KR890015349A - 기상성장장치 - Google Patents
기상성장장치 Download PDFInfo
- Publication number
- KR890015349A KR890015349A KR1019890002688A KR890002688A KR890015349A KR 890015349 A KR890015349 A KR 890015349A KR 1019890002688 A KR1019890002688 A KR 1019890002688A KR 890002688 A KR890002688 A KR 890002688A KR 890015349 A KR890015349 A KR 890015349A
- Authority
- KR
- South Korea
- Prior art keywords
- cassette
- vapor phase
- phase growth
- lead
- wafer
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 claims 10
- 238000001947 vapour-phase growth Methods 0.000 claims 7
- 238000001816 cooling Methods 0.000 claims 1
- 238000011156 evaluation Methods 0.000 claims 1
- 239000003779 heat-resistant material Substances 0.000 claims 1
Classifications
-
- H01L21/205—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Robotics (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도 ~3도는 본 발명의 일실시예를 나타내고, 제 1 도는 전체평면도. 제 2 도는 예비실의 종단측면도. 제 3 도는 예비실의 종단정면도.
Claims (9)
- 반응실과, 이 반응실에 대한 로우드와 언로우드겸용의 예비실을 구비하고, 예비실에는, 반응실에 대한 웨이퍼의 급배부와 그 양쪽에 등 간격으로 배설한 미가공웨이퍼의 인입부와 가공완료 웨이퍼의 인출부를 형성하고, 복수의 웨이퍼를 장전가능한 1쌍의 카세트가 양쪽에 설치되며 또한 이들 1쌍의 카세트를 인입부와 급배부 또는 급배부와 인출부에 위치시키도록 이동가능한 가동대를 배설한것을 특징으로 하는 기상성장장치.
- 제 1 항에 있어서, 가동대상의 카세트를 웨이퍼의 배열방향으로 이동시키는 이동수단을 구비한것을 특징으로 하는 기상성장장치.
- 제 1 항 또는 제 2 항에 있어서, 가동대상의 1쌍의 카세트는, 웨이퍼를 한방향으로 삽입하고, 그 연장방향으로 인출하도록한 로우드전용카세트와 언로우드전용카세트로 이루어진것을 특징으로 하는 기상성장장치.
- 제 3 항에 있어서, 로우드전용카세트 및 언로우드전용카세트를, 제품용카세트의 웨이퍼 장전매수보다 많은 매수의 웨이퍼를 장전가능하도록 구성한것을 특징으로 하는 기상성장장치.
- 제 3 항 또는 제 4 항에 있어서, 언로우드전용카세트를, 내열재료로 형성하고, 적어도 웨이퍼지지부의 표면을 미끄럼성이 뛰어난 표면으로 한것을 특징으로 하는 기상성장장치.
- 제 1 항 또는 제 4 항에 있어서, 예비실의 외부에, 인입부와 인출부에 대응시켜셔 로우드용의 케세트설치부와 언로우드용의 카세트설치부를 배설하고, 이들 카세트설치부와 인입부와 인출부의 사이에 웨이퍼의 이재수단을 배설한것을 특징으로 하는 기상성장장치.
- 제 6 항에 있어서, 각 카세트설치부는, 제품용카세트와 막두께평가용모니터카세트를 별렬로 설치가능하도록 구성한것을 특징으로 하는 기상성장장치.
- 제 1 항에 있어서, 예비실의 인입부에, 예열수단을 배설한것을 특징으로 하는 기상성장장치.
- 제 1 항에 있어서, 예비실의 인출부에, 냉각수단을 배설한것을 특징으로 하는 기상성장장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP88-51923 | 1988-03-04 | ||
JP63051923A JP2502661B2 (ja) | 1988-03-04 | 1988-03-04 | 気相成長装置 |
JP63-51923 | 1988-03-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890015349A true KR890015349A (ko) | 1989-10-30 |
KR930003135B1 KR930003135B1 (ko) | 1993-04-22 |
Family
ID=12900395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890002688A KR930003135B1 (ko) | 1988-03-04 | 1989-03-04 | 화학적 기상 성장장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5058526A (ko) |
JP (1) | JP2502661B2 (ko) |
KR (1) | KR930003135B1 (ko) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5254170A (en) * | 1989-08-07 | 1993-10-19 | Asm Vt, Inc. | Enhanced vertical thermal reactor system |
ES2130295T3 (es) * | 1989-10-20 | 1999-07-01 | Applied Materials Inc | Aparato de tipo robot. |
US5447409A (en) * | 1989-10-20 | 1995-09-05 | Applied Materials, Inc. | Robot assembly |
US5227708A (en) * | 1989-10-20 | 1993-07-13 | Applied Materials, Inc. | Two-axis magnetically coupled robot |
JP2704309B2 (ja) * | 1990-06-12 | 1998-01-26 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板の熱処理方法 |
JP2892170B2 (ja) * | 1990-07-20 | 1999-05-17 | 株式会社東芝 | 熱処理成膜方法 |
DE69113553T2 (de) * | 1990-07-23 | 1996-06-20 | Dainippon Screen Mfg | Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten. |
JPH04308090A (ja) * | 1991-04-05 | 1992-10-30 | M B K Maikurotetsuku:Kk | 気相化学反応生成装置のロードロック機構 |
JPH081923B2 (ja) * | 1991-06-24 | 1996-01-10 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
US5387557A (en) * | 1991-10-23 | 1995-02-07 | F. T. L. Co., Ltd. | Method for manufacturing semiconductor devices using heat-treatment vertical reactor with temperature zones |
US5299901A (en) * | 1992-04-16 | 1994-04-05 | Texas Instruments Incorporated | Wafer transfer machine |
TW239164B (ko) * | 1992-08-12 | 1995-01-21 | Tokyo Electron Co Ltd | |
US5324540A (en) * | 1992-08-17 | 1994-06-28 | Tokyo Electron Limited | System and method for supporting and rotating substrates in a process chamber |
KR100303075B1 (ko) | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 집적회로 웨이퍼 이송 방법 및 장치 |
KR100302012B1 (ko) * | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크 |
US5387067A (en) * | 1993-01-14 | 1995-02-07 | Applied Materials, Inc. | Direct load/unload semiconductor wafer cassette apparatus and transfer system |
US5376862A (en) * | 1993-01-28 | 1994-12-27 | Applied Materials, Inc. | Dual coaxial magnetic couplers for vacuum chamber robot assembly |
US5527390A (en) * | 1993-03-19 | 1996-06-18 | Tokyo Electron Kabushiki | Treatment system including a plurality of treatment apparatus |
DE4309092C2 (de) * | 1993-03-22 | 1998-11-12 | Joachim Dr Scheerer | Verfahren und Vorrichtung zur Handhabung und zum Transport von Wafern in Reinst-Räumen |
US5538390A (en) * | 1993-10-29 | 1996-07-23 | Applied Materials, Inc. | Enclosure for load lock interface |
US5730801A (en) * | 1994-08-23 | 1998-03-24 | Applied Materials, Inc. | Compartnetalized substrate processing chamber |
US6048154A (en) * | 1996-10-02 | 2000-04-11 | Applied Materials, Inc. | High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
US6280134B1 (en) * | 1997-06-17 | 2001-08-28 | Applied Materials, Inc. | Apparatus and method for automated cassette handling |
US7393561B2 (en) * | 1997-08-11 | 2008-07-01 | Applied Materials, Inc. | Method and apparatus for layer by layer deposition of thin films |
US6352593B1 (en) * | 1997-08-11 | 2002-03-05 | Torrex Equipment Corp. | Mini-batch process chamber |
US6610150B1 (en) | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
US6488778B1 (en) | 2000-03-16 | 2002-12-03 | International Business Machines Corporation | Apparatus and method for controlling wafer environment between thermal clean and thermal processing |
KR100345304B1 (ko) * | 2000-10-12 | 2002-07-25 | 한국전자통신연구원 | 수직형 초고진공 화학증착장치 |
GB0026027D0 (en) * | 2000-10-24 | 2000-12-13 | Smith John A | Extractor |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
WO2005048313A2 (en) * | 2003-11-10 | 2005-05-26 | Blueshift Technologies, Inc. | Methods and systems for handling workpieces in a vacuum-based semiconductor handling system |
JP4563219B2 (ja) * | 2005-03-01 | 2010-10-13 | 東京エレクトロン株式会社 | 中継ステーション及び中継ステーションを用いた基板処理システム |
US8007275B2 (en) * | 2008-01-25 | 2011-08-30 | Micron Technology, Inc. | Methods and apparatuses for heating semiconductor wafers |
CN102246290B (zh) * | 2008-12-12 | 2014-03-05 | 芝浦机械电子株式会社 | 衬底冷却装置及衬底处理系统 |
US10475627B2 (en) * | 2016-03-25 | 2019-11-12 | Lam Research Corporation | Carrier ring wall for reduction of back-diffusion of reactive species and suppression of local parasitic plasma ignition |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58197262A (ja) * | 1982-05-13 | 1983-11-16 | Canon Inc | 量産型真空成膜装置及び真空成膜法 |
JPS605509A (ja) * | 1983-06-24 | 1985-01-12 | Hitachi Ltd | 分子線エピタキシ装置 |
JPS60221572A (ja) * | 1984-03-24 | 1985-11-06 | Anelva Corp | 連続放電反応処理装置 |
JPH0636408B2 (ja) * | 1984-03-26 | 1994-05-11 | 株式会社日立製作所 | 反応処理装置 |
US4640223A (en) * | 1984-07-24 | 1987-02-03 | Dozier Alfred R | Chemical vapor deposition reactor |
JPS6293379A (ja) * | 1985-10-17 | 1987-04-28 | Canon Inc | 堆積膜形成装置 |
JPS62101029A (ja) * | 1985-10-28 | 1987-05-11 | Canon Inc | 基体表面の処理方法及び基体表面の処理装置 |
JPS62216314A (ja) * | 1986-03-18 | 1987-09-22 | Toshiba Mach Co Ltd | 半導体処理装置 |
US4770590A (en) * | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
JPS63109174A (ja) * | 1986-10-24 | 1988-05-13 | Hitachi Ltd | 枚葉式cvd装置 |
-
1988
- 1988-03-04 JP JP63051923A patent/JP2502661B2/ja not_active Expired - Lifetime
-
1989
- 1989-03-03 US US07/318,315 patent/US5058526A/en not_active Expired - Lifetime
- 1989-03-04 KR KR1019890002688A patent/KR930003135B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2502661B2 (ja) | 1996-05-29 |
JPH01225311A (ja) | 1989-09-08 |
US5058526A (en) | 1991-10-22 |
KR930003135B1 (ko) | 1993-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR890015349A (ko) | 기상성장장치 | |
US5588827A (en) | Passive gas substrate thermal conditioning apparatus and method | |
KR970013175A (ko) | 기판처리장치 | |
KR880002251A (ko) | 박막형성장치와 이를 이용한 박막형성방법 | |
TW373233B (en) | Furnace sidewall temperature control system | |
DE59000868D1 (de) | Hubtisch und transportverfahren. | |
JPH06239635A (ja) | 大面積ガラス基板の冷却および加熱方法とそのための装置 | |
EP0306967A3 (en) | Apparatus for performing heat treatment on semiconductor wafers | |
DE3260464D1 (en) | Lyophilizing installation having two series of racks | |
KR970077337A (ko) | 스터퍼링후의 기판의 취급방법 및 스퍼터링장치 | |
US3790404A (en) | Continuous vapor processing apparatus and method | |
KR930006823A (ko) | 반도체장치의 제조방법 | |
JPH09126660A (ja) | 連続式真空熱処理炉 | |
CA2051214A1 (en) | Vacuum Film Forming Apparatus | |
JPH0745547A (ja) | 熱処理装置 | |
ATE9663T1 (de) | Isolierfolie. | |
DE2966703D1 (en) | Heating device for electrically heated apparatuses | |
EP0061158A1 (en) | Method for firing thick film electronic circuits | |
JPH0576542B2 (ko) | ||
US4077792A (en) | Adjustable rack for supporting a glass sheet | |
JPS5677375A (en) | Plasma vapor deposition apparatus | |
WO1994024840A3 (en) | Thin film heat treatment apparatus | |
JPS5739528A (en) | Heating equipment for wafer | |
JPS57195034A (en) | Pallet loading apparatus | |
JPS5678422A (en) | Preparation of electrically conductive transparent thin film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20040323 Year of fee payment: 12 |
|
LAPS | Lapse due to unpaid annual fee |