ES8308091A1 - Mejoras introducidas en un procedimiento para la preparacion de materiales fotorresistentes. - Google Patents

Mejoras introducidas en un procedimiento para la preparacion de materiales fotorresistentes.

Info

Publication number
ES8308091A1
ES8308091A1 ES511340A ES511340A ES8308091A1 ES 8308091 A1 ES8308091 A1 ES 8308091A1 ES 511340 A ES511340 A ES 511340A ES 511340 A ES511340 A ES 511340A ES 8308091 A1 ES8308091 A1 ES 8308091A1
Authority
ES
Spain
Prior art keywords
radiation
copying material
photopolymerisable
material made
made therefrom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES511340A
Other languages
English (en)
Other versions
ES511340A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Original Assignee
Hoechst AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst AG filed Critical Hoechst AG
Publication of ES511340A0 publication Critical patent/ES511340A0/es
Publication of ES8308091A1 publication Critical patent/ES8308091A1/es
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
    • C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Liquid Hydrocarbon Mixture For Refining Petroleum (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Dental Preparations (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Cephalosporin Compounds (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PROCEDIMIENTO PARA LA PREPARACION DE MATERIALES FOTORRESISTENTES. COMPRENDE LAS SIGUIENTES OPERACIONES: PRIMERA, SE PREPARA UNA CAPA FOTOSENSIBLE TERMOPLASTICA CONSTITUIDA POR UNA MEZCLA POLIMERIZABLE QUE CONTIENE UN COMPUESTO FORMADO POR DOS GRUPOS ETILENICAMENTE INSATURADOS TERMINALES, POR UN LIGANTE POLIMERICO, POR UN INICIADOR DE LA POLIMERIZACION QUE PUEDE ACTIVARSE POR RADIACION, Y POR UN COMPUESTO CON DOS GRUPOS EPOXI; SEGUNDA, SE APLICA DICHA CAPA FOTOSENSIBLE SOBRE UNA SUPERFICIE METALICA MEDIANTE CALOR Y PRESION; TERCERA, SE EXPONE DICHA SUPERFICIE METALICA RECUBIERTA A LA LUZ ACTINICA PARA POLIMERIZAR DICHA CAPA EN LAS AREAS EXPUESTAS; Y POR ULTIMO, SE REVELA DICHA CAPA Y SE CALIENTA EL ESTARCIDO FOTORRESISTENTE, ASI OBTENIDO, A UNA TEMPERATURA COMPRENDIDA ENTRE 80 Y 150 GRADOS.
ES511340A 1981-04-13 1982-04-08 Mejoras introducidas en un procedimiento para la preparacion de materiales fotorresistentes. Expired ES8308091A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813114931 DE3114931A1 (de) 1981-04-13 1981-04-13 Durch strahlung polymerisierbares gemisch und daraus hergestelltes photopolymerisierbares kopiermaterial

Publications (2)

Publication Number Publication Date
ES511340A0 ES511340A0 (es) 1983-08-01
ES8308091A1 true ES8308091A1 (es) 1983-08-01

Family

ID=6130064

Family Applications (1)

Application Number Title Priority Date Filing Date
ES511340A Expired ES8308091A1 (es) 1981-04-13 1982-04-08 Mejoras introducidas en un procedimiento para la preparacion de materiales fotorresistentes.

Country Status (14)

Country Link
US (1) US4485166A (es)
EP (1) EP0063304B1 (es)
JP (1) JPS57178237A (es)
KR (1) KR890000802B1 (es)
AT (1) ATE15728T1 (es)
AU (1) AU548860B2 (es)
BR (1) BR8202101A (es)
CA (1) CA1185387A (es)
DE (2) DE3114931A1 (es)
ES (1) ES8308091A1 (es)
FI (1) FI69714C (es)
HK (1) HK56486A (es)
SG (1) SG42586G (es)
ZA (1) ZA822386B (es)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3320183A1 (de) * 1983-06-03 1984-12-06 ANT Nachrichtentechnik GmbH, 7150 Backnang Verfahren zum herstellen gedruckter schaltungen
DE3412992A1 (de) * 1984-04-06 1985-10-24 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht
US4615950A (en) * 1985-03-15 1986-10-07 M&T Chemicals Inc. Printed circuit boards having improved adhesion between solder mask and metal
GB8511861D0 (en) * 1985-05-10 1985-06-19 Bourne E Printed circuit boards
DE3785550T2 (de) * 1986-12-02 1993-11-04 Du Pont Photosensible zusammensetzung mit verbesserter haftung, gegenstaende und verfahren.
EP0276716A3 (en) * 1987-01-30 1989-07-26 General Electric Company Uv curable epoxy resin compositions with delayed cure
DE3710282A1 (de) * 1987-03-28 1988-10-13 Hoechst Ag Photopolymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial
JPS6462375A (en) * 1987-09-02 1989-03-08 Arakawa Chem Ind Liquid photosolder resist ink composition of alkali development type
DE3735088A1 (de) * 1987-10-16 1989-04-27 Hoechst Ag Photopolymerisierbares gemisch
US5364736A (en) * 1987-12-07 1994-11-15 Morton International, Inc. Photoimageable compositions
AU2912889A (en) * 1987-12-07 1989-07-05 Morton Thiokol, Inc. Photoimageable compositions containing acrylic polymers and epoxy resins
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
US5114830A (en) * 1988-10-28 1992-05-19 W. R. Grace & Co.-Conn. Solder mask resins having improved stability containing a multifunctional epoxide and a partial ester or styrene-maleic anhydride copolymer
DE3931467A1 (de) * 1989-09-21 1991-04-04 Hoechst Ag Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske
ES2080094T3 (es) * 1990-11-30 1996-02-01 Siemens Ag Procedimiento para dotar de soldadura placas de circuitos impresos.
JP2706859B2 (ja) * 1991-07-30 1998-01-28 富士写真フイルム株式会社 光硬化性樹脂組成物、保護層の形成方法及びカラーフイルター
US5315070A (en) * 1991-12-02 1994-05-24 Siemens Aktiengesellschaft Printed wiring board to which solder has been applied
DE4336901A1 (de) * 1993-10-28 1995-05-04 Du Pont Deutschland Photopolymerisierbares Gemisch und Verfahren zur Herstellung von Lötstopmasken
DE9420640U1 (de) * 1994-12-23 1995-03-23 Lord Corp., Cary, N.C. Strahlungsaushärtbare Zusammensetzungen mit einem Gehalt an hydroxy-terminierten Polyurethanen und einer Epoxy-Verbindung
US6320139B1 (en) 1998-11-12 2001-11-20 Rockwell Automation Technologies, Inc. Reflow selective shorting
US20060154180A1 (en) 2005-01-07 2006-07-13 Kannurpatti Anandkumar R Imaging element for use as a recording element and process of using the imaging element
US7618766B2 (en) * 2005-12-21 2009-11-17 E. I. Du Pont De Nemours And Company Flame retardant photoimagable coverlay compositions and methods relating thereto
WO2007074890A1 (ja) * 2005-12-28 2007-07-05 Kaneka Corporation 熱ラジカル硬化／熱潜在硬化型エポキシ併用硬化性組成物
JP5256646B2 (ja) * 2006-05-31 2013-08-07 三菱化学株式会社 液晶表示装置
US7527915B2 (en) * 2006-07-19 2009-05-05 E. I. Du Pont De Nemours And Company Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661576A (en) * 1970-02-09 1972-05-09 Brady Co W H Photopolymerizable compositions and articles
DE2064080C3 (de) * 1970-12-28 1983-11-03 Hoechst Ag, 6230 Frankfurt Lichtempfindliches Gemisch
US3776729A (en) * 1971-02-22 1973-12-04 Ibm Photosensitive dielectric composition and process of using the same
US3876432A (en) * 1972-09-11 1975-04-08 Sun Chemical Corp Fatty ester modified epoxy resin photopolymerizable compositions
CA1032392A (en) * 1973-10-23 1978-06-06 Eugene D. Feit High energy radiation curable resist and preparatory process
DE2363806B2 (de) * 1973-12-21 1979-05-17 Hoechst Ag, 6000 Frankfurt Lichtempfindliches Gemisch
US4025348A (en) * 1974-05-10 1977-05-24 Hitachi Chemical Company, Ltd. Photosensitive resin compositions
US4065315A (en) * 1976-04-26 1977-12-27 Dynachem Corporation Phototropic dye system and photosensitive compositions containing the same
SU941918A1 (ru) * 1976-08-10 1982-07-07 Предприятие П/Я Г-4444 Сухой пленочный фоторезист
CA1116919A (en) * 1976-10-27 1982-01-26 Joseph E. Gervay Flame retardant radiation sensitive element of photopolymerizable composition containing halogen and an acrylonitrile containing polymeric binder
US4146453A (en) * 1977-05-16 1979-03-27 Stauffer Chemical Company Photopolymerizable composition stabilized with epoxide compounds and process
JPS5471579A (en) * 1977-11-17 1979-06-08 Matsushita Electric Ind Co Ltd Electron beam resist
EP0002040B1 (de) * 1977-11-21 1981-12-30 Ciba-Geigy Ag Verfahren zur Herstellung von Lötstoppmasken auf gedruckten Schaltungen mit Druckkontaktierungsbohrungen
DE2807933A1 (de) * 1978-02-24 1979-08-30 Hoechst Ag Photopolymerisierbares gemisch
US4278752A (en) * 1978-09-07 1981-07-14 E. I. Du Pont De Nemours And Company Flame retardant radiation sensitive element
DE2841880A1 (de) * 1978-09-26 1980-04-03 Bayer Ag Trockenfotoresistmaterial
CA1154287A (en) * 1979-02-26 1983-09-27 Joseph E. Gervay Dry-developing photosensitive dry film resist
US4248958A (en) * 1979-05-23 1981-02-03 Hoechst Aktiengesellschaft Photopolymerizable mixture containing polyurethanes
US4227978A (en) * 1979-06-27 1980-10-14 Minnesota Mining And Manufacturing Company Photohardenable composition
SU900244A1 (ru) * 1980-01-07 1982-01-23 Институт химии высокомолекулярных соединений АН УССР Фотополимеризующа с композици дл изготовлени печатных форм
JPS56100817A (en) * 1980-01-16 1981-08-13 Hitachi Chem Co Ltd Photosetting resin composition
JPS573875A (en) * 1980-06-11 1982-01-09 Tamura Kaken Kk Photopolymerizable ink composition
DE3036694A1 (de) * 1980-09-29 1982-06-03 Hoechst Ag, 6000 Frankfurt Gummielastische, ethylenisch ungesaettigte polyurethane und dieselben enthaltendes durch strahlung polymerisierbares gemisch

Also Published As

Publication number Publication date
CA1185387A (en) 1985-04-09
AU548860B2 (en) 1986-01-02
ES511340A0 (es) 1983-08-01
DE3114931A1 (de) 1982-10-28
FI69714C (fi) 1986-03-10
SG42586G (en) 1987-09-18
AU8250582A (en) 1983-04-21
EP0063304A2 (de) 1982-10-27
FI821260L (fi) 1982-10-14
JPS57178237A (en) 1982-11-02
KR890000802B1 (ko) 1989-04-07
BR8202101A (pt) 1983-03-22
FI821260A0 (fi) 1982-04-08
EP0063304A3 (en) 1983-07-20
FI69714B (fi) 1985-11-29
KR830010403A (ko) 1983-12-30
EP0063304B1 (de) 1985-09-18
ZA822386B (en) 1983-02-23
HK56486A (en) 1986-08-08
US4485166A (en) 1984-11-27
DE3266301D1 (en) 1985-10-24
ATE15728T1 (de) 1985-10-15

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