IN170183B - - Google Patents

Info

Publication number
IN170183B
IN170183B IN17/MAS/88A IN17MA1988A IN170183B IN 170183 B IN170183 B IN 170183B IN 17MA1988 A IN17MA1988 A IN 17MA1988A IN 170183 B IN170183 B IN 170183B
Authority
IN
India
Prior art keywords
mould
plastic material
electronic module
module
undercut
Prior art date
Application number
IN17/MAS/88A
Inventor
Marc Brignet
Emile Droche
Original Assignee
Schlumberger Ind Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9346968&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IN170183(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schlumberger Ind Sa filed Critical Schlumberger Ind Sa
Publication of IN170183B publication Critical patent/IN170183B/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Holo Graphy (AREA)
  • Packaging For Recording Disks (AREA)
  • External Artificial Organs (AREA)
  • Electrically Operated Instructional Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Non-Volatile Memory (AREA)
  • Collating Specific Patterns (AREA)
  • Compression, Expansion, Code Conversion, And Decoders (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

In order to produce the card body from a plastic material, the electronic module (14) whose covering (50) has an undercut (54), is placed in a mould (60,62). The module is held in place by suction (72). The plastic material is injected into the mould, thereby producing a moulding around the electronic module. <IMAGE>
IN17/MAS/88A 1987-01-16 1988-01-12 IN170183B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8700446A FR2609821B1 (en) 1987-01-16 1987-01-16 METHOD FOR REALIZING MEMORY CARDS AND CARDS OBTAINED BY THE IMPLEMENTATION OF SAID METHOD

Publications (1)

Publication Number Publication Date
IN170183B true IN170183B (en) 1992-02-22

Family

ID=9346968

Family Applications (1)

Application Number Title Priority Date Filing Date
IN17/MAS/88A IN170183B (en) 1987-01-16 1988-01-12

Country Status (18)

Country Link
EP (1) EP0277854B1 (en)
JP (1) JPS63239097A (en)
KR (1) KR880009317A (en)
AT (1) ATE74456T1 (en)
AU (1) AU600785B2 (en)
BR (1) BR8800135A (en)
CA (1) CA1306058C (en)
DE (1) DE3869635D1 (en)
DK (1) DK16988A (en)
ES (1) ES2031248T3 (en)
FI (1) FI93156C (en)
FR (1) FR2609821B1 (en)
GR (1) GR3004900T3 (en)
IN (1) IN170183B (en)
NO (1) NO178089C (en)
NZ (1) NZ223192A (en)
PT (1) PT86557A (en)
ZA (1) ZA88279B (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825349B2 (en) * 1987-10-22 1996-03-13 日本ユーロテック株式会社 Card manufacturing method
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
FR2636755B1 (en) * 1988-09-16 1992-05-22 Schlumberger Ind Sa METHOD FOR PRODUCING MEMORY CARDS AND CARDS OBTAINED BY SAID METHOD
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
EP0361194A3 (en) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Method of enveloping electrical or electronic components or component assemblies, and envelope for electrical or electronic components or component assemblies
JP2559834B2 (en) * 1989-01-12 1996-12-04 三菱電機株式会社 IC card
JPH0687484B2 (en) * 1989-04-06 1994-11-02 三菱電機株式会社 IC card module
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
FR2647571B1 (en) * 1989-05-26 1994-07-22 Lemaire Gerard METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED THEREBY
FR2659157B2 (en) * 1989-05-26 1994-09-30 Lemaire Gerard METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED BY THIS PROCESS.
FR2650530B1 (en) * 1989-08-07 1991-11-29 Schlumberger Ind Sa METHOD FOR REALIZING CARD BODIES WITH GRAPHICS
FR2666687A1 (en) * 1990-09-06 1992-03-13 Sgs Thomson Microelectronics Integrated circuit with moulded housing comprising a thermal dissipator and method of manufacture
IT1243817B (en) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics METHOD FOR THE MANUFACTURE OF PLASTIC CONTAINERS, FOR INTEGRATED CIRCUITS, WITH BUILT-IN THERMAL DISSIPATOR
DE4038126C2 (en) * 1990-11-27 1993-12-16 Mannesmann Ag Method and device for producing a decorated chip card
FI913357A (en) * 1991-07-10 1993-01-11 Valtion Teknillinen FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL
US5286426A (en) * 1992-04-01 1994-02-15 Allegro Microsystems, Inc. Assembling a lead frame between a pair of molding cavity plates
DE4401588C2 (en) * 1994-01-20 2003-02-20 Gemplus Gmbh Method for capping a chip card module and chip card module
DE9422424U1 (en) * 1994-02-04 2002-02-21 Giesecke & Devrient GmbH, 81677 München Chip card with an electronic module
JPH0890600A (en) * 1994-09-22 1996-04-09 Rhythm Watch Co Ltd Ic card manufacturing mold
DE4435802A1 (en) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Method for producing data carriers with embedded elements and device for carrying out the method
JP3409943B2 (en) * 1995-05-25 2003-05-26 昭和電工株式会社 Plug for infusion container and method for producing the same
FR2735714B1 (en) * 1995-06-21 1997-07-25 Schlumberger Ind Sa METHOD FOR PRINTING A GRAPHICS ON A MEMORY CARD
DE19625228C2 (en) 1996-06-24 1998-05-14 Siemens Ag System carrier for mounting an integrated circuit in an injection molded housing
EP0890928A3 (en) * 1997-07-10 2001-06-13 Sarnoff Corporation Transmission apparatus and remotely identifying an electronically coded article
EP0938060A1 (en) * 1998-02-20 1999-08-25 ESEC Management SA Method for fabricating a chip article and chip article
EP1118111A1 (en) * 1998-09-29 2001-07-25 Tyco Electronics Logistics AG Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding
FR2895547B1 (en) * 2005-12-26 2008-06-06 Oberthur Card Syst Sa METHOD FOR MANUFACTURING A MICROCIRCUIT BOARD
ATE551668T1 (en) 2006-11-17 2012-04-15 Oberthur Technologies METHOD FOR PRODUCING AN ENTITY AND CORRESPONDING APPARATUS
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
DK3491584T3 (en) * 2016-07-27 2022-10-17 Composecure Llc Molded electronic components for transaction cards and methods of making the same
MX2021012822A (en) 2017-09-07 2023-03-02 Composecure Llc Transaction card with embedded electronic components and process for manufacture.
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
MX2020004012A (en) 2017-10-18 2020-09-25 Composecure Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting.
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (en) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC COMPONENT
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
JPS6086850A (en) * 1983-10-18 1985-05-16 Dainippon Printing Co Ltd Ic card
JPS60146383A (en) * 1984-01-10 1985-08-02 Dainippon Printing Co Ltd Ic card
JPS61222712A (en) * 1985-03-28 1986-10-03 Mitsubishi Electric Corp Manufacture of resin encapsulated body
JPS6232094A (en) * 1985-08-05 1987-02-12 カシオ計算機株式会社 Integrated circuit card

Also Published As

Publication number Publication date
NO178089C (en) 1996-01-17
CA1306058C (en) 1992-08-04
GR3004900T3 (en) 1993-04-28
FI93156C (en) 1995-02-27
NO178089B (en) 1995-10-09
AU600785B2 (en) 1990-08-23
JPS63239097A (en) 1988-10-05
NZ223192A (en) 1989-09-27
FI93156B (en) 1994-11-15
EP0277854A1 (en) 1988-08-10
DK16988A (en) 1988-07-17
BR8800135A (en) 1988-08-23
FR2609821B1 (en) 1989-03-31
FR2609821A1 (en) 1988-07-22
NO880166L (en) 1988-07-18
NO880166D0 (en) 1988-01-15
DE3869635D1 (en) 1992-05-07
DK16988D0 (en) 1988-01-14
AU1016088A (en) 1988-07-21
ES2031248T3 (en) 1992-12-01
EP0277854B1 (en) 1992-04-01
ATE74456T1 (en) 1992-04-15
FI880152A (en) 1988-07-17
FI880152A0 (en) 1988-01-14
PT86557A (en) 1989-01-30
KR880009317A (en) 1988-09-14
ZA88279B (en) 1988-07-01

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