JP2021093479A - 冷却装置、冷却方法および半導体パッケージの製造方法 - Google Patents

冷却装置、冷却方法および半導体パッケージの製造方法 Download PDF

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Publication number
JP2021093479A
JP2021093479A JP2019224332A JP2019224332A JP2021093479A JP 2021093479 A JP2021093479 A JP 2021093479A JP 2019224332 A JP2019224332 A JP 2019224332A JP 2019224332 A JP2019224332 A JP 2019224332A JP 2021093479 A JP2021093479 A JP 2021093479A
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JP
Japan
Prior art keywords
cooling
substrate
straightening
semiconductor package
cooling device
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Pending
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JP2019224332A
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English (en)
Japanese (ja)
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JP2021093479A5 (https=
Inventor
上野　幸一
Koichi Ueno
幸一 上野
央子 梶屋
Oko Kajiya
央子 梶屋
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2019224332A priority Critical patent/JP2021093479A/ja
Priority to TW109142978A priority patent/TW202129741A/zh
Priority to CN202011458722.3A priority patent/CN112992727A/zh
Priority to KR1020200173289A priority patent/KR20210075027A/ko
Publication of JP2021093479A publication Critical patent/JP2021093479A/ja
Publication of JP2021093479A5 publication Critical patent/JP2021093479A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2019224332A 2019-12-12 2019-12-12 冷却装置、冷却方法および半導体パッケージの製造方法 Pending JP2021093479A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019224332A JP2021093479A (ja) 2019-12-12 2019-12-12 冷却装置、冷却方法および半導体パッケージの製造方法
TW109142978A TW202129741A (zh) 2019-12-12 2020-12-07 冷卻裝置、冷卻方法及半導體封裝之製造方法
CN202011458722.3A CN112992727A (zh) 2019-12-12 2020-12-11 冷却装置、冷却方法以及半导体封装的制造方法
KR1020200173289A KR20210075027A (ko) 2019-12-12 2020-12-11 냉각 장치, 냉각 방법 및 반도체 패키지의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019224332A JP2021093479A (ja) 2019-12-12 2019-12-12 冷却装置、冷却方法および半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JP2021093479A true JP2021093479A (ja) 2021-06-17
JP2021093479A5 JP2021093479A5 (https=) 2021-07-29

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JP2019224332A Pending JP2021093479A (ja) 2019-12-12 2019-12-12 冷却装置、冷却方法および半導体パッケージの製造方法

Country Status (4)

Country Link
JP (1) JP2021093479A (https=)
KR (1) KR20210075027A (https=)
CN (1) CN112992727A (https=)
TW (1) TW202129741A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4098098A1 (en) 2021-06-03 2022-12-07 Yamabiko Corporation Mower, ground maintenance system and ground maintenance method
WO2025204743A1 (ja) * 2024-03-26 2025-10-02 東レエンジニアリング株式会社 基板保持装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274148A (ja) * 1995-01-30 1996-10-18 Sony Corp 基体固定装置及び基体の固定方法
JP2006116454A (ja) * 2004-10-22 2006-05-11 Seiko Epson Corp スリットコート式塗布装置及びスリットコート式塗布方法
JP2006210400A (ja) * 2005-01-25 2006-08-10 Tokyo Electron Ltd 冷却処理装置
KR100842060B1 (ko) * 2007-02-12 2008-06-30 (주)지티엔이 웨이퍼 교정 장치를 갖는 반도체 가열 및 냉각 시스템
JP2008306016A (ja) * 2007-06-08 2008-12-18 Tokyo Ohka Kogyo Co Ltd 温調装置
JP2016184679A (ja) * 2015-03-26 2016-10-20 株式会社テックインテック 熱処理装置
JP2017224687A (ja) * 2016-06-14 2017-12-21 株式会社ジェイデバイス 半導体パッケージの製造方法
JP2018074093A (ja) * 2016-11-04 2018-05-10 Ｔｏｗａ株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4662479B2 (ja) * 2006-05-30 2011-03-30 東京エレクトロン株式会社 熱処理装置
JP6926765B2 (ja) * 2017-07-19 2021-08-25 東京エレクトロン株式会社 基板加熱装置及び基板加熱方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274148A (ja) * 1995-01-30 1996-10-18 Sony Corp 基体固定装置及び基体の固定方法
JP2006116454A (ja) * 2004-10-22 2006-05-11 Seiko Epson Corp スリットコート式塗布装置及びスリットコート式塗布方法
JP2006210400A (ja) * 2005-01-25 2006-08-10 Tokyo Electron Ltd 冷却処理装置
KR100842060B1 (ko) * 2007-02-12 2008-06-30 (주)지티엔이 웨이퍼 교정 장치를 갖는 반도체 가열 및 냉각 시스템
JP2008306016A (ja) * 2007-06-08 2008-12-18 Tokyo Ohka Kogyo Co Ltd 温調装置
JP2016184679A (ja) * 2015-03-26 2016-10-20 株式会社テックインテック 熱処理装置
JP2017224687A (ja) * 2016-06-14 2017-12-21 株式会社ジェイデバイス 半導体パッケージの製造方法
JP2018074093A (ja) * 2016-11-04 2018-05-10 Ｔｏｗａ株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4098098A1 (en) 2021-06-03 2022-12-07 Yamabiko Corporation Mower, ground maintenance system and ground maintenance method
WO2025204743A1 (ja) * 2024-03-26 2025-10-02 東レエンジニアリング株式会社 基板保持装置

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Publication number Publication date
KR20210075027A (ko) 2021-06-22
TW202129741A (zh) 2021-08-01
CN112992727A (zh) 2021-06-18

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