KR20230025525A - 스핀 코팅 장치 - Google Patents

스핀 코팅 장치 Download PDF

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Publication number
KR20230025525A
KR20230025525A KR1020237002125A KR20237002125A KR20230025525A KR 20230025525 A KR20230025525 A KR 20230025525A KR 1020237002125 A KR1020237002125 A KR 1020237002125A KR 20237002125 A KR20237002125 A KR 20237002125A KR 20230025525 A KR20230025525 A KR 20230025525A
Authority
KR
South Korea
Prior art keywords
spin coating
thickness
unit
film
coating apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020237002125A
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English (en)
Korean (ko)
Inventor
도모시게 야마다
Original Assignee
미카사 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미카사 가부시키가이샤 filed Critical 미카사 가부시키가이샤
Publication of KR20230025525A publication Critical patent/KR20230025525A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H01L21/027—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
KR1020237002125A 2020-06-26 2020-06-26 스핀 코팅 장치 Ceased KR20230025525A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/025336 WO2021260943A1 (ja) 2020-06-26 2020-06-26 スピンコーティング装置

Publications (1)

Publication Number Publication Date
KR20230025525A true KR20230025525A (ko) 2023-02-21

Family

ID=79282127

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237002125A Ceased KR20230025525A (ko) 2020-06-26 2020-06-26 스핀 코팅 장치

Country Status (6)

Country Link
US (1) US20230266669A1 (https=)
EP (1) EP4173725A4 (https=)
JP (1) JPWO2021260943A1 (https=)
KR (1) KR20230025525A (https=)
CN (1) CN115916420A (https=)
WO (1) WO2021260943A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117637545B (zh) * 2023-11-30 2024-08-23 重庆大学 一种实验室用半自动化钙钛矿太阳能电池制备方法及其制备系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006231262A (ja) 2005-02-28 2006-09-07 Fuji Photo Film Co Ltd スピンコート製膜法
JP2010040921A (ja) 2008-08-07 2010-02-18 Tokyo Electron Ltd 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP2012256780A (ja) 2011-06-10 2012-12-27 Fuji Electric Co Ltd スピンコート法によるレジスト塗布方法
JP2014022452A (ja) 2012-07-13 2014-02-03 Toyota Motor Corp スピンコート装置
JP2016073240A (ja) 2014-10-07 2016-05-12 積水化学工業株式会社 スピンコート用シャーレ
JP2018202318A (ja) 2017-06-02 2018-12-27 キヤノン株式会社 スピンコータ装置、スピンコート方法、ドライフィルムレジストの製造方法および液体吐出ヘッドの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278021A (ja) * 1988-04-29 1989-11-08 Nec Corp レジストの塗布装置
JPH0265225A (ja) * 1988-08-31 1990-03-05 General Signal Japan Kk フォトレジストの塗布方法
JPH02142113A (ja) * 1988-11-22 1990-05-31 Kawasaki Steel Corp レジスト塗布装置
JP2768720B2 (ja) * 1989-03-02 1998-06-25 三菱電機株式会社 塗布装置
JPH02233176A (ja) * 1989-03-06 1990-09-14 Mitsubishi Electric Corp 塗布装置
JP3960633B2 (ja) * 1995-02-27 2007-08-15 リソテック ジャパン株式会社 膜厚制御方法および装置
JPH10328614A (ja) * 1997-05-30 1998-12-15 Mitsubishi Chem Corp 着色レジストの塗布方法
JP3641162B2 (ja) * 1998-04-20 2005-04-20 東京エレクトロン株式会社 塗布膜形成装置及びその方法並びにパターン形成方法
JP4342327B2 (ja) * 2004-01-26 2009-10-14 住友化学株式会社 枚葉塗膜形成方法
JP2006030070A (ja) * 2004-07-20 2006-02-02 Opto One Kk 膜厚検査装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006231262A (ja) 2005-02-28 2006-09-07 Fuji Photo Film Co Ltd スピンコート製膜法
JP2010040921A (ja) 2008-08-07 2010-02-18 Tokyo Electron Ltd 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP2012256780A (ja) 2011-06-10 2012-12-27 Fuji Electric Co Ltd スピンコート法によるレジスト塗布方法
JP2014022452A (ja) 2012-07-13 2014-02-03 Toyota Motor Corp スピンコート装置
JP2016073240A (ja) 2014-10-07 2016-05-12 積水化学工業株式会社 スピンコート用シャーレ
JP2018202318A (ja) 2017-06-02 2018-12-27 キヤノン株式会社 スピンコータ装置、スピンコート方法、ドライフィルムレジストの製造方法および液体吐出ヘッドの製造方法

Also Published As

Publication number Publication date
JPWO2021260943A1 (https=) 2021-12-30
US20230266669A1 (en) 2023-08-24
EP4173725A4 (en) 2024-04-24
CN115916420A (zh) 2023-04-04
EP4173725A1 (en) 2023-05-03
WO2021260943A1 (ja) 2021-12-30

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