JPWO2021260943A1 - - Google Patents
Info
- Publication number
- JPWO2021260943A1 JPWO2021260943A1 JP2022532225A JP2022532225A JPWO2021260943A1 JP WO2021260943 A1 JPWO2021260943 A1 JP WO2021260943A1 JP 2022532225 A JP2022532225 A JP 2022532225A JP 2022532225 A JP2022532225 A JP 2022532225A JP WO2021260943 A1 JPWO2021260943 A1 JP WO2021260943A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/025336 WO2021260943A1 (ja) | 2020-06-26 | 2020-06-26 | スピンコーティング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021260943A1 true JPWO2021260943A1 (https=) | 2021-12-30 |
| JPWO2021260943A5 JPWO2021260943A5 (https=) | 2023-03-10 |
Family
ID=79282127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022532225A Pending JPWO2021260943A1 (https=) | 2020-06-26 | 2020-06-26 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230266669A1 (https=) |
| EP (1) | EP4173725A4 (https=) |
| JP (1) | JPWO2021260943A1 (https=) |
| KR (1) | KR20230025525A (https=) |
| CN (1) | CN115916420A (https=) |
| WO (1) | WO2021260943A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117637545B (zh) * | 2023-11-30 | 2024-08-23 | 重庆大学 | 一种实验室用半自动化钙钛矿太阳能电池制备方法及其制备系统 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142113A (ja) * | 1988-11-22 | 1990-05-31 | Kawasaki Steel Corp | レジスト塗布装置 |
| JPH02229577A (ja) * | 1989-03-02 | 1990-09-12 | Mitsubishi Electric Corp | 塗布装置 |
| JPH08236430A (ja) * | 1995-02-27 | 1996-09-13 | Risotetsuku Japan Kk | 膜厚制御方法および装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01278021A (ja) * | 1988-04-29 | 1989-11-08 | Nec Corp | レジストの塗布装置 |
| JPH0265225A (ja) * | 1988-08-31 | 1990-03-05 | General Signal Japan Kk | フォトレジストの塗布方法 |
| JPH02233176A (ja) * | 1989-03-06 | 1990-09-14 | Mitsubishi Electric Corp | 塗布装置 |
| JPH10328614A (ja) * | 1997-05-30 | 1998-12-15 | Mitsubishi Chem Corp | 着色レジストの塗布方法 |
| JP3641162B2 (ja) * | 1998-04-20 | 2005-04-20 | 東京エレクトロン株式会社 | 塗布膜形成装置及びその方法並びにパターン形成方法 |
| JP4342327B2 (ja) * | 2004-01-26 | 2009-10-14 | 住友化学株式会社 | 枚葉塗膜形成方法 |
| JP2006030070A (ja) * | 2004-07-20 | 2006-02-02 | Opto One Kk | 膜厚検査装置 |
| JP2006231262A (ja) | 2005-02-28 | 2006-09-07 | Fuji Photo Film Co Ltd | スピンコート製膜法 |
| JP4748192B2 (ja) | 2008-08-07 | 2011-08-17 | 東京エレクトロン株式会社 | 塗布装置、塗布方法、塗布、現像装置及び記憶媒体 |
| JP2012256780A (ja) | 2011-06-10 | 2012-12-27 | Fuji Electric Co Ltd | スピンコート法によるレジスト塗布方法 |
| JP5796555B2 (ja) | 2012-07-13 | 2015-10-21 | トヨタ自動車株式会社 | スピンコート装置 |
| JP6454121B2 (ja) | 2014-10-07 | 2019-01-16 | 積水化学工業株式会社 | スピンコート用シャーレ |
| JP2018202318A (ja) | 2017-06-02 | 2018-12-27 | キヤノン株式会社 | スピンコータ装置、スピンコート方法、ドライフィルムレジストの製造方法および液体吐出ヘッドの製造方法 |
-
2020
- 2020-06-26 CN CN202080102432.7A patent/CN115916420A/zh active Pending
- 2020-06-26 WO PCT/JP2020/025336 patent/WO2021260943A1/ja not_active Ceased
- 2020-06-26 JP JP2022532225A patent/JPWO2021260943A1/ja active Pending
- 2020-06-26 KR KR1020237002125A patent/KR20230025525A/ko not_active Ceased
- 2020-06-26 US US18/012,942 patent/US20230266669A1/en not_active Abandoned
- 2020-06-26 EP EP20942288.0A patent/EP4173725A4/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142113A (ja) * | 1988-11-22 | 1990-05-31 | Kawasaki Steel Corp | レジスト塗布装置 |
| JPH02229577A (ja) * | 1989-03-02 | 1990-09-12 | Mitsubishi Electric Corp | 塗布装置 |
| JPH08236430A (ja) * | 1995-02-27 | 1996-09-13 | Risotetsuku Japan Kk | 膜厚制御方法および装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230025525A (ko) | 2023-02-21 |
| US20230266669A1 (en) | 2023-08-24 |
| EP4173725A4 (en) | 2024-04-24 |
| CN115916420A (zh) | 2023-04-04 |
| EP4173725A1 (en) | 2023-05-03 |
| WO2021260943A1 (ja) | 2021-12-30 |
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