EP1118111A1 - Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding - Google Patents

Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding

Info

Publication number
EP1118111A1
EP1118111A1 EP99953592A EP99953592A EP1118111A1 EP 1118111 A1 EP1118111 A1 EP 1118111A1 EP 99953592 A EP99953592 A EP 99953592A EP 99953592 A EP99953592 A EP 99953592A EP 1118111 A1 EP1118111 A1 EP 1118111A1
Authority
EP
European Patent Office
Prior art keywords
shot
electronic module
module
card body
injected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99953592A
Other languages
German (de)
French (fr)
Inventor
Jean-Pierre Dekeyser
Helge Schmidt
Peter Preiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Tyco Electronics Logistics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics AG filed Critical Tyco Electronics Logistics AG
Publication of EP1118111A1 publication Critical patent/EP1118111A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a method for casting a flat electronic module with external contacts into a plastic card body by thermoplastic injection molding.
  • the electronic module described there consists of a leadframe with a chip mounted thereon, which are embedded in a plastic housing in such a way that external contacts of the module protrude from the housing in one plane.
  • This module is then embedded in a flat plastic object, for example a chip card, which typically has a thickness of only about 0.8 mm, by injection molding.
  • the module is not cast with thermoplastic on either one of the flat sides, that is, the thickness of the electronic module is equal to the thickness of the thermoplastic material of the plastic card body.
  • the housed module the flat underside of which is typically formed by the exposed lead frame, is inserted into an injection mold with an upper and lower mold half and then the module, with the material of the chip card exactly in alignment, is cast around its edges, using centering pins the mold is additionally positioned in the mold cavity.
  • At least one surface of the module is also on the today
  • the object of the invention is therefore to provide a method of the type mentioned at the outset which allows the central injection of relatively large-area electronic modules into card bodies up to approximately 3 mm thick.
  • FIG. 1 shows a finished injection-molded plastic card body in a schematic sectional illustration
  • FIG. 1 a plastic card body in a molding tool after the first or after the second shot
  • FIG. 4 to 6 in a schematic plan view from above, an equipped chip carrier before the encapsulation (FIG. 4) and after the first (FIG. 5) and after the second (FIG. 6) shot, with the associated side views as parts of the figure below FIG. 5 and 6 are attached.
  • the present invention is based on the knowledge that, on the one hand, it is a necessary prerequisite for injecting an electronic module in the middle, in particular if it comprises a lead frame as the chip carrier, not to stress the lead frame or the module in such a way that the chip is functional loses what can only be prevented if there is a balance of forces during the injection process.
  • this is not possible with the known one-shot method for the following reasons:
  • the injection molding is not completely reproducible in the area of high pressures.
  • the increase in the mold temperature leads to a warping of the card body.
  • the bigger the de chip carrier area the higher the uncontrollable surface forces.
  • the chip carriers cannot be fixed in the mold, or only with difficulty.
  • turbulence occurs and leaves traces. It turns out that unevenness leads to an uneven flow, in which transverse forces arise despite the symmetrical position of the chip carrier to be injected, which press the lead frame or the module against the injection mold wall.
  • the invention is therefore based on the fact that the balance of forces in the middle injection is not immediate, which does not appear to be possible, but rather indirectly in two injection phases with two different molding tools, one half of which in each case has the necessary counterforce to the forces occurring in the opposite half of the mold due to the injection process forms to manufacture.
  • FIG. 1 shows a lead frame 8 on which an encapsulated chip, that is to say provided with a plastic housing 9, is arranged.
  • the production of such a plastic housing 9, which belongs to the electronics module 1 itself, is in principle independent of the method according to the invention.
  • the finished card body 2 in Figure 1 is on both sides Injection molded plastic, except in the area of the contact area 10 of the leadframe, which is designed as a via.
  • the position of the module 1 on the first shot can be seen in FIG.
  • the upper mold half 3 of the first mold is so pronounced that the relief of the module 1 bears completely and without gaps on the side to be covered.
  • the lead frame or module side with more relief structure is sprayed out, possibly together with a contact area 10, since then the negative for the module side with less structure, i.e. the upper mold half 3, can be made simpler, which is particularly the case with unhoused modules or PCB is important. Due to the fact that the upper side of the module 1 is fully in contact, infiltration during spraying is not possible and it is ensured that the chip carrier 8 does not bend.
  • the position of the partially injected card body 7 in the second shot can be seen in Figure 3.
  • the remaining card body areas 2 are filled in according to the upper mold half 5 of the second mold, while the mold half 6 lies flat.
  • the chip carrier 8 is completely enclosed. It is also possible to inject labeling labels that are inserted into one of the injection molds in the two injection molding processes.
  • FIGS. 4 to 6 A further exemplary embodiment is shown in FIGS. 4 to 6, in which a chip carrier 8 equipped with two chips 11 and without a plastic housing is encapsulated directly in the two-shot method according to the invention.
  • the plastic body 7 can be seen in FIG. 5 after the first shot, a preferred flow channel 12 for the second shot also being shown on the left and right.
  • the connecting seam 13 between the first and the second weft is also indicated in the finished injection-molded card.
  • the sprue for the second shot opens into the preferred flow channel 12 for the second shot and is already formed with the first shot by means of a mold insert.
  • ABS, PBT, PET, LCP, PA and PC are the most suitable plastic thermoplastics.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The module (1) is injected onto the middle of the body (2) of the plastic card, whereby the upper half (3) of the first mould (3,4) used during the first shot is shaped in such a way that the relief of the module (1) on the upper side that is to be covered and which remains initially free of injected material lies in a fully flat position on the upper half (3) of the mould without any gap therebetween, while the lower side of the module (1) is squeezed out and the lower half of the mould (6) used in the second shot lies in a flat position on the areas (7) of the body of the card that were injected during the first shot.

Description

VERFAHREN ZUM EINGIESSEN EINES FLACHEN ELEKTRONIKMODULS IN EINEM KUNSTSTOFFKARTENKÖRPER DURCH THERMOPLASTISCHES METHOD FOR POURING A FLAT ELECTRONIC MODULE IN A PLASTIC CARD BODY THERMOPLASTIC
SPRITZGIESSENINJECTION MOLDING
Die Erfindung betrifft ein Verfahren zum Eingießen eines flachen Elektronikmoduls mit Außenkontakten in einen Kunststoffkartenkörper durch thermoplastisches Spritzgießen.The invention relates to a method for casting a flat electronic module with external contacts into a plastic card body by thermoplastic injection molding.
Ein derartiges Verfahren ist beispielsweise aus der EP 0 599 194 AI bekannt geworden. Das dort beschriebene Elek- tronikmodul besteht aus einem Leadframe mit darauf montiertem Chip, die so in ein Kunststoffgehäuse eingebettet sind, daß in einer Ebene liegende Außenkontakte des Moduls aus dem Gehäuse hervorstehen. Dieses Modul wird anschließend durch Spritzgießen in einen flachen Kunststoffgegenstand, beispielsweise eine Chipkarte, die typischerweise eine Dicke von lediglich etwa 0,8 mm aufweist, eingebettet.Such a method has become known, for example, from EP 0 599 194 AI. The electronic module described there consists of a leadframe with a chip mounted thereon, which are embedded in a plastic housing in such a way that external contacts of the module protrude from the housing in one plane. This module is then embedded in a flat plastic object, for example a chip card, which typically has a thickness of only about 0.8 mm, by injection molding.
Bei dem bekannten Verfahren wird das Modul weder an der einen noch an der anderen Flachseite mit Thermoplast hintergossen, das heißt, die Dicke des Elektronikmoduls ist gleich der Dik- ke des Thermoplastmaterials des Kunststoffkartenkörpers . Das gehäuste Modul, dessen flache Unterseite typischerweise durch das freiliegende Leadframe gebildet wird, wird in eine Spritzgießform mit einer oberen und unteren Formhälfte eingelegt und anschließend wird das Modul, mit dem Material der Chipkarte genau fluchtend, an seinen Rändern rings umgössen, wobei es durch Zentrierstifte der Gießform im Formhohlraum zusätzlich positioniert wird.In the known method, the module is not cast with thermoplastic on either one of the flat sides, that is, the thickness of the electronic module is equal to the thickness of the thermoplastic material of the plastic card body. The housed module, the flat underside of which is typically formed by the exposed lead frame, is inserted into an injection mold with an upper and lower mold half and then the module, with the material of the chip card exactly in alignment, is cast around its edges, using centering pins the mold is additionally positioned in the mold cavity.
Ähnlich, wie früher die Module in einen vorgefertigten Kartenkörper aus Kunststoff eingefügt wurden, liegt auch heute, wie beschrieben, mindestens eine Fläche des Moduls an derSimilar to how the modules were previously inserted into a prefabricated card body made of plastic, as described above, at least one surface of the module is also on the today
Oberfläche des Chipkartenkörpers an und wird nicht vom Kunststoff bedeckt. Der frühere Aufbau wurde also in die jetzt üb- liehe Spritzgußtechnik übernommen, wobei das Modul einseitig an der Spritzgußform plan aufliegt und beim Spritzgießen angedrückt wird.Surface of the chip card body and is not covered by the plastic. The previous structure was therefore transferred to the now The injection molding technology was taken over, the module lying flat on one side of the injection mold and pressed on during injection molding.
Es hat sich herausgestellt, daß diese bekannte Technik nicht auf das thermoplastische Spritzgießen von relativ großen Elektronikmodulen, das heißt mit einer Fläche von mehr als etwa 100 mm2, die mittig in relativ dicke Kartenkörper mit einer Dicke bis etwa 3 mm, eingebettet werden sollen, über- tragbar ist. Bei derartigen Kartenkörpern ist, wie bei den noch dünneren ein hoher Einspritzdruck, der im Bereich von 600 bis 1200 bar liegt, erforderlich, damit die Spritzmasse in der Spritzform noch ausreichend dünn ausfließt. Dieser hohe Druck ist bei mittig und/oder innig zu positionierenden Modulen nicht beherrschbar, während es beim Umspritzen in größeren Dimensionen nur einfacher Haltemaßnahmen für mittig zu positionierende Teile bedarf, da in diesen Fällen der erforderliche Spritzdruck viel geringer ist.It has been found that this known technique is not intended for the thermoplastic injection molding of relatively large electronic modules, that is to say with an area of more than approximately 100 mm 2 , which are to be embedded in the middle in relatively thick card bodies with a thickness of up to approximately 3 mm. is transferable. With card bodies of this type, as with the even thinner ones, a high injection pressure, which is in the range from 600 to 1200 bar, is required so that the injection compound flows out in the injection mold in a sufficiently thin manner. This high pressure cannot be controlled in the case of modules that are to be positioned centrally and / or intimately, while in the case of encapsulation in larger dimensions, only simple holding measures are required for parts to be positioned in the center, since in these cases the required injection pressure is much lower.
Aufgabe der Erfindung ist daher die Schaffung eines Verfahrens der eingangs genannten Art, das das mittige Einspritzen von relativ großflächigen Elektronikmodulen in Kartenkörper bis zu etwa 3 mm Dicke erlaubt.The object of the invention is therefore to provide a method of the type mentioned at the outset which allows the central injection of relatively large-area electronic modules into card bodies up to approximately 3 mm thick.
Diese Aufgabe wird bei einem Verfahren der eingangs genannten Art dadurch gelöst, daß das Elektronikmodul im Zwei-Schuß- Verfahren mittig im Kunststoffkartenkörper eingespritzt wird, wobei die obere Formhälfte des beim ersten Schuß verwendeten ersten Formwerkzeugs so ausgeprägt ist, daß auf der abzudek- kenden, zunächst von Spritzmasse freibleibenden oberen Seite das Relief des Elektronikmoduls vollständig und lückenlos an der oberen Formhälfte anliegt, während die untere Seite des Elektronikmoduls entsprechend der unteren Formhälfte ausgespritzt wird, und wobei die untere Formhälfte des beim zwei- ten Schuß verwendeten zweiten Formwerkzeugs so ausgeprägt ist, daß sie mindestens an den beim ersten Schuß gespritzten Kartenkörperbereichen vollständig anliegt, während die rest- liehen Kartenkörperbereiche entsprechend der oberen Formhälf¬ te mit Spritzmasse ausgefüllt werden.This object is achieved in a method of the type mentioned at the outset in that the electronic module is injected in the center of the plastic card body using the two-shot method, the upper mold half of the first molding tool used in the first shot being so pronounced that on the one to be covered, First, the relief of the electronic module is completely and seamlessly in contact with the upper mold half, while the lower side of the electronic module is sprayed out corresponding to the lower mold half, and the lower mold half of the second mold used in the second shot is so pronounced, that it lies completely against at least the card body areas injected on the first shot, while the remaining loan card body regions corresponding to the upper Formhälf ¬ te be filled with injection-molding compound.
Zweckmäßige weitere Ausgestaltungen des erfindungsgemäßen Verfahrens sind in den Unteransprüchen angegeben.Appropriate further refinements of the method according to the invention are specified in the subclaims.
Die Erfindung wird nachfolgend an einem Ausführungsbeispiel anhand der Figuren der Zeichnung näher erläutert. Es zeigen:The invention is explained in more detail using an exemplary embodiment with reference to the figures of the drawing. Show it:
Figur 1 in schematischer seitlicher Schnittdarstellung einen fertig gespritzten Kunststoffkartenkör- per,FIG. 1 shows a finished injection-molded plastic card body in a schematic sectional illustration,
Figur 2 und 3 in gleicher Darstellung wie Figur 1 einen Kunststoffkartenkörper in einem Formwerkzeug nach dem ersten bzw. nach dem zweiten Schuß,2 and 3 in the same representation as FIG. 1 a plastic card body in a molding tool after the first or after the second shot,
Figur 4 bis 6 in einer schematischen Draufsicht von oben einen bestückten Chipträger vor der Umspritzung (Figur 4) und nach dem ersten (Figur 5) und nach dem zweiten (Figur 6) Schuß, wobei unterhalb der Figur 5 und 6 die zugehörigen Seitenansichten als Figurenteile angefügt sind.4 to 6 in a schematic plan view from above, an equipped chip carrier before the encapsulation (FIG. 4) and after the first (FIG. 5) and after the second (FIG. 6) shot, with the associated side views as parts of the figure below FIG. 5 and 6 are attached.
Der vorliegenden Erfindung liegt die Erkenntnis zugrunde, daß es einerseits eine notwendige Voraussetzung zum mittigen U - spritzen eines Elektronikmoduls ist, insbesondere wenn dieses ein Leadframe als Chipträger umfaßt, den Leadframe bzw. das Modul nicht so zu belasten, daß der Chip seine Funktionsfä- higkeit verliert, was nur bei Bestehen eines Kräftegleichgewichts beim Einspritzvorgang verhindert werden kann. Dies ist jedoch aus folgenden Gründen beim bekannten Ein-Schuß- Verfahren nicht möglich:The present invention is based on the knowledge that, on the one hand, it is a necessary prerequisite for injecting an electronic module in the middle, in particular if it comprises a lead frame as the chip carrier, not to stress the lead frame or the module in such a way that the chip is functional loses what can only be prevented if there is a balance of forces during the injection process. However, this is not possible with the known one-shot method for the following reasons:
Der Spritzguß ist im Bereich hoher Drücke nicht vollständig reproduzierbar. Die Erhöhung der Formtemperatur führt zu einem Verziehen des Kartenkörpers . Je größer die zu umspritzen- de Chipträgerfläche ist, desto höher sind die unbeherrschba- ren Flächenkräfte. Die Chipträger lassen sich trotz aller Bemühungen im Formwerkzeug nicht oder nur schlecht fixieren. Außerdem treten Turbulenzen auf und hinterlassen Spuren. Es stellt sich heraus, daß Ungleichmäßigkeiten zu einem ungleichmäßigen Fließen führen, bei dem trotz symmetrischer Lage des einzuspritzenden Chipträgers Querkräfte entstehen, die das Leadframe bzw. das Modul an die Spritzgußformwand pressen. Sobald eine geringfügige asymmetrische Lage des Chipträ- gers durch derartige Querkräfte eingetreten ist, besteht die Tendenz, diese asymmetrische Lage zu verstärken, da aufgrund der großen Viskosität der Spritzgußmasse der Fließwiderstand in dünneren Fließkanälen größer als in breiten ist. Dadurch gelangt die Kuststoff asse in den breiten Kanälen schneller in die Flußrichtung voran, womit das Kräftegleichgewicht aus der Waage kommt. Querkräfte werden insbesondere durch Turbulenzen generiert, die beim Einspritzen an Unstetigkeitsstel- len, wie Kanten und Verengungen, aufgrund des hohen Spritzdruckes und der damit verbundenen großen Fließgeschwindigkei- ten entstehen. Diese Wirbelstellen sind äußerlich auch nach dem Entformen als "Wellenberg" noch gut sichtbar.The injection molding is not completely reproducible in the area of high pressures. The increase in the mold temperature leads to a warping of the card body. The bigger the de chip carrier area, the higher the uncontrollable surface forces. Despite all efforts, the chip carriers cannot be fixed in the mold, or only with difficulty. In addition, turbulence occurs and leaves traces. It turns out that unevenness leads to an uneven flow, in which transverse forces arise despite the symmetrical position of the chip carrier to be injected, which press the lead frame or the module against the injection mold wall. As soon as a slight asymmetrical position of the chip carrier has occurred due to such transverse forces, there is a tendency to reinforce this asymmetrical position, since the flow resistance in thinner flow channels is greater than in wide ones due to the high viscosity of the injection molding compound. As a result, the plastic aces advance faster in the wide channels in the direction of the flow, which brings the balance of forces out of balance. Lateral forces are generated in particular by turbulence that occurs during injection at points of discontinuity, such as edges and constrictions, due to the high injection pressure and the associated high flow velocities. These swirl spots are still clearly visible externally even after demolding as a "wave crest".
Die Erfindung beruht mithin darauf, das Kräftegleichgewicht beim mittigen Einspritzen nicht unmittelbar, was nicht mög- lieh erscheint, sondern mittelbar in zwei Spritzphasen mit zwei verschiedenen Formwerkzeugen, von denen eine Formhälfte jeweils die notwendige Gegenkraft zu den in der gegenüberliegenden Formhälfte durch den Spritzvorgang auftretenden Kräfte bildet, herzustellen.The invention is therefore based on the fact that the balance of forces in the middle injection is not immediate, which does not appear to be possible, but rather indirectly in two injection phases with two different molding tools, one half of which in each case has the necessary counterforce to the forces occurring in the opposite half of the mold due to the injection process forms to manufacture.
In Figur 1 ist ein Leadframe 8 erkennbar, auf dem ein gekapselter, also mit einem Kunststoffgehäuse 9 versehener Chip angeordnet ist. Die Herstellung eines derartigen, zum Elektronikmodul 1 selbst gehörenden Kunststoffgehäuses 9 ist prinzipiell unabhängig vom erfindungsgemäßen Verfahren. Der fertige Kartenkörper 2 in Figur 1 ist auf beiden Seiten mit Kunststoff umspritzt, außer im Bereich des Kontaktbereiches 10 des Leadframes, der als Durchkontaktierung ausgeführt ist.1 shows a lead frame 8 on which an encapsulated chip, that is to say provided with a plastic housing 9, is arranged. The production of such a plastic housing 9, which belongs to the electronics module 1 itself, is in principle independent of the method according to the invention. The finished card body 2 in Figure 1 is on both sides Injection molded plastic, except in the area of the contact area 10 of the leadframe, which is designed as a via.
In Figur 2 ist die Lage des Moduls 1 beim ersten Schuß er- kennbar. Die obere Formhälfte 3 des ersten Formwerkzeugs ist so ausgeprägt, daß auf der abzudeckenden Seite das Relief des Moduls 1 auf dieser Seite vollständig und lückenlos anliegt. Vorteilhafterweise wird erst die mehr Reliefstruktur aufweisende Leadframe- bzw. Modulseite, möglicherweise zusammen mit einem Kontaktbereich 10, ausgespritzt, da dann das Negativ für die Modulseite mit weniger Struktur, also die obere Formhälfte 3, einfacher gestaltet werden kann, was besonders bei ungehäusten Modulen bzw. Leiterplatten wichtig ist. Dadurch, daß die obere Seite des Moduls 1 vollständig anliegt, ist kein Unterwandern beim Spritzen möglich und sichergestellt, daß ein Verbiegen des Chipträgers 8 nicht stattfindet.The position of the module 1 on the first shot can be seen in FIG. The upper mold half 3 of the first mold is so pronounced that the relief of the module 1 bears completely and without gaps on the side to be covered. Advantageously, the lead frame or module side with more relief structure is sprayed out, possibly together with a contact area 10, since then the negative for the module side with less structure, i.e. the upper mold half 3, can be made simpler, which is particularly the case with unhoused modules or PCB is important. Due to the fact that the upper side of the module 1 is fully in contact, infiltration during spraying is not possible and it is ensured that the chip carrier 8 does not bend.
Die Lage des teilgespritzten Kartenkörpers 7 beim zweiten Schuß ist in Figur 3 erkennbar. Beim zweiten Schuß werden die restlichen Kartenkörperbereiche 2 entsprechend der oberen Formhälfte 5 des zweiten Formwerkzeugs ausgefüllt, während die Formhälfte 6 plan anliegt. Nach den Entformung, also dem Aushärten, Öffnen des Formwerkzeugs 5, 6 und Austreiben des fertigen Spritzteils, ist der Chipträger 8 vollständig einge- schlössen. Es besteht die Möglichkeit, auch Beschriftungslabel, die in eine der Spritzformen eingelegt werden, in den beiden Spritzgußvorgängen mit einzuspritzen.The position of the partially injected card body 7 in the second shot can be seen in Figure 3. In the second shot, the remaining card body areas 2 are filled in according to the upper mold half 5 of the second mold, while the mold half 6 lies flat. After removal from the mold, ie curing, opening of the molding tool 5, 6 and removal of the finished molded part, the chip carrier 8 is completely enclosed. It is also possible to inject labeling labels that are inserted into one of the injection molds in the two injection molding processes.
In den Figuren 4 bis 6 ist ein weiteres Ausführungsbeispiel dargestellt, bei ein mit zwei Chips 11 bestückter Chipträger 8 ohne Kunststoffgehäuse direkt im erfindungsgemäßen Zwei- Schuß-Verfahren umspritzt wird. In Figur 5 ist der Kunststoffkörper 7 nach dem ersten Schuß erkennbar, wobei auch links und rechts ein bevorzugter Fließkanal 12 für den zwei- ten Schuß dargestellt ist. In Figur 6 ist bei der fertig gespritzten Karte auch die Verbindungsnaht 13 zwischen dem ersten und dem zweiten Schuß angedeutet. Vorteilhafterweise mündet der Anguß für den zweiten Schuß in den bevorzugten Fließkanal 12 für den zweiten Schuß und wird mittels Formeinsatz beim ersten Schuß bereits mit geformt.A further exemplary embodiment is shown in FIGS. 4 to 6, in which a chip carrier 8 equipped with two chips 11 and without a plastic housing is encapsulated directly in the two-shot method according to the invention. The plastic body 7 can be seen in FIG. 5 after the first shot, a preferred flow channel 12 for the second shot also being shown on the left and right. In FIG. 6, the connecting seam 13 between the first and the second weft is also indicated in the finished injection-molded card. Advantageously The sprue for the second shot opens into the preferred flow channel 12 for the second shot and is already formed with the first shot by means of a mold insert.
Als Kunststoff-Thermoplaste bieten sich vornehmlich ABS, PBT, PET, LCP, PA und PC an. ABS, PBT, PET, LCP, PA and PC are the most suitable plastic thermoplastics.

Claims

Patentansprüche claims
1. Verfahren zum Eingießen eines flachen Elektronikmoduls mit Außenkontakten in einen Kunststoffkartenkörper durch thermo- plastisches Spritzgießen, dadurch gekennzeichnet, daß1. A method for casting a flat electronic module with external contacts into a plastic card body by thermoplastic injection molding, characterized in that
- das Elektronikmodul (1) im Zwei-Schuß-Verfahren mittig im Kunststoffkartenkörper (2) eingespritzt wird, wobei- The electronic module (1) is injected in the center of the two-shot process in the plastic card body (2), whereby
- die obere Formhälfte (3) des beim ersten Schuß verwendeten ersten Formwerkzeugs (3, 4) so ausgeprägt ist, daß auf der abzudeckenden, zunächst von Spritzmasse freibleibenden oberen Seite das Relief des Elektronikmoduls (1) vollständig und lückenlos an der oberen Formhälfte (3) anliegt, während die untere Seite des Elektronikmoduls entsprechend der un- teren Formhälfte (4) ausgespritzt wird, und wobei- The upper mold half (3) of the first molding tool (3, 4) used in the first shot is so pronounced that the relief of the electronic module (1) is completely and seamlessly on the upper mold half (3 ) is applied while the lower side of the electronic module is sprayed out according to the lower mold half (4), and
- die untere Formhälfte (6) des beim zweiten Schuß verwendeten zweiten Formwerkzeugs (5, 6) so ausgeprägt ist, daß sie mindestens an den beim ersten Schuß gespritzten Kartenkör- perbereichen (7) vollständig anliegt, während die restli- chen Kartenkörperbereiche entsprechend der oberen Formhälfte (5) mit Spritzmasse ausgefüllt werden.- The lower mold half (6) of the second molding tool (5, 6) used in the second shot is so pronounced that it lies completely against at least the card body areas (7) injected during the first shot, while the remaining card body areas correspond to the upper one Mold half (5) are filled with molding compound.
2 . Verfahren nach Anspruch 1 , d a d u r c h g e k e n n z e i c h n e t , daß als Elektronikmodul (1) ein bestücktes Leadframe (8), eine bestückte Leiterplatte oder ein Multichipmodul verwendet wird, und daß zuerst, also im ersten Schuß, die mehr Reliefstruktur aufweisende Seite des Elektronikmoduls (1) ausgespritzt werden.2nd Method according to Claim 1, characterized in that an assembled lead frame (8), an assembled printed circuit board or a multichip module is used as the electronic module (1), and in that, in the first shot, the side of the electronic module (1) with more relief structure is sprayed out .
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß im ersten Schuß ein bevorzugter Fließkanal (12) für den zweiten Schuß gespritzt wird. 3. The method according to claim 1 or 2, characterized in that in the first shot a preferred flow channel (12) is injected for the second shot.
4. Verfahren nach Anspruch 3, dadurch gekennzeichnet , daß der Anguß für den zweiten Schuß in den bevorzugten Fließkanal (12) mündet und mittels Ausprägung des ersten Formwerk- zeugs (3, 4) beim ersten Schuß geformt wird.4. The method according to claim 3, characterized in that the sprue for the second shot opens into the preferred flow channel (12) and is formed by means of the shape of the first mold (3, 4) on the first shot.
5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß Beschriftungslabel in mindestens einem der Spritzvorgänge in ein Formwerkzeug (3, 4, 5, 6) eingelegt und mit eingespritzt werden. 5. The method according to any one of claims 1 to 4, characterized in that the label in at least one of the spraying operations in a mold (3, 4, 5, 6) are inserted and injected.
EP99953592A 1998-09-29 1999-08-25 Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding Withdrawn EP1118111A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19844640 1998-09-29
DE19844640 1998-09-29
PCT/DE1999/002659 WO2000019513A1 (en) 1998-09-29 1999-08-25 Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding

Publications (1)

Publication Number Publication Date
EP1118111A1 true EP1118111A1 (en) 2001-07-25

Family

ID=7882648

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99953592A Withdrawn EP1118111A1 (en) 1998-09-29 1999-08-25 Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding

Country Status (2)

Country Link
EP (1) EP1118111A1 (en)
WO (1) WO2000019513A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2725149A1 (en) 2012-10-24 2014-04-30 Hexagon Technology Center GmbH Machine control system for a wheel loader comprising a grading blade

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812335B1 (en) 1999-03-23 2004-11-02 The Regents Of The University Of California Human polypeptide receptors for lysophospholipids and sphingolipids and nucleic acids encoding the same
DE102006028816B4 (en) * 2006-06-21 2008-05-15 Hansatronic Gmbh Method for clocked, continuous production of double-sided overmolded flexible printed circuit boards
KR101561996B1 (en) 2012-09-14 2015-10-20 현대모비스 주식회사 card key for vehicle

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217491A (en) * 1984-04-12 1985-10-31 Dainippon Printing Co Ltd Manufacture of ic card
FR2609821B1 (en) * 1987-01-16 1989-03-31 Flonic Sa METHOD FOR REALIZING MEMORY CARDS AND CARDS OBTAINED BY THE IMPLEMENTATION OF SAID METHOD
FR2636755B1 (en) * 1988-09-16 1992-05-22 Schlumberger Ind Sa METHOD FOR PRODUCING MEMORY CARDS AND CARDS OBTAINED BY SAID METHOD
FR2659157B2 (en) * 1989-05-26 1994-09-30 Lemaire Gerard METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED BY THIS PROCESS.
CH686325A5 (en) * 1992-11-27 1996-02-29 Esec Sempac Sa Electronic module and chip card.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0019513A1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2725149A1 (en) 2012-10-24 2014-04-30 Hexagon Technology Center GmbH Machine control system for a wheel loader comprising a grading blade
WO2014064143A1 (en) 2012-10-24 2014-05-01 Hexagon Technology Center Gmbh Machine control system for a wheel loader comprising a grading blade

Also Published As

Publication number Publication date
WO2000019513A1 (en) 2000-04-06

Similar Documents

Publication Publication Date Title
DE69522116T2 (en) INJECTION OF ENCLOSURE MATERIAL ON AN OPTOELECTRONIC COMPONENT
DE69013220T3 (en) Manufacturing process of a chip card
DE60209278T2 (en) Chip antenna and manufacturing method of such an antenna
DE69528421T2 (en) Carrier and method for producing semiconductor arrangements sealed on one side with resin by means of the said carrier
DE3382817T2 (en) Method and apparatus for encapsulating a semiconductor device mounted on a lead frame
DE69534483T2 (en) Leadframe and semiconductor device
CH686325A5 (en) Electronic module and chip card.
CH687685A5 (en) Casting machine and method.
DE102006018364A1 (en) Electronic circuit device as transmitting and receiving apparatus for electronic key system of automobile comprises casing formed to seal entire body of circuit part, mounting face of circuit board and part of terminal with resin material
DE3937996A1 (en) METHOD FOR PRODUCING SEMICONDUCTOR ARRANGEMENTS
DE69519259T2 (en) METHOD FOR RESIN SEALING SEMICONDUCTOR COMPONENTS
DE69324980T2 (en) Connection frame with slots and method for injection molding housings for integrated circuits
DE2900114A1 (en) Encapsulating semiconductor devices with plastic - where device has heat sealing plate in a recess which is either sealed or has grooves to allow easy removal of hardened plastic (NL 11.2.80)
EP0649719B1 (en) Method for manufacturing chip cards by injection moulding
DE69216377T2 (en) Form and method for producing plastic packages for integrated circuits that contain a free metallic heat sink for inspection of the soldered connection
EP0982111A2 (en) Apparatus and method for encapsulating electric circuits by injection moulding
DE112020004809T5 (en) Apparatus for manufacturing a semiconductor, method of manufacturing a semiconductor device using the apparatus, and semiconductor device
EP1118111A1 (en) Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding
DE3508008A1 (en) MOLDING METHOD AND MOLDING DEVICE FOR PARTIAL SURROUNDING A METAL INSERT WITH A PLASTIC MATERIAL
DE69727685T2 (en) SEALING THROWING THREAD
DE10065535C2 (en) injection mold
DE102016109227B4 (en) Method and device for the simultaneous encapsulation of semiconductor dies with layered leadframe strips
DE1614834C2 (en) Method for producing a semiconductor arrangement
DE69828163T2 (en) DEVICE FOR FORMING PLASTIC PACKAGING
DE112006003788B4 (en) Electronic component with leadframe with non-conductive connecting webs and method for producing the electronic component

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20010330

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

RBV Designated contracting states (corrected)

Designated state(s): DE FR GB

17Q First examination report despatched

Effective date: 20060727

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20120824