KR880009317A - 메모리 카드 및 그 제조방법 - Google Patents

메모리 카드 및 그 제조방법 Download PDF

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KR880009317A
KR880009317A KR1019880000153A KR880000153A KR880009317A KR 880009317 A KR880009317 A KR 880009317A KR 1019880000153 A KR1019880000153 A KR 1019880000153A KR 880000153 A KR880000153 A KR 880000153A KR 880009317 A KR880009317 A KR 880009317A
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molding
module
card
memory
card body
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마르 브리그네
에밀 드로쉐
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슐룸버거 인더스트리즈
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
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    • B60—VEHICLES IN GENERAL
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Abstract

내용 없음.

Description

메모리 카드 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 전자메모리카드의 평면도.
제2도는 본 발명에 사용가능한 전자모듈을 통한 수직 단면도.
제3도는 본 발명을 실행하는 제1형태의 성형물을 통한 개력적인 단면도.
제3a도는 제3도 성형물의 제1변형을 도시하는 제3도의 라인A-A상의 단면도.
제3b도는 제3도 성형물의 제2변형을 도시하는 제3도의 라인 A-A상의 단면도.
제5도는 본 발명에 따른 전자메모리카드를 통한 부분 단면도.

Claims (15)

  1. 최소한 하나의 고정부분을 갖는 메모리 모듈이 제공되는 단계, 상기 모듈이 성형물에 놓여지고, 메모리모듈의 입구표면이 성형물의 벽들중 하나에 대하여 압착되는 방법으로 상기모듈이 자리에 유지되는 단계, 플라스틱 재료가 성형물의 벽돌에의해 정해지고 상기 메모리 모듈에의해 점유되지 않는 전체 체척을 점유하도록 하는 방법으로 플라스틱 재료가 성형물로 삽입되는 단계, 및 이와 같은 방법으로 만들어전 부분이 성형되지 않는 단계을 포함하는 것을 특징으로 하는, 카드본체와 입구 표면을 갖는 메모리모듈을 포함하는 메모리 카드 제조방법.
  2. 제1항에 있어서, 상길 메모리 모듈이 제1 표면상에 외부 전기접촉태브를 지니고 반대의 제2표면상에는 상기칩의 단자들과 상기 접촉태브들 사이에 있는 전기 접속 수단과 함께 칩을 지니는 절연지지물 및 상기칩과 상기 전기접속수단을 보호하는 피복재료를 보호하는 피복재료를 포함하여, 상기 방법이 상기 피복재료의 특정한 형태로 이루어지는 상기 고정 부분을 특징으로 하는 제조방법.
  3. 제1항에 있어서 카드본체가 두개의 주표면들을 가지며, 상기 전기접촉 태브들이 상기 주표면들의 하나와 수평이되며, 상기 방법이 절연지지물의 상기 제1표면이 카드본체의 주표면들의 하나를 정하는 성형물의 벽에 대하여 배치되도록 성형물에 놓여진 상기 전자모듈, 및 상기모듈을 상기벽에 대하여 유지시키기위하여 성형물의 상기벽과 절연지지물의 상기 제1표면 사이에 실정된 흡입을 특징으로 하는 제조방법.
  4. 제2항에 있어서, 유지된 상기 전자모듈에 대하여 성형물의 벽으로부터 돌출한 스터드(stud)들과 협력 하기위하여 상기 접촉태브들에 다수의 홀들이 제공되는 것을 특징으로 하는 제조방법.
  5. 제2항에 있어서, 전자모듈이 실질적으로 구형 입구 표면이며, 상기 방법이 상기 모듈의 상기 입구표면을 둘러싸는 돌출부분을 최소한 부분적으로 포함하는 압축된 상기모듈에 대한 성형물의 벽을 특징으로 하는 제조방법.
  6. 제1항에 있어서, 카드본체가 두개의 실질적인 주표면들을 포함하여, 카드본체의 ‘코너’를 정하는 성형물의 부분으로 사출되는 플라스틱재료를 특징으로 하는 제조방법.
  7. 제1항에 있어서, 상기부분이 성형되지 않은 후, 자기 트랙이 카드본체의 주표면들의 하나에 적용되는 것을 특징으로 하는 제조방법.
  8. 제1항에 있어서, 상기부분이 성형되지않은후, 플라스틱재료를 양각함으로써 메시지(message)들이 카드본체의 주표면들의 하나위에 기록되는것을 특징으로하는 제조방법.
  9. 제1항에 있어서, 상기 플라스틱 재료가 아크릴로니트릴-부타디엔-스틸렌, 폴리스틸렌, 폴리프로필렌, 및 폴리아민 11을 포함하는 그룹으로부터 선택되는 제조방법.
  10. 각각이 최소한 하나의 고정부분을 갖는, 다수의 메모리 모듈이 제공되는 단계, 각각의 공동이 카드본체에주어진 형태에 해당하며, 성형물내에서 통로들에의해 상호연결된 다수의 성형물 공동들을 포함하는 성형물이 제공되는 단계, 상기 모듈들이 성형물내에 놓이며 메모리 모듈 입구표면들이 상기 성형물의 벽들중 하나에 대하여 압착되도록 보장하는 방법으로 자리에 유지되는 단계, 플라스틱 재료가 상기 메모리 모듈들에 의해 점유되지않는 상기 성형물공동들의 모든 체적과 상기 통로들을 점유하도록하는 방법으로 플라스틱 재료가 상기 성형물로 삽입되는 단계, 및 이와 같은 방법으로 만들어진 부분이 성형되지 않는 단계을 포함하는 각각의 카드가 카드본체와 입구표면을 갖는 해당하는 전자모듈을 포함하는 다수의 메모리카드를 제조하는 제조방법.
  11. 제10항에 있어서, 상기 플라스틱 재료가 최소한 및몇의 상기 통로들을 거쳐서 상기 성형물로 삽입되는 제조방법.
  12. 두개의 주표면물을 갖는 플라스틱 재료로 만들어진 본체와 입구표면을 갖는 메모리 모듈을 포함하는 메모리 카드에 있어서, 상기 카드가 상기 본체는 단일 조각으로서 만들어지며, 상기 모듈은 최소한 하나의 고정부분을 포함하고, 상기 고정부분이 상기본체를 이루는 플라스틱재료로 완전하게 매입되여 모듈의 상기 입구표면은 카드본체의 주표면들중의 하나와 수평이되는 것을 특징으로 하는 메모리 카드.
  13. 제12항에 있어서, 카드본체가 아크릴로니트릴-부터디엔-스틸렌으로 만들어지는 메모리 카드.
  14. 제12항에 있어서, 카드본체가 폴리스틸렌, 폴리프로필렌, 및 폴리아민 11을 포함하는 그룹으로부터 선택되는 메모리 카드.
  15. 제12항에 있어서, 상기 메모리모듈이, 전기접촉의 외부층이 제공된 절연지지물, 외부전기접촉 태브들이 제공되어 상기 지지물에 고정된 칩, 상기칩의 단자들과 상기접촉태브들 사이의 전기접속수단, 및 상기칩을 피복하는 피복재료를 포함하는 전자모듈이여, 상기 고정부분이 상기피복재료로 주어진 특별한 형태에의해 만들어지는 것을 특징으로 하는 메모리카드.
    ※ 참고사항 : 최초출된 내용에 의하여 공개하는 것임.
KR1019880000153A 1987-01-16 1988-01-12 메모리 카드 및 그 제조방법 KR880009317A (ko)

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FR8700446A FR2609821B1 (fr) 1987-01-16 1987-01-16 Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede
FR87/00446 1987-01-16

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ATE74456T1 (de) 1992-04-15
DE3869635D1 (de) 1992-05-07
AU600785B2 (en) 1990-08-23
NO880166D0 (no) 1988-01-15
FR2609821A1 (fr) 1988-07-22
FR2609821B1 (fr) 1989-03-31
CA1306058C (en) 1992-08-04
FI93156C (fi) 1995-02-27
EP0277854A1 (fr) 1988-08-10
JPS63239097A (ja) 1988-10-05
NZ223192A (en) 1989-09-27
NO178089C (no) 1996-01-17
PT86557A (pt) 1989-01-30
FI93156B (fi) 1994-11-15
FI880152A (fi) 1988-07-17
DK16988D0 (da) 1988-01-14
ES2031248T3 (es) 1992-12-01
EP0277854B1 (fr) 1992-04-01
GR3004900T3 (ko) 1993-04-28
NO880166L (no) 1988-07-18
ZA88279B (en) 1988-07-01
DK16988A (da) 1988-07-17
FI880152A0 (fi) 1988-01-14
BR8800135A (pt) 1988-08-23
IN170183B (ko) 1992-02-22
NO178089B (no) 1995-10-09
AU1016088A (en) 1988-07-21

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