KR910001658A - 테이프캐리어와 그 테스트방법 - Google Patents
테이프캐리어와 그 테스트방법 Download PDFInfo
- Publication number
- KR910001658A KR910001658A KR1019900008379A KR900008379A KR910001658A KR 910001658 A KR910001658 A KR 910001658A KR 1019900008379 A KR1019900008379 A KR 1019900008379A KR 900008379 A KR900008379 A KR 900008379A KR 910001658 A KR910001658 A KR 910001658A
- Authority
- KR
- South Korea
- Prior art keywords
- tape carrier
- tape
- test method
- contact inspection
- inspection pattern
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도, 제2도는 본 발명의 각 실시예의 평면도.
Claims (4)
- 테이프(2)상에 도통시험을 행하는 접촉검사용 패턴(31, 3Z)이 형성되어 있는 것을 특징으로 하는 테이프캐리어.
- 제1항에 있어서, 상기 접촉검사용 패턴(31, 3Z)은 테이프패캐지각부근방에 형성되어 있는 것을 특징으로 하는 테이프캐리어.
- 제1항에 있어서, 상기 접촉검사용 패턴(31, 3Z)은 상기 테이프상의 다른 패턴(3)과 함께 형성된 것임을 특징으로 하는 테이프캐리어.
- 테이프캐리어의 테스트를 행함에 있어 그 테스트전에 테이프(2)상에 형성된 접촉검사용 패턴(31, 3Z)의 도통시험을 행하는 것을 특징으로 하는 테이프캐리어의 테스트방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01-148053 | 1989-06-09 | ||
| JP1148053A JPH07109842B2 (ja) | 1989-06-09 | 1989-06-09 | テープキャリアのテスト方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR910001658A true KR910001658A (ko) | 1991-01-31 |
| KR940000749B1 KR940000749B1 (ko) | 1994-01-28 |
Family
ID=15444105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019900008379A KR940000749B1 (ko) | 1989-06-09 | 1990-06-08 | 테이프캐리어와 그 테스트방법 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0401848A3 (ko) |
| JP (1) | JPH07109842B2 (ko) |
| KR (1) | KR940000749B1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439950A (ja) * | 1990-06-05 | 1992-02-10 | Alps Electric Co Ltd | 半導体装置 |
| JPH0648700B2 (ja) * | 1990-12-27 | 1994-06-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 導電性層の剥離防止構造を有するｔａｂテープ |
| CN104483517B (zh) * | 2014-12-31 | 2018-03-27 | 日月光半导体（昆山）有限公司 | 芯片测试工具 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6161439A (ja) * | 1984-09-03 | 1986-03-29 | Toshiba Corp | マスタ−スライス型半導体集積回路装置 |
| JPS62232134A (ja) * | 1986-04-01 | 1987-10-12 | Nec Corp | 半導体装置用テ−プキヤリア |
| JPS6379332A (ja) * | 1986-09-24 | 1988-04-09 | Hitachi Micro Comput Eng Ltd | フイルムキヤリア |
| JPS63141331A (ja) * | 1986-12-03 | 1988-06-13 | Nec Corp | テ−プキヤリア半導体装置用リ−ドフレ−ム |
| JPS6464332A (en) * | 1987-09-04 | 1989-03-10 | Nec Corp | Manufacture of tape carrier type semiconductor device |
-
1989
- 1989-06-09 JP JP1148053A patent/JPH07109842B2/ja not_active Expired - Lifetime
-
1990
- 1990-06-08 KR KR1019900008379A patent/KR940000749B1/ko not_active IP Right Cessation
- 1990-06-08 EP EP19900110876 patent/EP0401848A3/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312945A (ja) | 1991-01-21 |
| EP0401848A3 (en) | 1992-02-26 |
| JPH07109842B2 (ja) | 1995-11-22 |
| EP0401848A2 (en) | 1990-12-12 |
| KR940000749B1 (ko) | 1994-01-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| G160 | Decision to publish patent application | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20021231 Year of fee payment: 10 |
|
| LAPS | Lapse due to unpaid annual fee |