KR20210075027A - 냉각 장치, 냉각 방법 및 반도체 패키지의 제조 방법 - Google Patents

냉각 장치, 냉각 방법 및 반도체 패키지의 제조 방법 Download PDF

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Publication number
KR20210075027A
KR20210075027A KR1020200173289A KR20200173289A KR20210075027A KR 20210075027 A KR20210075027 A KR 20210075027A KR 1020200173289 A KR1020200173289 A KR 1020200173289A KR 20200173289 A KR20200173289 A KR 20200173289A KR 20210075027 A KR20210075027 A KR 20210075027A
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KR
South Korea
Prior art keywords
cooling
substrate
calibration
cooling position
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020200173289A
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English (en)
Korean (ko)
Inventor
고이치 조노
히로코 가지야
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20210075027A publication Critical patent/KR20210075027A/ko
Withdrawn legal-status Critical Current

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    • H01L23/42—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H01L23/345—
    • H01L23/367—
    • H01L23/473—
    • H01L23/562—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020200173289A 2019-12-12 2020-12-11 냉각 장치, 냉각 방법 및 반도체 패키지의 제조 방법 Withdrawn KR20210075027A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-224332 2019-12-12
JP2019224332A JP2021093479A (ja) 2019-12-12 2019-12-12 冷却装置、冷却方法および半導体パッケージの製造方法

Publications (1)

Publication Number Publication Date
KR20210075027A true KR20210075027A (ko) 2021-06-22

Family

ID=76312741

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200173289A Withdrawn KR20210075027A (ko) 2019-12-12 2020-12-11 냉각 장치, 냉각 방법 및 반도체 패키지의 제조 방법

Country Status (4)

Country Link
JP (1) JP2021093479A (https=)
KR (1) KR20210075027A (https=)
CN (1) CN112992727A (https=)
TW (1) TW202129741A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7658808B2 (ja) 2021-06-03 2025-04-08 株式会社やまびこ 草刈機、グラウンド整備システムおよびグラウンド整備方法
JP2025148840A (ja) * 2024-03-26 2025-10-08 東レエンジニアリング株式会社 基板保持装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274148A (ja) * 1995-01-30 1996-10-18 Sony Corp 基体固定装置及び基体の固定方法
JP4513960B2 (ja) * 2004-10-22 2010-07-28 セイコーエプソン株式会社 スリットコート式塗布装置及びスリットコート式塗布方法
JP4485374B2 (ja) * 2005-01-25 2010-06-23 東京エレクトロン株式会社 冷却処理装置
JP4662479B2 (ja) * 2006-05-30 2011-03-30 東京エレクトロン株式会社 熱処理装置
KR100842060B1 (ko) * 2007-02-12 2008-06-30 (주)지티엔이 웨이퍼 교정 장치를 갖는 반도체 가열 및 냉각 시스템
JP2008306016A (ja) * 2007-06-08 2008-12-18 Tokyo Ohka Kogyo Co Ltd 温調装置
JP6436828B2 (ja) * 2015-03-26 2018-12-12 株式会社テックインテック 熱処理装置
JP2017224687A (ja) * 2016-06-14 2017-12-21 株式会社ジェイデバイス 半導体パッケージの製造方法
JP6284996B1 (ja) * 2016-11-04 2018-02-28 Ｔｏｗａ株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法
JP6926765B2 (ja) * 2017-07-19 2021-08-25 東京エレクトロン株式会社 基板加熱装置及び基板加熱方法

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Publication number Publication date
JP2021093479A (ja) 2021-06-17
TW202129741A (zh) 2021-08-01
CN112992727A (zh) 2021-06-18

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St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000