KR20200131228A - 경화성 조성물, 경화물, 경화물의 제조 방법, 및, 경화성 조성물의 사용 방법 - Google Patents

경화성 조성물, 경화물, 경화물의 제조 방법, 및, 경화성 조성물의 사용 방법 Download PDF

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Publication number
KR20200131228A
KR20200131228A KR1020207025274A KR20207025274A KR20200131228A KR 20200131228 A KR20200131228 A KR 20200131228A KR 1020207025274 A KR1020207025274 A KR 1020207025274A KR 20207025274 A KR20207025274 A KR 20207025274A KR 20200131228 A KR20200131228 A KR 20200131228A
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South Korea
Prior art keywords
group
curable composition
component
substituent
mass
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KR1020207025274A
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English (en)
Korean (ko)
Inventor
스스무 미우라
히로노리 시즈하타
마나부 미야와키
히데카즈 나카야마
Original Assignee
린텍 가부시키가이샤
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Publication of KR20200131228A publication Critical patent/KR20200131228A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020207025274A 2018-03-12 2019-03-11 경화성 조성물, 경화물, 경화물의 제조 방법, 및, 경화성 조성물의 사용 방법 KR20200131228A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-044022 2018-03-12
JP2018044022 2018-03-12
PCT/JP2019/009584 WO2019176828A1 (ja) 2018-03-12 2019-03-11 硬化性組成物、硬化物、硬化物の製造方法、及び、硬化性組成物の使用方法

Publications (1)

Publication Number Publication Date
KR20200131228A true KR20200131228A (ko) 2020-11-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207025274A KR20200131228A (ko) 2018-03-12 2019-03-11 경화성 조성물, 경화물, 경화물의 제조 방법, 및, 경화성 조성물의 사용 방법

Country Status (5)

Country Link
JP (1) JP7310047B2 (ja)
KR (1) KR20200131228A (ja)
CN (1) CN111819249A (ja)
TW (1) TW201938648A (ja)
WO (1) WO2019176828A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004359933A (ja) 2003-05-14 2004-12-24 Nagase Chemtex Corp 光素子用封止材
JP2005263869A (ja) 2004-03-16 2005-09-29 Nagase Chemtex Corp 光半導体封止用樹脂組成物
JP2006328231A (ja) 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
JP2007112975A (ja) 2005-02-23 2007-05-10 Mitsubishi Chemicals Corp 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス
WO2012073988A1 (ja) 2010-11-30 2012-06-07 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
WO2016031728A1 (ja) 2014-08-26 2016-03-03 リンテック株式会社 硬化性組成物、硬化性組成物の製造方法、硬化物、硬化性組成物の使用方法、及び光デバイス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69716218T2 (de) * 1996-11-20 2003-04-17 Jsr Corp Härtbare Harzzusammensetzung und gehärtete Produkte
WO2005108494A1 (ja) * 2004-05-07 2005-11-17 Kaneka Corporation 硬化性組成物
JP2011202154A (ja) 2010-03-01 2011-10-13 Yokohama Rubber Co Ltd:The 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体
JP5760664B2 (ja) 2011-05-10 2015-08-12 三菱化学株式会社 シリコーン系封止材組成物及び半導体発光装置
JP2013124324A (ja) 2011-12-15 2013-06-24 Mitsubishi Chemicals Corp 硬化性ポリオルガノシロキサン組成物および該組成物を硬化させてなるポリオルガノシロキサン硬化物
JP6148870B2 (ja) 2013-01-31 2017-06-14 株式会社日本触媒 硬化性樹脂組成物、及び、硬化物
WO2015041344A1 (ja) * 2013-09-20 2015-03-26 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
EP3034543B1 (en) * 2013-09-20 2021-03-31 Lintec Corporation Curable composition, curing product, and method for using curable composition
TWI660010B (zh) * 2014-08-26 2019-05-21 日商琳得科股份有限公司 硬化性組合物、硬化物、硬化性組合物之使用方法以及光裝置
TWI696662B (zh) 2014-08-26 2020-06-21 日商琳得科股份有限公司 硬化性組合物、硬化物、硬化性組合物之使用方法以及光裝置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004359933A (ja) 2003-05-14 2004-12-24 Nagase Chemtex Corp 光素子用封止材
JP2005263869A (ja) 2004-03-16 2005-09-29 Nagase Chemtex Corp 光半導体封止用樹脂組成物
JP2007112975A (ja) 2005-02-23 2007-05-10 Mitsubishi Chemicals Corp 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス
JP2006328231A (ja) 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
WO2012073988A1 (ja) 2010-11-30 2012-06-07 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
WO2016031728A1 (ja) 2014-08-26 2016-03-03 リンテック株式会社 硬化性組成物、硬化性組成物の製造方法、硬化物、硬化性組成物の使用方法、及び光デバイス

Also Published As

Publication number Publication date
JP7310047B2 (ja) 2023-07-19
TW201938648A (zh) 2019-10-01
JPWO2019176828A1 (ja) 2021-03-25
CN111819249A (zh) 2020-10-23
WO2019176828A1 (ja) 2019-09-19

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