GB1224953A - Improvements in or relating to thin film electric circuits - Google Patents

Improvements in or relating to thin film electric circuits

Info

Publication number
GB1224953A
GB1224953A GB42341/69A GB4234169A GB1224953A GB 1224953 A GB1224953 A GB 1224953A GB 42341/69 A GB42341/69 A GB 42341/69A GB 4234169 A GB4234169 A GB 4234169A GB 1224953 A GB1224953 A GB 1224953A
Authority
GB
United Kingdom
Prior art keywords
thin film
layers
layer
relating
electric circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB42341/69A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1224953A publication Critical patent/GB1224953A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

1,224,953. Thin film circuits; resistors. SIEMENS A.G. 26 Aug., 1969 [27 Aug., 1968], No. 42341/69. Headings HlR and HIS. A thin film circuit comprises a non-conductive substitute 1 having applied thereon a resistive layer 2 of a chromium-nickel alloy, a protective layer 3 of iron, cobalt, nickel or aluminium and a highly conductive layer 4 of gold or copper in that order, layers being selectively etched to form resistive elements and conductive paths. Capacitors may also be formed (Fig. 3, not shown). The substrate may be of glass. The protective layer prevents diffusion of the highly conductive layer into the resistive layer. Layers 4 and 3 may be etched together and more than three layers may be used. The layers may be vaporized on to the substrate.
GB42341/69A 1968-08-27 1969-08-26 Improvements in or relating to thin film electric circuits Expired GB1224953A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681790013 DE1790013B1 (en) 1968-08-27 1968-08-27 ELECTRIC THIN-FILM CIRCUIT

Publications (1)

Publication Number Publication Date
GB1224953A true GB1224953A (en) 1971-03-10

Family

ID=5706837

Family Applications (1)

Application Number Title Priority Date Filing Date
GB42341/69A Expired GB1224953A (en) 1968-08-27 1969-08-26 Improvements in or relating to thin film electric circuits

Country Status (6)

Country Link
BE (1) BE738050A (en)
DE (1) DE1790013B1 (en)
FR (1) FR2016443A1 (en)
GB (1) GB1224953A (en)
LU (1) LU59346A1 (en)
NL (1) NL6911018A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137421A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Printed circuits

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2159848A5 (en) * 1971-11-05 1973-06-22 Bosch
DE3107943A1 (en) * 1981-03-02 1982-09-16 Siemens AG, 1000 Berlin und 8000 München METHOD FOR THE PRODUCTION OF SOLDERABLE AND TEMPERATURE-ENDED METAL-FREE THICK-LAYER CONDUCTORS
DE3107857C2 (en) * 1981-03-02 1984-08-23 Siemens AG, 1000 Berlin und 8000 München Process for the production of thin-film circuits with very easily solderable interconnect layer systems

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3406043A (en) * 1964-11-09 1968-10-15 Western Electric Co Integrated circuit containing multilayer tantalum compounds

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137421A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Printed circuits
US4572925A (en) * 1983-03-15 1986-02-25 Standard Telephones And Cables Public Limited Company Printed circuit boards with solderable plating finishes and method of making the same

Also Published As

Publication number Publication date
LU59346A1 (en) 1970-01-07
BE738050A (en) 1970-02-27
DE1790013B1 (en) 1971-11-25
FR2016443A1 (en) 1970-05-08
DE1790013C2 (en) 1973-10-11
NL6911018A (en) 1970-03-03

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