KR20220021453A - 봉지 시트 - Google Patents

봉지 시트 Download PDF

Info

Publication number
KR20220021453A
KR20220021453A KR1020217033339A KR20217033339A KR20220021453A KR 20220021453 A KR20220021453 A KR 20220021453A KR 1020217033339 A KR1020217033339 A KR 1020217033339A KR 20217033339 A KR20217033339 A KR 20217033339A KR 20220021453 A KR20220021453 A KR 20220021453A
Authority
KR
South Korea
Prior art keywords
sealing
agent layer
sealing agent
epoxy compound
sealing sheet
Prior art date
Application number
KR1020217033339A
Other languages
English (en)
Korean (ko)
Inventor
겐타 니시지마
다츠키 하세가와
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2019/023654 external-priority patent/WO2019240260A1/ja
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20220021453A publication Critical patent/KR20220021453A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H01L51/5246—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Sealing Material Composition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020217033339A 2019-06-14 2020-06-12 봉지 시트 KR20220021453A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPPCT/JP2019/023654 2019-06-14
PCT/JP2019/023654 WO2019240260A1 (ja) 2018-06-15 2019-06-14 封止剤組成物、封止シート及び封止体
JPJP-P-2019-216594 2019-11-29
JP2019216594 2019-11-29
PCT/JP2020/023240 WO2020251028A1 (ja) 2019-06-14 2020-06-12 封止シート

Publications (1)

Publication Number Publication Date
KR20220021453A true KR20220021453A (ko) 2022-02-22

Family

ID=73781227

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217033339A KR20220021453A (ko) 2019-06-14 2020-06-12 봉지 시트

Country Status (5)

Country Link
JP (2) JP6873337B1 (ja)
KR (1) KR20220021453A (ja)
CN (1) CN113924341A (ja)
TW (1) TW202111073A (ja)
WO (1) WO2020251028A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113831689A (zh) * 2021-10-13 2021-12-24 惠柏新材料科技（上海）股份有限公司 一种无色透明耐uv预浸料用环氧树脂组合物及制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018235824A1 (ja) 2017-06-23 2018-12-27 三井化学株式会社 画像表示装置封止材および画像表示装置封止シート

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5912611B2 (ja) * 2004-03-22 2016-04-27 日立化成株式会社 フィルム状接着剤
JP6100989B2 (ja) * 2011-03-25 2017-03-22 藤森工業株式会社 Ｉｔｏ用粘着テープ
JP5891745B2 (ja) * 2011-11-28 2016-03-23 大日本印刷株式会社 太陽電池モジュール用封止材シート及びそれを用いた太陽電池モジュール
CN103958602B (zh) * 2011-11-29 2016-09-07 东丽株式会社 树脂组合物、树脂组合物片材、半导体器件及其制备方法
JP5877087B2 (ja) * 2012-02-24 2016-03-02 古河電気工業株式会社 接着フィルムおよびウェハ加工用テープ
JP2015189802A (ja) * 2014-03-27 2015-11-02 株式会社ダイセル シート状透明封止材及びその製造方法
JP2015209477A (ja) * 2014-04-25 2015-11-24 東レ株式会社 半導体実装用樹脂組成物およびそれからなる半導体実装用樹脂組成物シートならびにそれらを用いた半導体装置およびその製造方法
KR101712703B1 (ko) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
JP6920635B2 (ja) * 2015-12-02 2021-08-18 株式会社スリーボンド カチオン硬化性樹脂組成物
EP3511386B1 (en) * 2016-09-07 2021-08-25 Lintec Corporation Adhesive composition, sealing sheet, and sealed body

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018235824A1 (ja) 2017-06-23 2018-12-27 三井化学株式会社 画像表示装置封止材および画像表示装置封止シート

Also Published As

Publication number Publication date
CN113924341A (zh) 2022-01-11
JP6873337B1 (ja) 2021-05-19
JP2021114471A (ja) 2021-08-05
JPWO2020251028A1 (ja) 2021-09-13
WO2020251028A1 (ja) 2020-12-17
TW202111073A (zh) 2021-03-16

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