FR2724526B1 - Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprime - Google Patents
Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprimeInfo
- Publication number
- FR2724526B1 FR2724526B1 FR9410978A FR9410978A FR2724526B1 FR 2724526 B1 FR2724526 B1 FR 2724526B1 FR 9410978 A FR9410978 A FR 9410978A FR 9410978 A FR9410978 A FR 9410978A FR 2724526 B1 FR2724526 B1 FR 2724526B1
- Authority
- FR
- France
- Prior art keywords
- plots
- printed circuit
- conductive portions
- forming soldering
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9410978A FR2724526B1 (fr) | 1994-09-14 | 1994-09-14 | Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprime |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9410978A FR2724526B1 (fr) | 1994-09-14 | 1994-09-14 | Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprime |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2724526A1 FR2724526A1 (fr) | 1996-03-15 |
FR2724526B1 true FR2724526B1 (fr) | 1996-12-13 |
Family
ID=9466938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9410978A Expired - Fee Related FR2724526B1 (fr) | 1994-09-14 | 1994-09-14 | Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprime |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2724526B1 (fr) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4872261A (en) * | 1987-12-11 | 1989-10-10 | Digital Equipment Corporation | Method of and apparatus for surface mounting electronic components onto a printed wiring board |
ZA915965B (en) * | 1990-07-30 | 1992-04-29 | South Africa Ind Dev Corp | Attaching integrated circuits to circuit boards |
JPH04336490A (ja) * | 1991-05-13 | 1992-11-24 | Sharp Corp | リフローハンダの形成方法 |
JPH05177965A (ja) * | 1992-01-07 | 1993-07-20 | Matsushita Electric Ind Co Ltd | クリーム半田印刷用メタルマスク構造 |
US5403671A (en) * | 1992-05-12 | 1995-04-04 | Mask Technology, Inc. | Product for surface mount solder joints |
JP3364266B2 (ja) * | 1993-03-17 | 2003-01-08 | ローム株式会社 | バンプの形成法 |
US5346118A (en) * | 1993-09-28 | 1994-09-13 | At&T Bell Laboratories | Surface mount solder assembly of leadless integrated circuit packages to substrates |
-
1994
- 1994-09-14 FR FR9410978A patent/FR2724526B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2724526A1 (fr) | 1996-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2575630B1 (fr) | Procede de montage d'elements de circuit du type puce sur des plaquettes de circuit imprime et appareil associe | |
KR960009816A (ko) | 인쇄 회로 기판상에 미세 피치 땜납 피착 방법 및 그 제품 | |
FR2593016B1 (fr) | Procede pour former des circuits electriques sur une plaquette de base | |
FR2575627B1 (fr) | Procede de fabrication d'une carte multicouche de circuits imprimes | |
GB9113916D0 (en) | Method of manufacturing a printed wiring board | |
EP0478320A3 (en) | Method for manufacturing printed circuit board | |
GB2316901B (en) | Printed circuit board for flow soldering | |
GB2246480B (en) | A method of manufacturing a printed circuit board | |
GB2330331B (en) | Method of forming a circuit element on a surface | |
GB9302228D0 (en) | Method of forming discrete solder portions on respective contact pads of a printed circuit board | |
FR2724526B1 (fr) | Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprime | |
EP0669793A3 (fr) | Procédé de fabrication d'un panneau à circuit imprimé. | |
GB9218566D0 (en) | A method of manufacturing a printed wirring board | |
FR2733656B1 (fr) | Procede de fabrication d'un dispositif a circuit imprime pour un appareil electrique | |
GB2291216B (en) | Method of manufacturing a printed circuit board | |
IL103439A0 (en) | Method of forming a printed circuit board | |
GB2284509B (en) | Method of making a printed circuit board | |
FR2773262B1 (fr) | Procede de formation d'elements conducteurs dans un circuit integre | |
FR2598055B1 (fr) | Procede de brasage de composants de surface sur un circuit imprime | |
FR2646583B1 (fr) | Procede pour fabriquer des plaquettes a circuits imprimes | |
FR2753304B1 (fr) | Procede de fabrication d'un bouchon conducteur | |
GB2246477B (en) | Method of manufacturing a printed wiring board | |
GB2267784B (en) | Method of making a printed circuit board | |
GB9027821D0 (en) | A method of forming an insulating layer on a printed circuit board | |
GB2247570B (en) | A method of manufacturing a printed circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |