KR20210025003A - 진공 인쇄용 도전성 페이스트 - Google Patents
진공 인쇄용 도전성 페이스트 Download PDFInfo
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- KR20210025003A KR20210025003A KR1020207034064A KR20207034064A KR20210025003A KR 20210025003 A KR20210025003 A KR 20210025003A KR 1020207034064 A KR1020207034064 A KR 1020207034064A KR 20207034064 A KR20207034064 A KR 20207034064A KR 20210025003 A KR20210025003 A KR 20210025003A
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- South Korea
- Prior art keywords
- conductive paste
- vacuum printing
- meth
- solvent
- conductive
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- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical class CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- HMDRAGZZZBGZJC-UHFFFAOYSA-N n-[3-[3-aminopropoxy(dimethoxy)silyl]propyl]-1-phenylprop-2-en-1-amine Chemical class NCCCO[Si](OC)(OC)CCCNC(C=C)C1=CC=CC=C1 HMDRAGZZZBGZJC-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 210000002569 neuron Anatomy 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- CAQIWIAAHXOQOS-UHFFFAOYSA-N octadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O CAQIWIAAHXOQOS-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005007 perfluorooctyl group Chemical group FC(C(C(C(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005996 polystyrene-poly(ethylene-butylene)-polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- APTZNLHMIGJTEW-UHFFFAOYSA-N pyraflufen-ethyl Chemical compound C1=C(Cl)C(OCC(=O)OCC)=CC(C=2C(=C(OC(F)F)N(C)N=2)Cl)=C1F APTZNLHMIGJTEW-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- NZTSTZPFKORISI-UHFFFAOYSA-N tert-butylperoxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOOC(C)(C)C NZTSTZPFKORISI-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical class O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018120696A JP2020004524A (ja) | 2018-06-26 | 2018-06-26 | 真空印刷用導電性ペースト |
| JPJP-P-2018-120696 | 2018-06-26 | ||
| PCT/JP2019/018772 WO2020003765A1 (ja) | 2018-06-26 | 2019-05-10 | 真空印刷用導電性ペースト |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210025003A true KR20210025003A (ko) | 2021-03-08 |
Family
ID=68986173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207034064A KR20210025003A (ko) | 2018-06-26 | 2019-05-10 | 진공 인쇄용 도전성 페이스트 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2020004524A (zh) |
| KR (1) | KR20210025003A (zh) |
| CN (1) | CN112292735B (zh) |
| TW (1) | TWI839358B (zh) |
| WO (1) | WO2020003765A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115136265A (zh) * | 2020-02-20 | 2022-09-30 | 松下知识产权经营株式会社 | 电解电容器用导电性糊剂及电解电容器 |
| CN115985551A (zh) * | 2022-12-28 | 2023-04-18 | 广东南海启明光大科技有限公司 | 一种perc单晶正面导电浆料有机载体、制备方法及其应用 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147378A (ja) | 2004-11-22 | 2006-06-08 | Tanaka Kikinzoku Kogyo Kk | 導電ペースト |
| JP2007197498A (ja) | 2006-01-24 | 2007-08-09 | Sumitomo Metal Mining Co Ltd | 導電性接着剤 |
| JP2013175559A (ja) | 2012-02-24 | 2013-09-05 | Hitachi Chemical Co Ltd | 接着剤層と配線層よりなる複合層及びそれを形成するための印刷用接着剤層形成インク |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2426861C (en) * | 2000-10-25 | 2008-10-28 | Yorishige Matsuba | Conductive metal paste |
| JP2002203428A (ja) * | 2000-12-27 | 2002-07-19 | Jsr Corp | 導電性ペースト組成物 |
| JP2004234900A (ja) * | 2003-01-28 | 2004-08-19 | Asahi Kasei Corp | 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート |
| JP2005159344A (ja) * | 2003-11-06 | 2005-06-16 | Mitsui Chemicals Inc | 回路基板および多層基板の製造方法 |
| JPWO2012014481A1 (ja) * | 2010-07-30 | 2013-09-12 | 太陽ホールディングス株式会社 | オフセット印刷用導電性ペースト |
| KR102007046B1 (ko) * | 2011-01-26 | 2019-08-02 | 나믹스 가부시끼가이샤 | 도전성 페이스트 및 그 제조 방법 |
| JP5462984B1 (ja) * | 2012-03-30 | 2014-04-02 | 荒川化学工業株式会社 | 導電ペースト、硬化物、電極、及び電子デバイス |
| WO2016088540A1 (ja) * | 2014-12-05 | 2016-06-09 | 三井金属鉱業株式会社 | 導電性組成物並びに配線基板及びその製造方法 |
| CN107205677B (zh) * | 2015-01-14 | 2020-12-25 | 东洋纺株式会社 | 伸缩性电极片、生物体信息计测用接触面 |
| TWI732839B (zh) * | 2016-03-29 | 2021-07-11 | 日商東洋紡股份有限公司 | 延展性導電糊劑及曲面印刷電路板之製造方法 |
| JP2017218469A (ja) * | 2016-06-03 | 2017-12-14 | 株式会社Ｄｎｐファインケミカル | 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 |
| JP2017228363A (ja) * | 2016-06-20 | 2017-12-28 | 住友ベークライト株式会社 | 導電性ペースト |
| JP6900278B2 (ja) * | 2016-08-31 | 2021-07-07 | Ｄｏｗａエレクトロニクス株式会社 | 銀被覆合金粉末、導電性ペースト、電子部品及び電気装置 |
-
2018
- 2018-06-26 JP JP2018120696A patent/JP2020004524A/ja active Pending
-
2019
- 2019-05-10 KR KR1020207034064A patent/KR20210025003A/ko not_active Application Discontinuation
- 2019-05-10 WO PCT/JP2019/018772 patent/WO2020003765A1/ja active Application Filing
- 2019-05-10 CN CN201980038637.0A patent/CN112292735B/zh active Active
- 2019-05-20 TW TW108117301A patent/TWI839358B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147378A (ja) | 2004-11-22 | 2006-06-08 | Tanaka Kikinzoku Kogyo Kk | 導電ペースト |
| JP2007197498A (ja) | 2006-01-24 | 2007-08-09 | Sumitomo Metal Mining Co Ltd | 導電性接着剤 |
| JP2013175559A (ja) | 2012-02-24 | 2013-09-05 | Hitachi Chemical Co Ltd | 接着剤層と配線層よりなる複合層及びそれを形成するための印刷用接着剤層形成インク |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020003765A1 (ja) | 2020-01-02 |
| TWI839358B (zh) | 2024-04-21 |
| JP2020004524A (ja) | 2020-01-09 |
| CN112292735B (zh) | 2023-06-06 |
| TW202000809A (zh) | 2020-01-01 |
| CN112292735A (zh) | 2021-01-29 |
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