KR910015030A - 필름 실장형 반도체 장치 - Google Patents

필름 실장형 반도체 장치 Download PDF

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Publication number
KR910015030A
KR910015030A KR1019910000310A KR910000310A KR910015030A KR 910015030 A KR910015030 A KR 910015030A KR 1019910000310 A KR1019910000310 A KR 1019910000310A KR 910000310 A KR910000310 A KR 910000310A KR 910015030 A KR910015030 A KR 910015030A
Authority
KR
South Korea
Prior art keywords
film
semiconductor device
lead
wirings
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019910000310A
Other languages
English (en)
Korean (ko)
Inventor
히로히꼬 나까무라
Original Assignee
야마무라 가쯔미
세이꼬 엡슨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마무라 가쯔미, 세이꼬 엡슨 가부시끼가이샤 filed Critical 야마무라 가쯔미
Publication of KR910015030A publication Critical patent/KR910015030A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes

Landscapes

  • Wire Bonding (AREA)
KR1019910000310A 1990-01-16 1991-01-11 필름 실장형 반도체 장치 Withdrawn KR910015030A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP250290 1990-01-16
JP2502 1990-01-16
JP106008 1990-10-08
JP1990106008U JPH0493147U (enExample) 1990-01-16 1990-10-08

Publications (1)

Publication Number Publication Date
KR910015030A true KR910015030A (ko) 1991-08-31

Family

ID=31889738

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910000310A Withdrawn KR910015030A (ko) 1990-01-16 1991-01-11 필름 실장형 반도체 장치

Country Status (2)

Country Link
JP (1) JPH0493147U (enExample)
KR (1) KR910015030A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3640155B2 (ja) 1999-01-26 2005-04-20 セイコーエプソン株式会社 可撓性配線基板、フィルムキャリア、テープ状半導体装置、半導体装置、回路基板並びに電子機器

Also Published As

Publication number Publication date
JPH0493147U (enExample) 1992-08-13

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000