WO1994024840A3 - Thin film heat treatment apparatus - Google Patents

Thin film heat treatment apparatus Download PDF

Info

Publication number
WO1994024840A3
WO1994024840A3 PCT/US1994/004629 US9404629W WO9424840A3 WO 1994024840 A3 WO1994024840 A3 WO 1994024840A3 US 9404629 W US9404629 W US 9404629W WO 9424840 A3 WO9424840 A3 WO 9424840A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
heat treatment
treatment apparatus
film heat
heater table
Prior art date
Application number
PCT/US1994/004629
Other languages
French (fr)
Other versions
WO1994024840A2 (en
Inventor
Yong-Kil Kim
Original Assignee
Varian Associates
Kim Yong Kil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates, Kim Yong Kil filed Critical Varian Associates
Priority to JP6524512A priority Critical patent/JPH07508860A/en
Publication of WO1994024840A2 publication Critical patent/WO1994024840A2/en
Publication of WO1994024840A3 publication Critical patent/WO1994024840A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Abstract

The thin film heat treatment apparatus for heating the wafers (200) or foil sheets is equipped with a vacuum chamber (100), a heater table (21) placed inside a vacuum chamber, a heat radiation preventing device (40) that is installed adjacent to the heater table (12) and forms a space with the top of the heater table by wrapping the foil sheet or wafer placed closely on the top of the heater table.
PCT/US1994/004629 1993-04-26 1994-04-26 Thin film heat treatment apparatus WO1994024840A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6524512A JPH07508860A (en) 1993-04-26 1994-04-26 Thin film heat treatment equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR93-6993 1993-04-26
KR1019930006993A KR960009975B1 (en) 1993-04-26 1993-04-26 Heat treating apparatus using the second space

Publications (2)

Publication Number Publication Date
WO1994024840A2 WO1994024840A2 (en) 1994-11-10
WO1994024840A3 true WO1994024840A3 (en) 1995-01-19

Family

ID=19354456

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1994/004629 WO1994024840A2 (en) 1993-04-26 1994-04-26 Thin film heat treatment apparatus

Country Status (3)

Country Link
JP (1) JPH07508860A (en)
KR (1) KR960009975B1 (en)
WO (1) WO1994024840A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5791895A (en) * 1994-02-17 1998-08-11 Novellus Systems, Inc. Apparatus for thermal treatment of thin film wafer
KR950025850A (en) * 1994-02-17 1995-09-18 서성기 Heat treatment device of thin film
KR100675271B1 (en) * 2000-12-08 2007-01-26 삼성전자주식회사 A wafer processing apparatus for semiconductor production apparatus
CN102148176B (en) * 2010-02-09 2013-02-06 北京北方微电子基地设备工艺研究中心有限责任公司 Lifting device and semiconductor device processing equipment with same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466793A (en) * 1983-04-04 1984-08-21 Mitsubishi Denki Kaisha Heat treatment jig for use in the manufacture of cathode-ray tubes
US4721462A (en) * 1986-10-21 1988-01-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Active hold-down for heat treating
US5090900A (en) * 1988-05-24 1992-02-25 Balzers Aktiengesellschaft Workpiece support for vacuum chamber
US5183402A (en) * 1990-05-15 1993-02-02 Electrotech Limited Workpiece support

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466793A (en) * 1983-04-04 1984-08-21 Mitsubishi Denki Kaisha Heat treatment jig for use in the manufacture of cathode-ray tubes
US4721462A (en) * 1986-10-21 1988-01-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Active hold-down for heat treating
US5090900A (en) * 1988-05-24 1992-02-25 Balzers Aktiengesellschaft Workpiece support for vacuum chamber
US5183402A (en) * 1990-05-15 1993-02-02 Electrotech Limited Workpiece support

Also Published As

Publication number Publication date
WO1994024840A2 (en) 1994-11-10
JPH07508860A (en) 1995-09-28
KR960009975B1 (en) 1996-07-25

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