체를 형성할 수 있는 화합물. b) 중합성 결합제 및 c) 광중합 개시제(여기서 층은 부가적으로) d)분자내에 2개의 에폭시그룹 및 1500 이내의 분자량을 갖는 화합물을 함유한다)을 함유하며 유동성의 투명한 일시적인 지지체 및 전환성의 열경화 광중합성 층을 갖는 광중합성 복사물질
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR8201623A 1981-04-13 1982-04-13 방사선-중합가능성 혼합물 및 이로부터 제조한 광중합가능성 복사물질 KR890000802B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE3114931.6 1981-04-13
DE19813114931 DE3114931A1 (de) 1981-04-13 1981-04-13 Durch strahlung polymerisierbares gemisch und daraus hergestelltes photopolymerisierbares kopiermaterial
JP???? 1982-04-12

Publications (2)

Publication Number Publication Date
KR830010403A true KR830010403A (ko) 1983-12-30
KR890000802B1 KR890000802B1 (ko) 1989-04-07

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KR8201623A KR890000802B1 (ko) 1981-04-13 1982-04-13 방사선-중합가능성 혼합물 및 이로부터 제조한 광중합가능성 복사물질

Country Status (14)

Country Link
US (1) US4485166A (ko)
EP (1) EP0063304B1 (ko)
JP (1) JPS57178237A (ko)
KR (1) KR890000802B1 (ko)
AT (1) ATE15728T1 (ko)
AU (1) AU548860B2 (ko)
BR (1) BR8202101A (ko)
CA (1) CA1185387A (ko)
DE (2) DE3114931A1 (ko)
ES (1) ES8308091A1 (ko)
FI (1) FI69714C (ko)
HK (1) HK56486A (ko)
SG (1) SG42586G (ko)
ZA (1) ZA822386B (ko)

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Also Published As

Publication number Publication date
AU8250582A (en) 1983-04-21
ES511340A0 (es) 1983-08-01
ES8308091A1 (es) 1983-08-01
FI69714C (fi) 1986-03-10
EP0063304A2 (de) 1982-10-27
ZA822386B (en) 1983-02-23
KR890000802B1 (ko) 1989-04-07
HK56486A (en) 1986-08-08
SG42586G (en) 1987-09-18
AU548860B2 (en) 1986-01-02
FI821260L (fi) 1982-10-14
FI69714B (fi) 1985-11-29
US4485166A (en) 1984-11-27
FI821260A0 (fi) 1982-04-08
EP0063304A3 (en) 1983-07-20
DE3114931A1 (de) 1982-10-28
JPS57178237A (en) 1982-11-02
EP0063304B1 (de) 1985-09-18
CA1185387A (en) 1985-04-09
DE3266301D1 (en) 1985-10-24
BR8202101A (pt) 1983-03-22
ATE15728T1 (de) 1985-10-15

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