KR880003401A - 고속 반도체장치 및 그 제조방법 - Google Patents
고속 반도체장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR880003401A KR880003401A KR870009226A KR870009226A KR880003401A KR 880003401 A KR880003401 A KR 880003401A KR 870009226 A KR870009226 A KR 870009226A KR 870009226 A KR870009226 A KR 870009226A KR 880003401 A KR880003401 A KR 880003401A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- compound
- speed semiconductor
- high speed
- less
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000000758 substrate Substances 0.000 claims description 7
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 125000002524 organometallic group Chemical group 0.000 claims 2
- 239000002994 raw material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000103 photoluminescence spectrum Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Junction Field-Effect Transistors (AREA)
- Recrystallisation Techniques (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본원 발명의 설명을 위한 Ⅴ/Ⅲ비와 캐리어 농도와의 관계의 측정결과를 나타낸 곡선도.
제2 및 제3도는 각기(311)B 기판 및 (100)기판상에 MOCVD에 의한 반도체층을 형성한 것의 포토루미네센스 스펙트럼도.
제4도는 본원 발명에 의한 고속 반도체장치의 일례의 약선적 단면도.
Claims (8)
- GaAs 기판과, 이 기판위에 형성된 고저항 Ⅲ-Ⅴ족 화합물 반도체층으로 이루어지며, 상기 반도체층은 상기 기판의 (311)B 면상에 형성되는 고속 반도체장치.
- 제1항에 있어서, 상기 Ⅲ-Ⅴ족 화합물 AlxGa1-xAs이며, 여기에서 x는 1이하인 고속 반도체장치.
- 제1항에 있어서, 상기 Ⅲ-Ⅴ족 화합물은 InyGa1-yAs 이며, 여기에서, y는 1이하인 고속 반도체장치.
- 제1항에 있어서, 상기 화합물 반도체의 Ⅲ족 원료에 대한 Ⅴ족 원료의비(Ⅴ/Ⅲ비)가 100/1이하인 고속 반도체장치.
- 제1항에 있어서, 상기 반도체층은 유기금속기성장(MOCVD)에 의해 형성된 고속 반도체장치.
- GaAs 기판을 배설하고, 유기금속기성장(MOCVD)에 의해 상기 기판의 (311)B면에 고저항 Ⅲ-Ⅴ족 화합물 반도체층을 형성함으로써 이루어지는 고속 반도체장치의 제조방법.
- 제6항에 있어서, 상기 Ⅲ-Ⅴ족 화합물은 AlxGa1-xAs 이며, 여기에서 x는 1이하인 고속 반도체장치의 제조방법.
- 제6항에 있어서, 상기 Ⅲ-Ⅴ족 화합물은 InxGa1-xAs이며, 여기에서 x는 1이하인 고속반도체장치의제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP86-202110 | 1986-08-28 | ||
JP61202110A JPH0783109B2 (ja) | 1986-08-28 | 1986-08-28 | 高速半導体装置 |
JP202110 | 1986-08-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880003401A true KR880003401A (ko) | 1988-05-16 |
KR950014278B1 KR950014278B1 (ko) | 1995-11-24 |
Family
ID=16452126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870009226A KR950014278B1 (ko) | 1986-08-28 | 1987-08-24 | 고속 반도체장치 및 그 제조 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH0783109B2 (ko) |
KR (1) | KR950014278B1 (ko) |
DE (1) | DE3728524C2 (ko) |
FR (1) | FR2611313A1 (ko) |
GB (1) | GB2195050B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR910007414B1 (ko) * | 1989-03-18 | 1991-09-25 | 재단법인 한국전자통신연구소 | 도핑 효과를 개선한 이질구조 화합물 반도체 소자의 제조방법 |
JPH03278542A (ja) * | 1990-03-28 | 1991-12-10 | Hitachi Ltd | 半導体装置 |
EP0535293A1 (en) * | 1991-01-29 | 1993-04-07 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | A method of fabricating a compositional semiconductor device |
JP3360105B2 (ja) * | 1994-03-04 | 2002-12-24 | 富士通株式会社 | 半導体装置の製造方法 |
WO2008063704A2 (en) | 2006-05-03 | 2008-05-29 | Rochester Institute Of Technology | Nanostructured quantum dots or dashes in photovoltaic devices and methods thereof |
JP2010225981A (ja) | 2009-03-25 | 2010-10-07 | Fujitsu Ltd | 光半導体素子、集積素子、光半導体素子の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4830787B1 (ko) * | 1967-12-28 | 1973-09-22 | ||
US3721583A (en) * | 1970-12-08 | 1973-03-20 | Ibm | Vapor phase epitaxial deposition process for forming superlattice structure |
JPS52101698A (en) * | 1976-02-23 | 1977-08-25 | Toshiba Corp | Vapor phase growth of gallium arsenide |
US4122407A (en) * | 1976-04-06 | 1978-10-24 | International Business Machines Corporation | Heterostructure junction light emitting or responding or modulating devices |
-
1986
- 1986-08-28 JP JP61202110A patent/JPH0783109B2/ja not_active Expired - Lifetime
-
1987
- 1987-08-21 GB GB8719817A patent/GB2195050B/en not_active Expired - Lifetime
- 1987-08-24 KR KR1019870009226A patent/KR950014278B1/ko not_active IP Right Cessation
- 1987-08-26 DE DE3728524A patent/DE3728524C2/de not_active Expired - Lifetime
- 1987-08-26 FR FR8711943A patent/FR2611313A1/fr active Pending
Also Published As
Publication number | Publication date |
---|---|
DE3728524C2 (de) | 1996-05-09 |
GB2195050B (en) | 1990-05-30 |
DE3728524A1 (de) | 1988-03-10 |
JPH0783109B2 (ja) | 1995-09-06 |
FR2611313A1 (fr) | 1988-08-26 |
KR950014278B1 (ko) | 1995-11-24 |
JPS6356960A (ja) | 1988-03-11 |
GB2195050A (en) | 1988-03-23 |
GB8719817D0 (en) | 1987-09-30 |
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