JPWO2021260943A1 - - Google Patents

Info

Publication number
JPWO2021260943A1
JPWO2021260943A1 JP2022532225A JP2022532225A JPWO2021260943A1 JP WO2021260943 A1 JPWO2021260943 A1 JP WO2021260943A1 JP 2022532225 A JP2022532225 A JP 2022532225A JP 2022532225 A JP2022532225 A JP 2022532225A JP WO2021260943 A1 JPWO2021260943 A1 JP WO2021260943A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022532225A
Other languages
Japanese (ja)
Other versions
JPWO2021260943A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021260943A1 publication Critical patent/JPWO2021260943A1/ja
Publication of JPWO2021260943A5 publication Critical patent/JPWO2021260943A5/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/40Distributing applied liquids or other fluent materials by members moving relatively to surface
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0448Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/002Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005Spin coating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
JP2022532225A 2020-06-26 2020-06-26 Pending JPWO2021260943A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/025336 WO2021260943A1 (ja) 2020-06-26 2020-06-26 スピンコーティング装置

Publications (2)

Publication Number Publication Date
JPWO2021260943A1 true JPWO2021260943A1 (https=) 2021-12-30
JPWO2021260943A5 JPWO2021260943A5 (https=) 2023-03-10

Family

ID=79282127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022532225A Pending JPWO2021260943A1 (https=) 2020-06-26 2020-06-26

Country Status (6)

Country Link
US (1) US20230266669A1 (https=)
EP (1) EP4173725A4 (https=)
JP (1) JPWO2021260943A1 (https=)
KR (1) KR20230025525A (https=)
CN (1) CN115916420A (https=)
WO (1) WO2021260943A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117637545B (zh) * 2023-11-30 2024-08-23 重庆大学 一种实验室用半自动化钙钛矿太阳能电池制备方法及其制备系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142113A (ja) * 1988-11-22 1990-05-31 Kawasaki Steel Corp レジスト塗布装置
JPH02229577A (ja) * 1989-03-02 1990-09-12 Mitsubishi Electric Corp 塗布装置
JPH08236430A (ja) * 1995-02-27 1996-09-13 Risotetsuku Japan Kk 膜厚制御方法および装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278021A (ja) * 1988-04-29 1989-11-08 Nec Corp レジストの塗布装置
JPH0265225A (ja) * 1988-08-31 1990-03-05 General Signal Japan Kk フォトレジストの塗布方法
JPH02233176A (ja) * 1989-03-06 1990-09-14 Mitsubishi Electric Corp 塗布装置
JPH10328614A (ja) * 1997-05-30 1998-12-15 Mitsubishi Chem Corp 着色レジストの塗布方法
JP3641162B2 (ja) * 1998-04-20 2005-04-20 東京エレクトロン株式会社 塗布膜形成装置及びその方法並びにパターン形成方法
JP4342327B2 (ja) * 2004-01-26 2009-10-14 住友化学株式会社 枚葉塗膜形成方法
JP2006030070A (ja) * 2004-07-20 2006-02-02 Opto One Kk 膜厚検査装置
JP2006231262A (ja) 2005-02-28 2006-09-07 Fuji Photo Film Co Ltd スピンコート製膜法
JP4748192B2 (ja) 2008-08-07 2011-08-17 東京エレクトロン株式会社 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP2012256780A (ja) 2011-06-10 2012-12-27 Fuji Electric Co Ltd スピンコート法によるレジスト塗布方法
JP5796555B2 (ja) 2012-07-13 2015-10-21 トヨタ自動車株式会社 スピンコート装置
JP6454121B2 (ja) 2014-10-07 2019-01-16 積水化学工業株式会社 スピンコート用シャーレ
JP2018202318A (ja) 2017-06-02 2018-12-27 キヤノン株式会社 スピンコータ装置、スピンコート方法、ドライフィルムレジストの製造方法および液体吐出ヘッドの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142113A (ja) * 1988-11-22 1990-05-31 Kawasaki Steel Corp レジスト塗布装置
JPH02229577A (ja) * 1989-03-02 1990-09-12 Mitsubishi Electric Corp 塗布装置
JPH08236430A (ja) * 1995-02-27 1996-09-13 Risotetsuku Japan Kk 膜厚制御方法および装置

Also Published As

Publication number Publication date
KR20230025525A (ko) 2023-02-21
US20230266669A1 (en) 2023-08-24
EP4173725A4 (en) 2024-04-24
CN115916420A (zh) 2023-04-04
EP4173725A1 (en) 2023-05-03
WO2021260943A1 (ja) 2021-12-30

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