KR920003823A - 직접 회로를 회로보오드에 접속하는 방법 및 회로 보오드 어셈블리 - Google Patents
직접 회로를 회로보오드에 접속하는 방법 및 회로 보오드 어셈블리 Download PDFInfo
- Publication number
- KR920003823A KR920003823A KR1019910013084A KR910013084A KR920003823A KR 920003823 A KR920003823 A KR 920003823A KR 1019910013084 A KR1019910013084 A KR 1019910013084A KR 910013084 A KR910013084 A KR 910013084A KR 920003823 A KR920003823 A KR 920003823A
- Authority
- KR
- South Korea
- Prior art keywords
- solder
- circuit board
- contact
- attached
- pattern
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims 18
- 239000006071 cream Substances 0.000 claims 4
- 230000000295 complement effect Effects 0.000 claims 3
- 238000007650 screen-printing Methods 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 방법에 따라 처리된 직접회로 칩상의 접촉부에 대한 개략 단면도
제2도는 인쇄 회로 기판상에 직접회로 칩을 조립한 모양을 나타낸 개략 단면도
Claims (12)
- 전자부품 또는 회로 보오드중 하나의 접촉부상에 소정의 납땜 패턴으로 땜납을 부착하는 단계와; 부착된 납땜 패턴으로 하여금 접촉부에 대해 융기되도록 하는 단계와; 한편의 소정의 납땜 패턴과 다른 편의 상보적 접촉부가 정렬되도록 전자 부품과 회로 보오드가 서로 마주보고 인접되게 하는 단계와; 전자 부품의 각 접촉부와 회로 보오드를 접합시키도록 땜납을 다시 흐르게 하는 단계를 포함하는 것을 특징으로 하는 전자 부품을 회로 보오드에 접속하는 방법.
- 제1항에 있어서, 상기 부착된 납땜 패턴은 상기 접촉부상에 땜납 크림을 스크린 프린팅 함으로써 형성되는 것을 특징으로 하는 방법.
- 제2항에 있어서, 상기 땜납 크림은 상기 접촉부위의 최소한 50μ두께가 있는 층으로 부착되는 것을 특징으로 하는 방법.
- 제2항에 있어서, 상기 부착된 땜납 크림은 전자 부품과 회로 보오드가 서로 대향하여 인접하게 하기 전에, 상기 접촉부상에 납땜 융기부를 형성하도록 다시 흐르게 되는 것을 특징으로 하는 방법.
- 제4항에 있어서, 상기 부착된 땜납 크림의 두께는 다시 흐르게 되어 형성된 납땜 융기부가 최소한 30μ높이가 되도록한 것을 특징으로 하는 방법.
- 제1항에 있어서, 상기 납땜 패턴은 접촉부를 웨이브 납땜함으로써, 접촉부 상에 납땜융기부를 부착시키는 것에 의해 형성되는 것을 특징으로 하는 방법.
- 제1항 내지 제6항중 어느 한 항에 있어서, 상기 다른 전자 부품 또는 회로 보오드의 상보적 접촉부에 상보적 땜납 패턴내의 땜납을 부착시키는 단계를 포함하는 것을 특징으로 하는 방법.
- 제1항 내지 제7항중 어느 한 항에 있어서, 상기 전자 부품은 직접회로인 것을 특징으로 하는 방법.
- 제1항 내지 제8항중 어느 한 항에 있어서, 땜납 마스크는 그위에 땜납을 부착시키기 전에 스크린 인쇄하여 전자부품 또는 회로 보오드중 하나에 부착되는 것을 특징으로 하는 방법.
- 제1항 내지 제9항중 어느 한 항에 있어서, 실리콘 웨이피상에 협성된 복수의 전자 부품들과 동시에 부착된 납땜을 갖는 것을 특징으로 하는 방법.
- 제1항 내지 제10항중 어느 한 항에 있어서, 복수의 전자부품은 다수의 회로 보오드에 동시에 연결되고 상기 다수의 회로 보오드는 개개의 보오드로 분리 전달되는 것을 특징으로 하는 방법.
- 제1항 내지 제11항중 어느 한 항의 방법에 의해 형성된 것을 특징으로 하는 회로 보오드 어셈블리.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ZA915965A ZA915965B (en) | 1990-07-30 | 1990-07-30 | Attaching integrated circuits to circuit boards |
ZA90/5965 | 1990-07-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR920003823A true KR920003823A (ko) | 1992-02-29 |
Family
ID=25580228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910013084A KR920003823A (ko) | 1990-07-30 | 1991-07-30 | 직접 회로를 회로보오드에 접속하는 방법 및 회로 보오드 어셈블리 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0469848A3 (ko) |
JP (1) | JPH04233792A (ko) |
KR (1) | KR920003823A (ko) |
AU (1) | AU653945B2 (ko) |
CA (1) | CA2048035A1 (ko) |
ZA (1) | ZA915965B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2268628B (en) * | 1992-07-07 | 1995-10-11 | Northern Telecom Ltd | Affixing dielectric resonator on p.c.b. |
US6077725A (en) * | 1992-09-03 | 2000-06-20 | Lucent Technologies Inc | Method for assembling multichip modules |
US5346118A (en) * | 1993-09-28 | 1994-09-13 | At&T Bell Laboratories | Surface mount solder assembly of leadless integrated circuit packages to substrates |
FR2724526B1 (fr) * | 1994-09-14 | 1996-12-13 | Peugeot | Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprime |
DE19702186C2 (de) * | 1997-01-23 | 2002-06-27 | Fraunhofer Ges Forschung | Verfahren zur Gehäusung von integrierten Schaltkreisen |
US6036084A (en) * | 1997-02-06 | 2000-03-14 | Tdk Corporation | Screen printing method and apparatus therefor, and electronic component soldering method using screen printing and apparatus therefor |
FR2762715B1 (fr) * | 1997-04-28 | 2000-07-21 | Novatec | Procede de realisation et de brasage de billes de connexion electrique sur des plages d'accueil de raccordement electrique de circuits ou de composants electroniques et dispositif de mise en oeuvre |
US6372624B1 (en) * | 1997-08-04 | 2002-04-16 | Micron Technology, Inc. | Method for fabricating solder bumps by wave soldering |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149763A (en) * | 1977-06-01 | 1978-12-27 | Citizen Watch Co Ltd | Mounting method of semiconductor integrate circuit |
US4545610A (en) * | 1983-11-25 | 1985-10-08 | International Business Machines Corporation | Method for forming elongated solder connections between a semiconductor device and a supporting substrate |
US4600137A (en) * | 1985-02-21 | 1986-07-15 | Hollis Automation, Inc. | Method and apparatus for mass soldering with subsequent reflow soldering |
JPH01160028A (ja) * | 1987-12-17 | 1989-06-22 | Matsushita Electric Ind Co Ltd | 電極の接続方法 |
WO1990007792A1 (en) * | 1989-01-03 | 1990-07-12 | Motorola, Inc. | Method of making high density solder bumps and a substrate socket for high density solder bumps |
US5024372A (en) * | 1989-01-03 | 1991-06-18 | Motorola, Inc. | Method of making high density solder bumps and a substrate socket for high density solder bumps |
US5071787A (en) * | 1989-03-14 | 1991-12-10 | Kabushiki Kaisha Toshiba | Semiconductor device utilizing a face-down bonding and a method for manufacturing the same |
US5059553A (en) * | 1991-01-14 | 1991-10-22 | Ibm Corporation | Metal bump for a thermal compression bond and method for making same |
-
1990
- 1990-07-30 ZA ZA915965A patent/ZA915965B/xx unknown
-
1991
- 1991-07-29 AU AU81439/91A patent/AU653945B2/en not_active Ceased
- 1991-07-29 CA CA002048035A patent/CA2048035A1/en not_active Abandoned
- 1991-07-30 KR KR1019910013084A patent/KR920003823A/ko active IP Right Grant
- 1991-07-30 JP JP3190227A patent/JPH04233792A/ja active Pending
- 1991-07-30 EP EP19910306961 patent/EP0469848A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CA2048035A1 (en) | 1992-01-31 |
EP0469848A3 (en) | 1992-12-16 |
EP0469848A2 (en) | 1992-02-05 |
JPH04233792A (ja) | 1992-08-21 |
ZA915965B (en) | 1992-04-29 |
AU8143991A (en) | 1992-02-06 |
AU653945B2 (en) | 1994-10-20 |
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