KR20210065846A - 절삭 블레이드의 장착 방법, 분리 방법, 및, 블레이드 파지구 - Google Patents
절삭 블레이드의 장착 방법, 분리 방법, 및, 블레이드 파지구 Download PDFInfo
- Publication number
- KR20210065846A KR20210065846A KR1020200149191A KR20200149191A KR20210065846A KR 20210065846 A KR20210065846 A KR 20210065846A KR 1020200149191 A KR1020200149191 A KR 1020200149191A KR 20200149191 A KR20200149191 A KR 20200149191A KR 20210065846 A KR20210065846 A KR 20210065846A
- Authority
- KR
- South Korea
- Prior art keywords
- blade
- cutting blade
- gripping
- fitting hole
- cutting
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/026—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade carried by a movable arm, e.g. pivoted
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2019-214544 | 2019-11-27 | ||
JP2019214544A JP7465078B2 (ja) | 2019-11-27 | 2019-11-27 | ブレード把持具 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20210065846A true KR20210065846A (ko) | 2021-06-04 |
Family
ID=75996495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200149191A KR20210065846A (ko) | 2019-11-27 | 2020-11-10 | 절삭 블레이드의 장착 방법, 분리 방법, 및, 블레이드 파지구 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7465078B2 (ja) |
KR (1) | KR20210065846A (ja) |
CN (1) | CN112847856A (ja) |
SG (1) | SG10202011111SA (ja) |
TW (1) | TW202120230A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009241177A (ja) | 2008-03-28 | 2009-10-22 | Disco Abrasive Syst Ltd | ブレード交換工具 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002219648A (ja) | 2001-01-24 | 2002-08-06 | Disco Abrasive Syst Ltd | ブレードの装着方法及び切削装置 |
JP5014892B2 (ja) | 2007-06-25 | 2012-08-29 | 株式会社ディスコ | ブレード交換工具 |
-
2019
- 2019-11-27 JP JP2019214544A patent/JP7465078B2/ja active Active
-
2020
- 2020-11-09 SG SG10202011111SA patent/SG10202011111SA/en unknown
- 2020-11-10 KR KR1020200149191A patent/KR20210065846A/ko unknown
- 2020-11-25 CN CN202011335876.3A patent/CN112847856A/zh active Pending
- 2020-11-26 TW TW109141481A patent/TW202120230A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009241177A (ja) | 2008-03-28 | 2009-10-22 | Disco Abrasive Syst Ltd | ブレード交換工具 |
Also Published As
Publication number | Publication date |
---|---|
CN112847856A (zh) | 2021-05-28 |
TW202120230A (zh) | 2021-06-01 |
SG10202011111SA (en) | 2021-06-29 |
JP2021084171A (ja) | 2021-06-03 |
JP7465078B2 (ja) | 2024-04-10 |
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