KR910015048A - 집적 회로 - Google Patents
집적 회로 Download PDFInfo
- Publication number
- KR910015048A KR910015048A KR1019910001002A KR910001002A KR910015048A KR 910015048 A KR910015048 A KR 910015048A KR 1019910001002 A KR1019910001002 A KR 1019910001002A KR 910001002 A KR910001002 A KR 910001002A KR 910015048 A KR910015048 A KR 910015048A
- Authority
- KR
- South Korea
- Prior art keywords
- transistor
- integrated circuit
- base
- supply line
- collector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
- H03F1/302—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in bipolar transistor amplifiers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
- G05F1/10—Regulating voltage or current
- G05F1/46—Regulating voltage or current wherein the variable actually regulated by the final control device is DC
- G05F1/613—Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in parallel with the load as final control devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Automation & Control Theory (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
- Networks Using Active Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US469903 | 1990-01-25 | ||
| US07/469,903 US5049764A (en) | 1990-01-25 | 1990-01-25 | Active bypass for inhibiting high-frequency supply voltage variations in integrated circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR910015048A true KR910015048A (ko) | 1991-08-31 |
Family
ID=23865491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910001002A Abandoned KR910015048A (ko) | 1990-01-25 | 1991-01-22 | 집적 회로 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5049764A (enExample) |
| EP (1) | EP0439230B1 (enExample) |
| JP (1) | JP3055702B2 (enExample) |
| KR (1) | KR910015048A (enExample) |
| DE (1) | DE69121254T2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5701098A (en) * | 1995-12-21 | 1997-12-23 | National Semiconductor Corporation | AC bypass circuit which provides stabilization of high frequency transient noise |
| US6456107B1 (en) | 2001-01-04 | 2002-09-24 | Sun Microsystems, Inc. | CMOS-microprocessor chip and package anti-resonance method |
| US6483341B2 (en) | 2001-01-04 | 2002-11-19 | Sun Microsystems, Inc. | CMOS-microprocessor chip and package anti-resonance apparatus |
| US6441640B1 (en) | 2001-01-04 | 2002-08-27 | Sun Microsystems, Inc. | CMOS-microprocessor chip and package anti-resonance pass-band shunt apparatus |
| FI112560B (fi) * | 2001-06-27 | 2003-12-15 | Micro Analog Syst Oy | RF-suoja Integroidulla piirillä |
| WO2004074947A2 (en) * | 2003-02-14 | 2004-09-02 | Dresser, Inc. | Method, system and storage medium for performing online valve diagnostics |
| US7283894B2 (en) * | 2006-02-10 | 2007-10-16 | Dresser, Inc. | System and method for fluid regulation |
| US7539560B2 (en) | 2007-01-05 | 2009-05-26 | Dresser, Inc. | Control valve and positioner diagnostics |
| US20110090725A1 (en) * | 2009-10-20 | 2011-04-21 | Texas Instruments Inc | Systems and Methods of Synchronous Rectifier Control |
| WO2012157155A1 (ja) | 2011-05-16 | 2012-11-22 | パナソニック株式会社 | 参照電圧安定化回路およびそれを備えた集積回路 |
| EP2761384A4 (en) * | 2011-09-30 | 2015-11-04 | Intel Corp | DEVICE AND METHOD FOR IMPROVING INTEGRATED VOLTAGE REGULATORS |
| US9194884B1 (en) * | 2012-08-28 | 2015-11-24 | Maxim Integrated Products, Inc. | Integrated circuit with analog device fault detection |
| JPWO2017179301A1 (ja) * | 2016-04-13 | 2019-02-21 | 株式会社ソシオネクスト | 参照電圧安定化回路およびこれを備えた集積回路 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE709376C (de) * | 1938-04-30 | 1941-08-14 | Siemens & Halske Akt Ges | Schaltungsanordnung mit steilheitsgesteuerten Blindwiderstaenden |
| US3619659A (en) * | 1969-12-02 | 1971-11-09 | Honeywell Inf Systems | Integrator amplifier circuit with voltage regulation and temperature compensation |
| DE2946306C2 (de) * | 1979-11-16 | 1987-02-26 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verstärkerschaltung mit vorgebbarem Wechselstrominnenwiderstand |
| DE2946305A1 (de) * | 1979-11-16 | 1981-05-21 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Impedanzschaltung mit steuerbarem widerstandswert |
| SE423659B (sv) * | 1980-09-26 | 1982-05-17 | Ericsson Telefon Ab L M | Kopplingsanordning |
| GB8321549D0 (en) * | 1983-08-10 | 1983-09-14 | British Telecomm | Electronic switch |
| US4739193A (en) * | 1986-10-30 | 1988-04-19 | Rca Corporation | Drive circuit with limited signal transition rate for RFI reduction |
| US4740717A (en) * | 1986-11-25 | 1988-04-26 | North American Philips Corporation, Signetics Division | Switching device with dynamic hysteresis |
| US4947063A (en) * | 1987-10-09 | 1990-08-07 | Western Digital Corporation | Method and apparatus for reducing transient noise in integrated circuits |
| NL8702781A (nl) * | 1987-11-20 | 1989-06-16 | Philips Nv | Geintegreerde logische schakeling met "hot-carrier-stress"-reduktie en instabiliteiten-demping. |
| JPH07105446B2 (ja) * | 1988-01-11 | 1995-11-13 | 株式会社東芝 | Mos型半導体装置の入力保護回路 |
| US4894567A (en) * | 1988-10-17 | 1990-01-16 | Honeywell Inc. | Active snubber circuit |
| US4939616A (en) * | 1988-11-01 | 1990-07-03 | Texas Instruments Incorporated | Circuit structure with enhanced electrostatic discharge protection |
| US4893212A (en) * | 1988-12-20 | 1990-01-09 | North American Philips Corp. | Protection of power integrated circuits against load voltage surges |
-
1990
- 1990-01-25 US US07/469,903 patent/US5049764A/en not_active Expired - Fee Related
-
1991
- 1991-01-21 DE DE69121254T patent/DE69121254T2/de not_active Expired - Fee Related
- 1991-01-21 EP EP91200108A patent/EP0439230B1/en not_active Expired - Lifetime
- 1991-01-22 KR KR1019910001002A patent/KR910015048A/ko not_active Abandoned
- 1991-01-23 JP JP3006346A patent/JP3055702B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69121254T2 (de) | 1997-01-30 |
| EP0439230A3 (en) | 1993-05-26 |
| EP0439230A2 (en) | 1991-07-31 |
| JP3055702B2 (ja) | 2000-06-26 |
| US5049764A (en) | 1991-09-17 |
| US5049764B1 (enExample) | 1992-12-15 |
| JPH04212512A (ja) | 1992-08-04 |
| EP0439230B1 (en) | 1996-08-14 |
| DE69121254D1 (de) | 1996-09-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| NORF | Unpaid initial registration fee | ||
| PC1904 | Unpaid initial registration fee |
St.27 status event code: A-2-2-U10-U13-oth-PC1904 St.27 status event code: N-2-6-B10-B12-nap-PC1904 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |