KR890001359A - 고체촬상 장치 - Google Patents
고체촬상 장치 Download PDFInfo
- Publication number
- KR890001359A KR890001359A KR1019880006913A KR880006913A KR890001359A KR 890001359 A KR890001359 A KR 890001359A KR 1019880006913 A KR1019880006913 A KR 1019880006913A KR 880006913 A KR880006913 A KR 880006913A KR 890001359 A KR890001359 A KR 890001359A
- Authority
- KR
- South Korea
- Prior art keywords
- solid state
- image pickup
- state image
- optical
- low frequency
- Prior art date
Links
- 239000007787 solid Substances 0.000 title claims description 11
- 238000003384 imaging method Methods 0.000 title claims description 5
- 230000003287 optical effect Effects 0.000 claims 10
- 239000004020 conductor Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예 I인 고체촬성장치의 개략구성을 도시한 부분단면도,
제2도는 본 발명의 실시 예 Ⅱ인 고체촬상장치의 개략구성을 도시한 부분단명도,
제3도는 본 발명의 실시예 Ⅲ인 고체촬상장치의 개략구성을 도시한 부분단면도.
Claims (4)
- 광학적 저주파 여과기를 통해서 고체촬상소자칩에 광신호를 입력하는고체촬상장치에 있어서, 상기 광학적 저주파여과기와 고체촬상소자칩사이에, 광투과성 및 도전성을 가진 시일드부재를 착설한 것을 특징으로 하는 고체촬상장치.
- 제1항에 있어서, 상기 시일드부재는 In2O3와 ZnO2와의 혼합물로 이루어진 투명도전성재료로 구성되어 있는 것을 특징으로하는 고체촬상장치.
- 제1항 또는 제2항에 있어서, 상기 광학적 저주파여과기는, 광학적 수정필터인 것을 특징으로 하는 고체촬상장치.
- 광학적 저주파여과기를 통해서 고체촬상소자칩에 광신호를 입력하는 고체촬상장치에 있어서, 상기 광학적 저주파 여과기를 광투과성 및 도전성을 가진 시일두부재로 피복한 것을 특징으로 하는 고체촬상장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP?62-144916 | 1987-06-10 | ||
JP62-144916 | 1987-06-10 | ||
JP62144916A JPS63308375A (ja) | 1987-06-10 | 1987-06-10 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890001359A true KR890001359A (ko) | 1989-03-20 |
KR920000578B1 KR920000578B1 (ko) | 1992-01-16 |
Family
ID=15373231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880006913A KR920000578B1 (ko) | 1987-06-10 | 1988-06-09 | 고체촬상장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4896217A (ko) |
JP (1) | JPS63308375A (ko) |
KR (1) | KR920000578B1 (ko) |
Families Citing this family (61)
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US5400072A (en) * | 1988-12-23 | 1995-03-21 | Hitachi, Ltd. | Video camera unit having an airtight mounting arrangement for an image sensor chip |
JPH0394587A (ja) * | 1989-09-07 | 1991-04-19 | Canon Inc | 撮像装置 |
US6031670A (en) * | 1990-08-28 | 2000-02-29 | Sankyo Seiki Mfg. Co., Ltd. | Wide-angle lens |
JPH0775400B2 (ja) * | 1990-12-28 | 1995-08-09 | 松下電器産業株式会社 | 固体撮像装置のカメラヘッド及びその製造方法 |
GB2258968B (en) * | 1991-04-17 | 1994-08-31 | Gec Ferranti Defence Syst | A method of fixing an optical image sensor in alignment with the image plane of a lens assembly |
JP3136702B2 (ja) * | 1991-10-07 | 2001-02-19 | 株式会社ニコン | 撮像装置 |
EP0565776B1 (en) * | 1992-04-15 | 1997-03-19 | Hewlett-Packard Company | Color image sensing apparatus and method |
US5322998A (en) * | 1993-03-31 | 1994-06-21 | Eastman Kodak Company | Conical blur filter for reducing artifacts in imaging apparatus |
US5299275A (en) * | 1993-03-31 | 1994-03-29 | Eastman Kodak Company | Optical fiber filter for reducing artifacts in imaging apparatus |
US5438366A (en) * | 1993-03-31 | 1995-08-01 | Eastman Kodak Company | Aspherical blur filter for reducing artifacts in imaging apparatus |
JPH0794691A (ja) * | 1993-09-21 | 1995-04-07 | Nikon Corp | イメージセンサ |
WO1996038980A1 (fr) * | 1995-05-31 | 1996-12-05 | Sony Corporation | Dispositif de saisie d'image et son procede de fabrication, adaptateur de saisie d'image, processeur de signaux, procede de traitement de signaux, processeur d'informations et procede de traitement d'informations |
US5684293A (en) * | 1995-11-29 | 1997-11-04 | Eastman Kodak Company | Anti-aliasing low-pass blur filter for reducing artifacts in imaging apparatus |
US6795120B2 (en) * | 1996-05-17 | 2004-09-21 | Sony Corporation | Solid-state imaging apparatus and camera using the same |
US6937283B1 (en) | 1996-12-03 | 2005-08-30 | Eastman Kodak Company | Anti-aliasing low-pass blur filter for reducing artifacts in imaging apparatus |
US7129978B1 (en) | 1998-07-13 | 2006-10-31 | Zoran Corporation | Method and architecture for an improved CMOS color image sensor |
JP3918320B2 (ja) * | 1998-09-29 | 2007-05-23 | 富士フイルム株式会社 | 固体撮像素子 |
US7092031B1 (en) * | 1999-07-30 | 2006-08-15 | Zoran Corporation | Digital camera imaging module |
US20040212724A1 (en) * | 1999-07-30 | 2004-10-28 | Bawolek Edward J. | Imaging device with liquid crystal shutter |
US7176446B1 (en) | 1999-09-15 | 2007-02-13 | Zoran Corporation | Method and apparatus for distributing light onto electronic image sensors |
KR100340938B1 (ko) * | 1999-11-17 | 2002-06-20 | 박병선 | 광 저 대역 통과 필터 일체형 고체 촬상 소자 |
US6483030B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Snap lid image sensor package |
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
US20010007475A1 (en) * | 2000-01-06 | 2001-07-12 | Asahi Kogaku Kogyo Kabushiki Kaisha | Image pickup device and its mounting structure for an optical low-pass filter |
JP3725012B2 (ja) * | 2000-08-17 | 2005-12-07 | シャープ株式会社 | レンズ一体型固体撮像装置の製造方法 |
JP3887162B2 (ja) * | 2000-10-19 | 2007-02-28 | 富士通株式会社 | 撮像用半導体装置 |
TW523924B (en) * | 2001-01-12 | 2003-03-11 | Konishiroku Photo Ind | Image pickup device and image pickup lens |
US7059040B1 (en) | 2001-01-16 | 2006-06-13 | Amkor Technology, Inc. | Optical module with lens integral holder fabrication method |
JP3540281B2 (ja) * | 2001-02-02 | 2004-07-07 | シャープ株式会社 | 撮像装置 |
KR100401020B1 (ko) * | 2001-03-09 | 2003-10-08 | 앰코 테크놀로지 코리아 주식회사 | 반도체칩의 스택킹 구조 및 이를 이용한 반도체패키지 |
JP2003244560A (ja) * | 2002-02-21 | 2003-08-29 | Seiko Precision Inc | 固体撮像装置 |
JP4009473B2 (ja) * | 2002-03-08 | 2007-11-14 | オリンパス株式会社 | カプセル型内視鏡 |
US7324148B2 (en) * | 2002-04-26 | 2008-01-29 | Olympus Optical Co., Ltd. | Camera and image pickup device unit used therefor having a sealing structure between a dust proofing member and an image pick up device |
US7324149B2 (en) * | 2002-05-20 | 2008-01-29 | Olympus Optical Co., Ltd. | Camera and image pick-up device unit having an optical member that is vibrated to remove dust |
JP2003348462A (ja) * | 2002-05-27 | 2003-12-05 | Olympus Optical Co Ltd | カメラ及び撮像素子ユニット |
JP2004064554A (ja) * | 2002-07-30 | 2004-02-26 | Olympus Corp | カメラ及びこれに用いる撮像素子ユニット |
US7146106B2 (en) * | 2002-08-23 | 2006-12-05 | Amkor Technology, Inc. | Optic semiconductor module and manufacturing method |
JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
US20060261458A1 (en) * | 2003-11-12 | 2006-11-23 | Amkor Technology, Inc. | Semiconductor package and manufacturing method thereof |
JP2006165624A (ja) * | 2004-12-02 | 2006-06-22 | Konica Minolta Opto Inc | 撮像装置及び該撮像装置を有する携帯端末 |
JP2005348275A (ja) * | 2004-06-04 | 2005-12-15 | Sharp Corp | 撮像素子およびカメラモジュール |
US7359579B1 (en) | 2004-10-08 | 2008-04-15 | Amkor Technology, Inc. | Image sensor package and its manufacturing method |
TW200634417A (en) * | 2005-03-31 | 2006-10-01 | Yang Zen Wei | Assembly of lens structure |
US20070210246A1 (en) * | 2005-04-14 | 2007-09-13 | Amkor Technology, Inc. | Stacked image sensor optical module and fabrication method |
US7227236B1 (en) | 2005-04-26 | 2007-06-05 | Amkor Technology, Inc. | Image sensor package and its manufacturing method |
US20070272827A1 (en) * | 2005-04-27 | 2007-11-29 | Amkor Technology, Inc. | Image sensor package having mount holder attached to image sensor die |
US7576401B1 (en) | 2005-07-07 | 2009-08-18 | Amkor Technology, Inc. | Direct glass attached on die optical module |
JP2007206336A (ja) * | 2006-02-01 | 2007-08-16 | Seiko Epson Corp | 光モジュールおよびその製造方法 |
US7675180B1 (en) | 2006-02-17 | 2010-03-09 | Amkor Technology, Inc. | Stacked electronic component package having film-on-wire spacer |
US20080237824A1 (en) * | 2006-02-17 | 2008-10-02 | Amkor Technology, Inc. | Stacked electronic component package having single-sided film spacer |
US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
EP1944807A1 (en) * | 2007-01-12 | 2008-07-16 | STMicroelectronics (Research & Development) Limited | Electromagnetic interference shielding for image sensor |
US20090096915A1 (en) * | 2007-10-16 | 2009-04-16 | Kelly Sean C | Anti-aliasing spatial filter system |
EP2340148A4 (en) * | 2008-09-09 | 2012-05-02 | Univ Cornell | OPTICAL GRID FOR A HIGH-PRECISION AND HIGH-RESOLUTION METHOD FOR NANO-PRODUCTION IN SEMICONDUCTOR SIZE |
US9350906B2 (en) * | 2008-10-02 | 2016-05-24 | Omnivision Technologies, Inc. | Encapsulant module with opaque coating |
US8228418B2 (en) * | 2009-03-20 | 2012-07-24 | Eastman Kodak Company | Anti-aliasing spatial filter system |
US8389926B2 (en) * | 2009-09-14 | 2013-03-05 | Star Technologies Inc. | Testing apparatus for light-emitting devices with a design for a removable sensing module |
GB0920946D0 (en) * | 2009-11-30 | 2010-01-13 | St Microelectronics Res & Dev | Electromagnetic shielding for camera modules |
JP5455706B2 (ja) * | 2010-02-25 | 2014-03-26 | キヤノン株式会社 | 固体撮像装置、撮像ユニット及び撮像装置 |
JP2013012615A (ja) * | 2011-06-29 | 2013-01-17 | Fujifilm Corp | 固体撮像素子及びその製造方法、それに用いる固体撮像素子用の透明導電性膜 |
US10375280B2 (en) * | 2014-07-18 | 2019-08-06 | Fuji Corporation | Imaging device with improved heat dissipation including a board section between a first and a second housing |
Family Cites Families (3)
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---|---|---|---|---|
JPS5737887A (en) * | 1980-08-19 | 1982-03-02 | Fuji Photo Film Co Ltd | Image reader |
US4554585A (en) * | 1983-08-12 | 1985-11-19 | Rca Corporation | Spatial prefilter for variable-resolution sampled imaging systems |
US4691244A (en) * | 1984-05-04 | 1987-09-01 | Energy Conversion Devices, Inc. | Contact-type document scanner including static shield |
-
1987
- 1987-06-10 JP JP62144916A patent/JPS63308375A/ja active Pending
-
1988
- 1988-06-09 KR KR1019880006913A patent/KR920000578B1/ko not_active IP Right Cessation
- 1988-06-10 US US07/204,737 patent/US4896217A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63308375A (ja) | 1988-12-15 |
US4896217A (en) | 1990-01-23 |
KR920000578B1 (ko) | 1992-01-16 |
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