GB1026114A - Improvements in or relating to electrical circuits formed on insulating carrier wafers - Google Patents

Improvements in or relating to electrical circuits formed on insulating carrier wafers

Info

Publication number
GB1026114A
GB1026114A GB4936363A GB4936363A GB1026114A GB 1026114 A GB1026114 A GB 1026114A GB 4936363 A GB4936363 A GB 4936363A GB 4936363 A GB4936363 A GB 4936363A GB 1026114 A GB1026114 A GB 1026114A
Authority
GB
United Kingdom
Prior art keywords
layer
inner layer
alloy
layers
relating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4936363A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens AG
Original Assignee
Siemens and Halske AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens AG filed Critical Siemens and Halske AG
Publication of GB1026114A publication Critical patent/GB1026114A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C13/00Resistors not provided for elsewhere
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate

Abstract

1,026,114. Printed circuits. SIEMENS & HALSKE A.G. Dee. 13, 1963 [Dec. 18, 1962], No. 49363/63. Heading H1R. In a circuit comprising components mounted on an insulating wafer, conductive paths and/or contacts are formed by a plurality of metal layers, the inner layer which contacts the wafer being made of Cr, Mg or chromiumnickel alloy and the outer layer, which is alloyed to an inner layer, being made of gold. The inner layer has a resistance of between 50 and 500 ohms per square, and the Au layer has a resistance of between 0À05 and 1 ohm par square; preferred values are 100 and 0À2 ohms per square, respectively. As shown, a circuit on an insulating wafer 1 comprises two capacitors of which dielectric layers-4, 5 and electrode layers 6, 7 are visible, resistors 3, a transistor 8, and a power source 9. Conductive paths and a contact 2 are formed by vapourdeposition in vacuo of an inner layer of Cr-Ni alloy, followed, with continuous or discontinuous transition, by deposition of an outer layer of Au; annealing may then be effected. The alloy layer of Cr-Ni with Au should not extend to either surface of the conductor. A plurality of alternate Cr-Ni and Au layers may be used.
GB4936363A 1962-12-18 1963-12-13 Improvements in or relating to electrical circuits formed on insulating carrier wafers Expired GB1026114A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962S0082923 DE1257918B (en) 1962-12-18 1962-12-18 Integrated circuit

Publications (1)

Publication Number Publication Date
GB1026114A true GB1026114A (en) 1966-04-14

Family

ID=7510694

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4936363A Expired GB1026114A (en) 1962-12-18 1963-12-13 Improvements in or relating to electrical circuits formed on insulating carrier wafers

Country Status (3)

Country Link
CH (1) CH426966A (en)
DE (1) DE1257918B (en)
GB (1) GB1026114A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2183603B1 (en) * 1972-05-12 1974-08-30 Cit Alcatel
DE2833919C2 (en) * 1978-08-02 1982-06-09 Siemens AG, 1000 Berlin und 8000 München Process for the production of electrical layer circuits on plastic foils

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB874965A (en) * 1958-07-09 1961-08-16 G V Planer Ltd Improvements in or relating to electrical circuits or circuit elements

Also Published As

Publication number Publication date
DE1257918B (en) 1968-01-04
CH426966A (en) 1966-12-31

Similar Documents

Publication Publication Date Title
GB1082106A (en) Improvements in and relating to electrical circuits
US2560792A (en) Electrolytic surface treatment of germanium
SE7513853L (en) PROCEDURE FOR MANUFACTURE OF ELECTRICAL CONDUCTORS ON AN INSULATING SUBSTRATE
IE39514B1 (en) Improvements in or relating to thin-film electrical circuits
GB1298475A (en) Improvements in or relating to electrical components
US3759798A (en) Method of producing electrically insulated aluminum contacts
GB1389338A (en) Surge protective devices and methods of making same
GB1359780A (en) Beam-lead semiconductor components
GB1041204A (en) Improvements in or relating to electrical terminal connectors
GB1026114A (en) Improvements in or relating to electrical circuits formed on insulating carrier wafers
GB1412986A (en) Thin-film circuit assemblies
EP0340466A3 (en) Semiconductor device comprising leads
GB1032519A (en) An electric two-layer sintered contact body having high resistance to welding
GB1234858A (en) Terminal construction for electrical circuit element
EP0303083A3 (en) Barrier layer containing conductive articles
JPS6486527A (en) Ccb tape carrier
GB1473249A (en) Electrical switching contacts
GB1224953A (en) Improvements in or relating to thin film electric circuits
GB1176582A (en) A Hard Solder Electrical Device
JPS57130443A (en) Substrate for hybrid integrated circuit
GB1271121A (en) Method of producing contacts
JPS5571053A (en) Circuit device
GB1302987A (en)
JPS6454797A (en) Multilayer interconnection substrate
JPS5642362A (en) Package for integrated circuit