KR20210126592A - 반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 그리고 반도체 장치의 제조 방법 - Google Patents
반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 그리고 반도체 장치의 제조 방법 Download PDFInfo
- Publication number
- KR20210126592A KR20210126592A KR1020217025299A KR20217025299A KR20210126592A KR 20210126592 A KR20210126592 A KR 20210126592A KR 1020217025299 A KR1020217025299 A KR 1020217025299A KR 20217025299 A KR20217025299 A KR 20217025299A KR 20210126592 A KR20210126592 A KR 20210126592A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- buffer layer
- absorber
- reflective mask
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- H01L21/0274—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/405—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2019-035300 | 2019-02-28 | ||
| JP2019035300 | 2019-02-28 | ||
| PCT/JP2020/007002 WO2020175354A1 (ja) | 2019-02-28 | 2020-02-21 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210126592A true KR20210126592A (ko) | 2021-10-20 |
Family
ID=72239553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217025299A Pending KR20210126592A (ko) | 2019-02-28 | 2020-02-21 | 반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 그리고 반도체 장치의 제조 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220121102A1 (https=) |
| JP (2) | JP7018162B2 (https=) |
| KR (1) | KR20210126592A (https=) |
| SG (1) | SG11202109240PA (https=) |
| TW (1) | TWI865492B (https=) |
| WO (1) | WO2020175354A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11619875B2 (en) * | 2020-06-29 | 2023-04-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV photo masks and manufacturing method thereof |
| KR20250012736A (ko) * | 2020-12-03 | 2025-01-24 | 에이지씨 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 |
| JP7612408B2 (ja) * | 2020-12-22 | 2025-01-14 | Hoya株式会社 | 反射型マスクブランク、反射型マスク、反射型マスクの製造方法、及び半導体デバイスの製造方法 |
| JP7581107B2 (ja) * | 2021-03-29 | 2024-11-12 | Hoya株式会社 | 反射型マスクブランク、反射型マスク、反射型マスクの製造方法、及び半導体装置の製造方法 |
| US12535740B2 (en) * | 2021-07-09 | 2026-01-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interstitial type absorber for extreme ultraviolet mask |
| DE102022202061B4 (de) * | 2022-03-01 | 2025-07-17 | Carl Zeiss Smt Gmbh | Verfahren und vorrichtung zur maskenreparatur |
| JP7506114B2 (ja) * | 2022-07-01 | 2024-06-25 | アルバック成膜株式会社 | マスクブランクスの製造方法及びマスクブランクス、フォトマスク |
| KR20250053862A (ko) | 2022-08-30 | 2025-04-22 | 호야 가부시키가이샤 | 반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 그리고 반도체 장치의 제조 방법 |
| KR102851718B1 (ko) | 2022-10-13 | 2025-09-02 | 주식회사 에스앤에스텍 | 극자외선 리소그래피용 위상반전 블랭크마스크 및 포토마스크 |
| JPWO2024247713A1 (https=) * | 2023-05-31 | 2024-12-05 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004039884A (ja) | 2002-07-04 | 2004-02-05 | Hoya Corp | 反射型マスクブランクス及び反射型マスク並びに反射型マスクの製造方法 |
| JP2009212220A (ja) | 2008-03-03 | 2009-09-17 | Toshiba Corp | 反射型マスク及びその作製方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3989367B2 (ja) * | 2002-02-22 | 2007-10-10 | Hoya株式会社 | 露光用反射型マスクブランク、その製造方法及び露光用反射型マスク |
| US6777137B2 (en) * | 2002-07-10 | 2004-08-17 | International Business Machines Corporation | EUVL mask structure and method of formation |
| US20060115744A1 (en) * | 2004-08-06 | 2006-06-01 | Lutz Aschke | Method of producing a mask blank for photolithographic applications, and mask blank |
| DE102005027697A1 (de) * | 2005-06-15 | 2006-12-28 | Infineon Technologies Ag | EUV-Reflexionsmaske und Verfahren zu deren Herstellung |
| JP4926523B2 (ja) * | 2006-03-31 | 2012-05-09 | Hoya株式会社 | 反射型マスクブランクス及び反射型マスク並びに半導体装置の製造方法 |
| DE102007028800B4 (de) * | 2007-06-22 | 2016-11-03 | Advanced Mask Technology Center Gmbh & Co. Kg | Maskensubstrat, Photomaske und Verfahren zur Herstellung einer Photomaske |
| WO2009122972A1 (ja) | 2008-03-31 | 2009-10-08 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法 |
| WO2010007955A1 (ja) * | 2008-07-14 | 2010-01-21 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク、および、euvリソグラフィ用反射型マスク |
| JP5638769B2 (ja) * | 2009-02-04 | 2014-12-10 | Hoya株式会社 | 反射型マスクブランクの製造方法及び反射型マスクの製造方法 |
| JP5515773B2 (ja) * | 2010-01-21 | 2014-06-11 | 大日本印刷株式会社 | 遮光枠を有する反射型マスクおよびその製造方法 |
| JP5533016B2 (ja) * | 2010-02-24 | 2014-06-25 | 大日本印刷株式会社 | 反射型マスクの製造方法 |
| JP2011187746A (ja) * | 2010-03-09 | 2011-09-22 | Dainippon Printing Co Ltd | 反射型マスクブランクス、反射型マスク、およびその製造方法 |
| US8679707B2 (en) * | 2012-08-01 | 2014-03-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of fabricating a lithography mask |
| KR102219307B1 (ko) * | 2013-02-22 | 2021-02-23 | 호야 가부시키가이샤 | 반사형 마스크블랭크의 제조방법, 및 반사형 마스크의 제조방법 |
| JP6287099B2 (ja) * | 2013-05-31 | 2018-03-07 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク |
| US9261774B2 (en) * | 2013-11-22 | 2016-02-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet lithography process and mask with reduced shadow effect and enhanced intensity |
| JP6301127B2 (ja) * | 2013-12-25 | 2018-03-28 | Hoya株式会社 | 反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 |
| JP6425951B2 (ja) * | 2014-09-17 | 2018-11-21 | Hoya株式会社 | 反射型マスクブランク及びその製造方法、反射型マスクの製造方法、並びに半導体装置の製造方法 |
| JP6855190B2 (ja) * | 2016-08-26 | 2021-04-07 | Hoya株式会社 | 反射型マスク、並びに反射型マスクブランク及び半導体装置の製造方法 |
| CN106169416B (zh) * | 2016-08-29 | 2019-11-12 | 复旦大学 | 一种极紫外掩模的制造方法 |
| WO2018159785A1 (ja) * | 2017-03-02 | 2018-09-07 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
| US10838295B2 (en) * | 2017-05-04 | 2020-11-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photomask and fabrication method therefor |
-
2020
- 2020-02-21 SG SG11202109240PA patent/SG11202109240PA/en unknown
- 2020-02-21 US US17/431,700 patent/US20220121102A1/en active Pending
- 2020-02-21 KR KR1020217025299A patent/KR20210126592A/ko active Pending
- 2020-02-21 JP JP2021502175A patent/JP7018162B2/ja active Active
- 2020-02-21 WO PCT/JP2020/007002 patent/WO2020175354A1/ja not_active Ceased
- 2020-02-25 TW TW109106009A patent/TWI865492B/zh active
-
2022
- 2022-01-28 JP JP2022011849A patent/JP7268211B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004039884A (ja) | 2002-07-04 | 2004-02-05 | Hoya Corp | 反射型マスクブランクス及び反射型マスク並びに反射型マスクの製造方法 |
| JP2009212220A (ja) | 2008-03-03 | 2009-09-17 | Toshiba Corp | 反射型マスク及びその作製方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7018162B2 (ja) | 2022-02-09 |
| JP7268211B2 (ja) | 2023-05-02 |
| WO2020175354A1 (ja) | 2020-09-03 |
| SG11202109240PA (en) | 2021-09-29 |
| TWI865492B (zh) | 2024-12-11 |
| TW202038001A (zh) | 2020-10-16 |
| JP2022064956A (ja) | 2022-04-26 |
| US20220121102A1 (en) | 2022-04-21 |
| JPWO2020175354A1 (ja) | 2021-12-23 |
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