KR880003021A - 전자기기용 구리합금 및 그 제조방법 - Google Patents

전자기기용 구리합금 및 그 제조방법 Download PDF

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Publication number
KR880003021A
KR880003021A KR1019860007163A KR860007163A KR880003021A KR 880003021 A KR880003021 A KR 880003021A KR 1019860007163 A KR1019860007163 A KR 1019860007163A KR 860007163 A KR860007163 A KR 860007163A KR 880003021 A KR880003021 A KR 880003021A
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KR
South Korea
Prior art keywords
copper alloy
weight
electronic device
manufacturing
ingot
Prior art date
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KR1019860007163A
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English (en)
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KR930005072B1 (ko
Inventor
마꼬또 아사이
쇼지 시가
도루 다니가와
요시마사 오야마
시게오 시노자끼
Original Assignee
구사까베 에쯔 지
후루까와 덴끼고교 가부시끼 가이샤
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Application filed by 구사까베 에쯔 지, 후루까와 덴끼고교 가부시끼 가이샤 filed Critical 구사까베 에쯔 지
Publication of KR880003021A publication Critical patent/KR880003021A/ko
Application granted granted Critical
Publication of KR930005072B1 publication Critical patent/KR930005072B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

내용 없음

Description

전자기기용 구리합금 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 0.1 내지 3.0중량 %의 Ni, 0.1 내지 1.0중량의 Ti, 0.1 내지 6.0중량 %의 Sn과 Zn, Mn, Mg, 희토류 원소들, Ca, B, Sb, Te, Si, Co, Fe, Zr, Ag와 Al로 이루어진 그룹에서 선택된 1종 또는 2종 이상의 합계가 0.005 내지 3.0중량 % 및 잔부로서 구리와 불가피한 불순물을 포함하며 상기에서 Ni/Ti≥4인 것을 특징으로 하는 전자기기용 구리합금.
  2. 제1항에 있어서, O2의 함량은 20ppm이하이고, 석출물 입자의 직경이 5㎛이하인 것을 특징으로 하는 전자기기용 구리합금.
  3. 제1항의 전자기기용 구리합금을 제조하는 방법에 있어서, 상기 구리합금을 비산화성 분위기에서의 용융주조를 반연속이나 연속 주조법으로 행하여 주괴를 만들고 압연전에 750 내지 960℃에서 0.5 내지 15시간동안 상기 주괴를 균열 및 균질화 처리한 다음 개시온도 700 내지 880℃에서 열간 압연을 행한 직후 즉시 냉각하는 것을 특징으로 하는 전자기기용 구리합금의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860007163A 1985-08-29 1986-08-28 전자기기용 구리합금 및 그 제조방법 KR930005072B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60190605A JPS6250425A (ja) 1985-08-29 1985-08-29 電子機器用銅合金
JP190605 1985-08-29

Publications (2)

Publication Number Publication Date
KR880003021A true KR880003021A (ko) 1988-05-13
KR930005072B1 KR930005072B1 (ko) 1993-06-15

Family

ID=16260848

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860007163A KR930005072B1 (ko) 1985-08-29 1986-08-28 전자기기용 구리합금 및 그 제조방법

Country Status (4)

Country Link
US (1) US4732731A (ko)
JP (1) JPS6250425A (ko)
KR (1) KR930005072B1 (ko)
DE (1) DE3629395A1 (ko)

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JPH0285330A (ja) * 1988-09-20 1990-03-26 Mitsui Mining & Smelting Co Ltd プレス折り曲げ性の良い銅合金およびその製造方法
JPH0765133B2 (ja) * 1988-10-17 1995-07-12 日立粉末冶金株式会社 耐摩耗性銅系焼結含油軸受材料
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JP2529489B2 (ja) * 1991-07-09 1996-08-28 三菱電機株式会社 銅−ニッケル基合金
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US6379478B1 (en) * 1998-08-21 2002-04-30 The Miller Company Copper based alloy featuring precipitation hardening and solid-solution hardening
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US6251199B1 (en) 1999-05-04 2001-06-26 Olin Corporation Copper alloy having improved resistance to cracking due to localized stress
JP2001032029A (ja) * 1999-05-20 2001-02-06 Kobe Steel Ltd 耐応力緩和特性に優れた銅合金及びその製造方法
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EP2161726A1 (en) * 2002-05-17 2010-03-10 Idemitsu Kosan Co., Ltd. Wiring material and wiring board using the same
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JP5306591B2 (ja) * 2005-12-07 2013-10-02 古河電気工業株式会社 配線用電線導体、配線用電線、及びそれらの製造方法
JP5520438B2 (ja) 2006-09-05 2014-06-11 古河電気工業株式会社 線材の製造方法および線材の製造装置
MY168183A (en) 2010-05-14 2018-10-11 Mitsubishi Materials Corp Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
JP5903832B2 (ja) 2011-10-28 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金圧延材及び電子機器用部品
JP5903838B2 (ja) 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
CN102776409B (zh) * 2012-08-24 2014-05-07 宁波市阳光汽车配件有限公司 一种耐蚀铜合金的制备工艺
CN102776410B (zh) * 2012-08-24 2014-05-07 宁波市阳光汽车配件有限公司 一种耐蚀铜合金
DE102013007274B4 (de) * 2013-04-26 2020-01-16 Wieland-Werke Ag Konstruktionsteil aus einer Kupfergusslegierung
CN103740976B (zh) * 2014-01-16 2016-01-20 九星控股集团有限公司 一种海洋工程中用白铜管及其制备方法
CN103898353A (zh) * 2014-04-02 2014-07-02 太原理工大学 一种高强度高导电性能铜合金及其制备方法
US10357943B2 (en) * 2015-01-14 2019-07-23 Lockheed Martin Corporation Articles having an exposed surface coating formed from copper nanoparticles
CN106119598A (zh) * 2016-08-09 2016-11-16 苏州天兼新材料科技有限公司 一种应用于机车引擎部件的铜基复合材料及其制备方法
CN109136637A (zh) * 2018-10-29 2019-01-04 九江中船消防设备有限公司 一种钛微合金化锡青铜合金棒材及其制备方法
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Also Published As

Publication number Publication date
US4732731A (en) 1988-03-22
DE3629395A1 (de) 1987-06-11
KR930005072B1 (ko) 1993-06-15
JPS6250425A (ja) 1987-03-05

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