KR850006265A - 투명 도전막과의 접속구조체 - Google Patents

투명 도전막과의 접속구조체 Download PDF

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Publication number
KR850006265A
KR850006265A KR1019850000148A KR850000148A KR850006265A KR 850006265 A KR850006265 A KR 850006265A KR 1019850000148 A KR1019850000148 A KR 1019850000148A KR 850000148 A KR850000148 A KR 850000148A KR 850006265 A KR850006265 A KR 850006265A
Authority
KR
South Korea
Prior art keywords
conductive film
transparent conductive
metal
connection structure
oxide transparent
Prior art date
Application number
KR1019850000148A
Other languages
English (en)
Other versions
KR930004858B1 (ko
Inventor
요시오(외 5) 후지와라
Original Assignee
오오가 노리오
소니 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가 노리오, 소니 가부시끼가이샤 filed Critical 오오가 노리오
Publication of KR850006265A publication Critical patent/KR850006265A/ko
Application granted granted Critical
Publication of KR930004858B1 publication Critical patent/KR930004858B1/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Databases & Information Systems (AREA)
  • General Physics & Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

내용 없음

Description

투명 도전막과의 접속구조체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 투명 도전막과의 접속구조체를 설명하기 위한 분해 평면도,
제2도는 본 발명에 의한 투명 도전막과의 접속구조체의 확대평면도,
제3도는 제2도의 A-A선에 따른 단면도.
* 도면의 부호에 대한 설명
1 : 투명 기판, 2 : 투명 기판상의 도전막으로 되는 투명 전극패턴, 3 : 가요성 기판, 4 : 가요성 기판상에 형성된 외부 리드로 된 도전막으로 이루어진 도전 패턴.

Claims (1)

  1. 산화물 투명 도전막과, 이에 접속되는 도전막과의 서로의 접속부가 중합되고, 이 중합부에 Pb-Sn을 모합금으로 하여 이것에 Zn, 회토류 금속중의 적어도 1종류 이상의 금속을 배합한 금속입자를 분산시킨 절연성 접착제층을 개재하고, 상기 접착제층이 상기 산화물 투명 도전막과 상기 도전막과의 사이에 있어서 가압 가열되어, 상기 산화물 투명 도전막과 상기 도전막이 상기 금속입자의 용융에 의해 전기적으로 접속된 투명 도전막과의 접속구조체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850000148A 1984-02-10 1985-01-11 투명 전도막과 전도막의 접속 구조체 KR930004858B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59023882A JPS60170176A (ja) 1984-02-10 1984-02-10 透明導電膜との接続構造体
JP84-23882 1984-02-10
JP23882 1984-02-10

Publications (2)

Publication Number Publication Date
KR850006265A true KR850006265A (ko) 1985-10-02
KR930004858B1 KR930004858B1 (ko) 1993-06-09

Family

ID=12122815

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850000148A KR930004858B1 (ko) 1984-02-10 1985-01-11 투명 전도막과 전도막의 접속 구조체

Country Status (2)

Country Link
JP (1) JPS60170176A (ko)
KR (1) KR930004858B1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6144494A (ja) * 1984-08-09 1986-03-04 ソニー株式会社 電気的接続体
JPS61228490A (ja) * 1985-04-02 1986-10-11 株式会社日立製作所 表示装置の接続構造
JP2598030B2 (ja) * 1986-09-11 1997-04-09 株式会社東芝 液晶表示装置
JPH0644132Y2 (ja) * 1987-09-16 1994-11-14 日立化成工業株式会社 回路の接続構造
JPH06103701B2 (ja) * 1988-03-11 1994-12-14 松下電器産業株式会社 半導体装置の実装体
JP2652107B2 (ja) * 1992-06-18 1997-09-10 セイコーエプソン株式会社 電気的接続構造
JP2821729B2 (ja) * 1994-09-05 1998-11-05 株式会社日立製作所 フラットパネル表示装置
JP2630314B2 (ja) * 1995-12-04 1997-07-16 セイコーエプソン株式会社 液晶装置
JP6187918B2 (ja) * 2015-04-23 2017-08-30 パナソニックＩｐマネジメント株式会社 回路部材の接続構造、接続方法および接続材料
JP6474008B2 (ja) * 2017-03-29 2019-02-27 パナソニックＩｐマネジメント株式会社 接続材料
JP6513134B2 (ja) 2017-05-26 2019-05-15 レノボ・シンガポール・プライベート・リミテッド ケーブル接続構造及びケーブル接続方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644717B2 (ja) * 1983-12-06 1997-08-25 松下電器産業株式会社 シート状異方導電性接着剤

Also Published As

Publication number Publication date
KR930004858B1 (ko) 1993-06-09
JPS60170176A (ja) 1985-09-03

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