KR890007406A - 고밀도 집적회로 - Google Patents
고밀도 집적회로 Download PDFInfo
- Publication number
- KR890007406A KR890007406A KR1019880013051A KR880013051A KR890007406A KR 890007406 A KR890007406 A KR 890007406A KR 1019880013051 A KR1019880013051 A KR 1019880013051A KR 880013051 A KR880013051 A KR 880013051A KR 890007406 A KR890007406 A KR 890007406A
- Authority
- KR
- South Korea
- Prior art keywords
- gate electrode
- electrode wiring
- wiring
- high density
- density integrated
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
- H01L27/11803—Masterslice integrated circuits using field effect technology
- H01L27/11807—CMOS gate arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일 실시예인 반도체 소자상에 형성된 LSI의 구성을 나타내는 설명도.
제2도는 상기 실시예에서의 다층배선의 일 구성예를 나타내는 설명도.
* 도면의 주요부분에 대한 부호의 설명
1 : 반도체기판 2 : 기본셀
4 : 논리셀 5 : 여영역
6 : 제1층 금속배선 7 : 제2층 금속배선
8 : 관통공 10 : 게이트전극배선
14, 15, 16 : 배선로 18 : 전원배선
19 : 접지배선
Claims (4)
- 반도체기판; 상기 반도체기판상에 배치된 적어도 한쌍의 p-형 MOS트랜지스터와 n-형 MOS트랜지스터 및 게이트전극배선을 갖는 복수개의 기본셀을 조합함으로써 구성되어 지는 논리셀; 상기 반도체기판상에 상기 논리셀을 포함하지 않는 여영역; 상기 여영역에 연설되는 연설되는 상기 게이트전극배선의 연설부; 상기 여영역에서, 상기 게이트전극배선의 상기 연설부가 속하는 층과 다른 층에 배치된 배선부; 및 상기 게이트전극배선의 상기 연설부와 그것과 다른 층에 배치된 상기 배선부를 접속시키는 관통공 등을 구성하는 고밀도 집적회로.
- 제1항에 있어서, 상기 기본셀이 게이트에레이방식으로 구성되는 고밀도 집적회로.
- 제1항에 있어서, 상기 다른 층의 배선부가 2층 이상에 배치되는 고밀도 집적회로.
- 제1항에 있어서, 상기 게이트 전극배선의 연설부가 통상의 게이트전극배선보다 폭이 넓은 고밀도 집적회로.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62251963A JPH0194636A (ja) | 1987-10-06 | 1987-10-06 | 半導体装置 |
JP62-251963 | 1987-10-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890007406A true KR890007406A (ko) | 1989-06-19 |
KR910009423B1 KR910009423B1 (ko) | 1991-11-15 |
Family
ID=17230591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880013051A KR910009423B1 (ko) | 1987-10-06 | 1988-10-06 | 고밀도 집적회로 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4949157A (ko) |
JP (1) | JPH0194636A (ko) |
KR (1) | KR910009423B1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0831458B2 (ja) * | 1987-09-08 | 1996-03-27 | 三菱電機株式会社 | 超電導配線集積回路 |
US5168342A (en) * | 1989-01-30 | 1992-12-01 | Hitachi, Ltd. | Semiconductor integrated circuit device and manufacturing method of the same |
SG67297A1 (en) * | 1989-04-19 | 1999-09-21 | Seiko Epson Corp | Semiconductor device |
JPH0828120B2 (ja) * | 1990-05-23 | 1996-03-21 | 株式会社東芝 | アドレスデコード回路 |
US5079614A (en) * | 1990-09-26 | 1992-01-07 | S-Mos Systems, Inc. | Gate array architecture with basic cell interleaved gate electrodes |
JP3556814B2 (ja) * | 1997-10-23 | 2004-08-25 | 株式会社ルネサステクノロジ | フィールドシールド分離トランジスタ |
KR100525111B1 (ko) * | 2004-04-19 | 2005-11-01 | 주식회사 하이닉스반도체 | 반도체 소자 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3477312D1 (de) * | 1983-07-09 | 1989-04-20 | Fujitsu Ltd | Masterslice semiconductor device |
JPS6135535A (ja) * | 1984-07-27 | 1986-02-20 | Fujitsu Ltd | マスタ−スライス集積回路装置 |
JPH0693480B2 (ja) * | 1985-03-29 | 1994-11-16 | 株式会社東芝 | 半導体集積回路装置 |
JPH0789568B2 (ja) * | 1986-06-19 | 1995-09-27 | 日本電気株式会社 | 集積回路装置 |
-
1987
- 1987-10-06 JP JP62251963A patent/JPH0194636A/ja active Pending
-
1988
- 1988-10-04 US US07/253,186 patent/US4949157A/en not_active Expired - Fee Related
- 1988-10-06 KR KR1019880013051A patent/KR910009423B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR910009423B1 (ko) | 1991-11-15 |
JPH0194636A (ja) | 1989-04-13 |
US4949157A (en) | 1990-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19971230 Year of fee payment: 10 |
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LAPS | Lapse due to unpaid annual fee |