KR870005561A - 프린트 배선기판 - Google Patents

프린트 배선기판 Download PDF

Info

Publication number
KR870005561A
KR870005561A KR860009348A KR860009348A KR870005561A KR 870005561 A KR870005561 A KR 870005561A KR 860009348 A KR860009348 A KR 860009348A KR 860009348 A KR860009348 A KR 860009348A KR 870005561 A KR870005561 A KR 870005561A
Authority
KR
South Korea
Prior art keywords
wiring board
printed wiring
state
inspecting
note
Prior art date
Application number
KR860009348A
Other languages
English (en)
Other versions
KR940005415B1 (ko
Inventor
마스아끼 오따
Original Assignee
오오가 노리오
소니 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가 노리오, 소니 가부시끼 가이샤 filed Critical 오오가 노리오
Publication of KR870005561A publication Critical patent/KR870005561A/ko
Application granted granted Critical
Publication of KR940005415B1 publication Critical patent/KR940005415B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G01N13/02—Investigating surface tension of liquids
    • G01N2013/0225—Investigating surface tension of liquids of liquid metals or solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

내용 없음

Description

프린트 배선기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예인 프린트 배선기판의 일부를 도시하는 평면도.
제2도는 제1도의 Ⅱ-Ⅱ선에 의한 확대 단면도.
제3a,3b도 및 3c도는 납의 누설성의 검출예를 도시하는 설명도.
제4도는 종래의 프린트 배선기판의 일부를 도시하는 평면도.
제5도의 제4도의 V-V선에 의한 확대 단면도.
제6a도,6b도 및 6c도는 납땜의 상태를 도시하는 설명도.
* 도면의 주요부분에 대한 부호의 설명
1 : 프린트 배선기판 4A 내지 4J : 납땜 랜드부
6 : 레지스트

Claims (1)

  1. 복수의 납땜 랜드부의 간극이 차츰 증대하도록 배열이 되어 있는 랜드부열로 구성된 납의 상태 검사용 패턴이 설치가 되어 있는 것을 특징으로 하는 프린트 배선기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860009348A 1985-11-08 1986-11-06 프린트 배선기판 KR940005415B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP248,710 1985-11-08
JP248710 1985-11-08
JP60248710A JP2575109B2 (ja) 1985-11-08 1985-11-08 プリント配線基板

Publications (2)

Publication Number Publication Date
KR870005561A true KR870005561A (ko) 1987-06-09
KR940005415B1 KR940005415B1 (ko) 1994-06-18

Family

ID=17182183

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860009348A KR940005415B1 (ko) 1985-11-08 1986-11-06 프린트 배선기판

Country Status (5)

Country Link
US (1) US4694121A (ko)
JP (1) JP2575109B2 (ko)
KR (1) KR940005415B1 (ko)
GB (1) GB2183189B (ko)
MY (1) MY100046A (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US4859808A (en) * 1988-06-28 1989-08-22 Delco Electronics Corporation Electrical conductor having unique solder dam configuration
US5304743A (en) * 1992-05-12 1994-04-19 Lsi Logic Corporation Multilayer IC semiconductor package
US5340947A (en) * 1992-06-22 1994-08-23 Cirqon Technologies Corporation Ceramic substrates with highly conductive metal vias
US5679929A (en) * 1995-07-28 1997-10-21 Solectron Corporqtion Anti-bridging pads for printed circuit boards and interconnecting substrates
US5787211A (en) * 1996-04-03 1998-07-28 General Instrument Corporation Of Delaware Optical modulator for CATV systems
KR101128146B1 (ko) * 2005-06-01 2012-03-23 엘지전자 주식회사 인쇄회로기판
DE102006023325B4 (de) * 2006-05-11 2008-06-26 Siemens Ag Verfahren zum Bestimmen der Benetzungsfähigkeit eines Lotmaterials und Träger mit einem benetzbaren Oberflächenabschnitt zur Durchführung dieses Verfahrens
WO2008050511A1 (fr) * 2006-10-26 2008-05-02 Mitsubishi Electric Corporation Carte de circuit imprimé électronique
JP2008177422A (ja) * 2007-01-19 2008-07-31 Toshiba Corp プリント回路板及び電子機器
JP5236707B2 (ja) * 2010-09-22 2013-07-17 日立オートモティブシステムズ株式会社 電子機器制御装置
CN114126200B (zh) * 2021-11-30 2024-06-04 格力电器（合肥）有限公司 Pcb焊盘开孔结构、方法以及电器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1416671A (en) * 1973-02-14 1975-12-03 Siemens Ag Layer circuits
JPS5441102B2 (ko) * 1975-03-04 1979-12-06
JPS5229691A (en) * 1975-09-01 1977-03-05 Shin Meiwa Ind Co Ltd Roller feed type of machine cutting wire to prescribed length
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
DE2729834A1 (de) * 1977-07-01 1979-01-04 Siemens Ag Leiterplatte mit unterschiedlicher rasterteilung
US4339784A (en) * 1980-08-11 1982-07-13 Rca Corporation Solder draw pad
US4529116A (en) * 1983-04-28 1985-07-16 At&T Technologies, Inc. Methods of and devices for determining the soldering capability of a solder wave
US4467638A (en) * 1983-05-13 1984-08-28 Rca Corporation Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system
JPS6076065U (ja) * 1983-10-29 1985-05-28 パイオニア株式会社 プリント基板

Also Published As

Publication number Publication date
GB8626401D0 (en) 1986-12-03
KR940005415B1 (ko) 1994-06-18
JPS62109396A (ja) 1987-05-20
US4694121A (en) 1987-09-15
MY100046A (en) 1989-01-29
JP2575109B2 (ja) 1997-01-22
GB2183189B (en) 1989-02-01
GB2183189A (en) 1987-06-03

Similar Documents

Publication Publication Date Title
KR870005561A (ko) 프린트 배선기판
KR900019544A (ko) 트위스트.프린트 배선
KR870009614A (ko) 드로우 홀 접속부를 가진 인쇄 배선기판
KR890004595A (ko) 전자 부품 내장 구조
KR880003415A (ko) 반도체 집적 회로
KR890012412A (ko) 순응단면을 가지는 전기 커넥터
KR910008824A (ko) 반도체소자패키지 및 반도체소자패키지 탑재배선회로기판
KR880011927A (ko) 반도체 기억장치
KR870004650A (ko) 역류 납땜 장치
KR910003801A (ko) 반도체 집적회로장치 및 그 제조방법
KR920022431A (ko) 반도체 장치용 패키지
KR910010688A (ko) 반도체장치
KR960020629A (ko) 비-환상의 랜드
KR860009332A (ko) 광학소자의 배치구조
KR920003823A (ko) 직접 회로를 회로보오드에 접속하는 방법 및 회로 보오드 어셈블리
KR880700616A (ko) 다층 프린트 기판
KR950035538A (ko) 프린트 배선판
KR900001025A (ko) 반도체장치
KR870005449A (ko) 집적 회로 칩
JPH0355899A (ja) プリント配線板
KR900019220A (ko) 반도체장치
KR910001658A (ko) 테이프캐리어와 그 테스트방법
KR830006817A (ko) 칩부품 탑재용 프린트기판의 제조방법
KR940010302A (ko) 반도체 접속장치
KR890006123A (ko) 칩부품의 냉땜의 방지되는 인쇄회로기판의 랜드구조

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee